Table of Contents
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Introduction
1.2.15
TP4 – GND
Ground test point.
1.2.16
TP5 – GND
Ground test point.
1.2.17
TP6 – SO
Bode plot measurement test point.
1.2.18
TP7 – PG
Bode plot measurement test point.
1.3
Soldering Guidelines
To avoid damaging the integrated circuit (IC), use a hot-air system for any solder rework to modify the
EVM for the purpose of repair or other application reasons.
1.4
Equipment Connection
Connect the equipment as shown in the following steps:
1. Set the input power supply up to 40 V (max), and turn them off.
2. Connect the positive voltage lead from the input power supply to VIN at the J3 connector of the EVM.
3. Connect the ground lead from the input power supply to GND at the J8 connector of the EVM.
4. Connect a 0-A to 150-mA load between VOUT and GND.
5. Disable output voltage by connecting J6 pin 2 (EN) to J6 pin 1 (GND).
2
PCB Layout
Figure 2
to
Figure 6
Figure 2. Assembly Layer
4
TPS7B8401EVM Evaluation Module
illustrate the PCB layout for this EVM.
Copyright © 2020, Texas Instruments Incorporated
Figure 3. Top Layer Routing
SBVU060A – March 2020 – Revised April 2020
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