Texas Instruments TPSM63610 Manual

TPSM63610 High-Density, 3-V to 36-V Input, 1-V to 20-V Output, 8-A (10-A Peak)
Synchronous Buck DC/DC Power Module With Enhanced HotRod™ QFN Package
1 Features
• Functional Safety-Capable
– Documentation available to aid functional safety
system design
• Versatile 36-V , 8-A
IN OUT
– Integrated MOSFETs, inductor, and controller
– Adjustable output voltage from 1 V to 20 V
– 6.5-mm × 7.5-mm × 4-mm overmolded package
– –40°C to 125°C junction temperature range
– Frequency adjustable from 200 kHz to 2.2 MHz
– Negative output voltage
• Ultra-high efficiency across the full load range
– 95%+ peak efficiency
– External bias option for improved efficiency
– Exposed Pad for low thermal impedance. EVM
θ = 18.2 °C/W.
JA
– Shutdown quiescent current of 0.6 µA (typical)
• Ultra-low conducted and radiated EMI
– Low-noise package with dual input paths and
integrated capacitors reduces switch ringing
– Resistor-adjustable switch-node slew rate
– Meets CISPR 11 and 32 Class B emissions
• Suitable for scalable power supplies
– Pin compatible with the TPSM63608 (36 V, 6 A)
• Inherent protection features for robust design
– Precision enable input and open-drain PGOOD
indicator for sequencing, control, and V
– Overcurrent and thermal shutdown protections
• Create a custom design using the TPSM63610
with the WEBENCH ® Power Designer
2 Applications
• Test and measurement,
• Factory automation and control
• Buck and inverting buck-boost
V = 3 V...36 V
IN
VIN1
VIN2
C
IN
PGND
TPSM63610
EN
VCC
R
SPSP
PG
PG
RT
R
RT
SYNC/
MODE
Typical Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
synchronous buck module
capability
signatures
UVLO
IN
aerospace and defense
power supplies
CBOOT
RBOOT
V
OUT
VLDOIN I = 8 A
OUT
VOUT1
VOUT2
R
FBT
C
OUT
FB
R
FBB
AGND
3 Description
Deriving from a family of synchronous buck modules,
the TPSM63610 is a highly integrated 36-V, 8-A
DC/DC solution that combines power MOSFETs, a
shielded inductor, and passives in an Enhanced
HotRod ™ QFN package. The module has VIN and
VOUT pins located at the corners of the package
for optimized input and output capacitor placement.
Four larger thermal pads beneath the module enable
a simple layout and easy handling in manufacturing.
With an output voltage from 1 V to 20 V, the
TPSM63610 is designed to quickly and easily
implement a low-EMI design in a small PCB footprint.
The total solution requires as few as four external
components and eliminates the magnetics and
compensation part selection from the design process.
Although designed for small size and simplicity
in space-constrained applications, the TPSM63610
module offers many features for robust performance:
precision enable with hysteresis for adjustable input-
voltage UVLO, resistor-programmable switch node
slew rate and spread spectrum and spread spectrum
option for improved EMI. Along with integrated VCC,
bootstrap and input capacitors for increased reliability
and higher density. The module can be configured
for constant switching frequency over the full load
current range (FPWM), or variable frequency (PFM)
for higher light load efficiency. Including a PGOOD
indicator for sequencing, fault protection, and output
voltage monitoring.
Package Information
PART NUMBER PACKAGE
TPSM63610
RDF (B3QFN, 22) 6.50 mm × 7.50 mm
(2)
TPSM63608
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) Product preview.
100
95
90
85
80
75
70
0 1 2 3
Output Current (A)
Typical Efficiency, V
OUT
TPSM63610
SLVSGU1 – NOVEMBER 2022
(1)
BODY SIZE (NOM)
VIN = 12 V
VIN = 24 V
VIN = 36 V
4 5 6 7 8
= 5 V, F = 1 MHz
SW