LG MG210 Service Manual
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LG MG210 Service Manual

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Service Manual
MG210
Date: May, 2006 / Issue 1.0

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  • Page 1 Service Manual MG210 Date: May, 2006 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the MG210.
  • Page 3 - 2 -...

  • Page 4: Table Of Contents

    Table of Contents 1. Introduction ........5 5. DOWNLOAD ........89 5.1 Download Setup........89 1.1 Purpose........... 5 5.2 Download Procedure ......90 1.2 Regulatory Information......5 1.3 Abbreviations .......... 7 6. SERVICE AND CALIBRATION ..97 2. General Performance...... 9 6.1 Calibration..........97 2.1 Product Name .........

  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the MG210 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. Introduction E. Notice of Radiated Emissions The MG210 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

  • Page 8: Abbreviations

    1. Introduction 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electoluminescence...
  • Page 9 1. Introduction Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating Travel Adapter...

  • Page 10: General Performance

    2. General Performance 2. General Performance 2.1 Product Name MG210: Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment GSM900/DCS1800/PCS1900 Tri-Band (900/1800/1900 - MG210c) GSM850/DCS1800/PCS1900 Tri-Band (850/1800/1900 - MG210d) Supporting Standard Triple-Band with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1,2,3,A~E...

  • Page 11: H/W Features

    2.4 H/W Features Item Feature Comment Form Factor Single LCD Folder 1) Capacity Standard : Size(mm) : Li-ion, Min 830mAh (LG Chem) 34.15(W) x 53.55(H) x 4.5(T) Battery Weight: 25g under Standard : 84X44X21.5 mm Size Standard : 84X44X21.5 mm Weight...
  • Page 12 2. General Performance Status Indicator 2 color LED Alpha/numeric Key : 12 Function Key: Function Key : 12 4 Key Navigation, I, SND, Keypad Total # of Keys : 24 END/PWR, CLR, menu, select, Side key up/down Fixed Type Internal Antenna System connector 24 Pin Ear Phone Jack...

  • Page 13: S/W Features

    2. General Performance 2.5 S/W Features Item Feature Comment RSSI 0 ~ 5 Levels Battery Charging 0 ~ 4 Levels Key Volume 0 ~ 5 Level Audio Volume 1 ~ 5 Level Time / Date Display Multi- Language English/Spanish/Portuguese Quick Access Mode Phone Book / scheduler/ Sound / Message Speed Dial Yes ( 2 ~ 9 )
  • Page 14 2. General Performance Item Feature Comment Game Java Game Calendar Memo World Clock Unit Convert Length/Surface/Volume/Weight Fax & Data Wall Paper Default : 3ea WAP Browser WAP 2. 0 Openwave 6.2 Download Melody / Over WAP Wallpaper SIM Lock Operator Dependent SIM Toolkit Class 1, 2, 3, A - E EONS...

  • Page 15: H/W Circuit Description

    3. H/W Circuit Description 3. H/W Circuit Description 3.1 General Description The RF parts consist of a transceiver part, a power amplifier part, a front-end module part, a voltage supply part, and a VC-TCXO part. The AeroII transceiver is composed of single RF chipset, Si4210-GM[U400] which is a quadband GSM/GPRS wireless communications.
  • Page 16 3. H/W Circuit Description FL400 U400/Si4210 Front End Module Baseband Baseband EGSM (TI) (TI) EGSM U101 U101 (Calypso) (Calypso) U100 U100 (IOTA (IOTA X400 Shrink) Shrink) VC-TCXO VCO + FREQUENCY VCO + FREQUENCY SYNTHESIZER SYNTHESIZER 26MHz Figure 1. RF Receiver Block 3.2.1.
  • Page 17 3. H/W Circuit Description 3.2.2. Synthesizer The Aero II transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode.

  • Page 18: Transmitter Part

    3. H/W Circuit Description 3.3 Transmitter Part The Transmitter part contains the transmitter parts of Si4210-GM[U400], Power Amp Module[U401] and Front End Module[FL400]. The transmit section of Si4210-GM[U400] consists of an I/Q base band up_converter, an offset phase-locked loop(OPLL) and two output buffers that can drive external power amplifiers(PA).
  • Page 19 3. H/W Circuit Description 3.3.1 Power Amplifier The RF3166 [U401] is a quad-band EGSM 900/GSM 850/DCS/PCS power amplifier module that incorporat es an indirect closed loop method of power control. The indirect closed loop is fully self- contained and it do es not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.
  • Page 20 3. H/W Circuit Description 3.3.3 Power Supplies and Control Signals An external regulator(U403) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. RF2.85V VBAT R1114D281D-TR-F U403 VOUT GND1 GND2 RF_EN C440 C441...

  • Page 21: Digital Baseband (Dbb) Processor

    3. H/W Circuit Description 3.4 Digital Baseband (DBB) Processor Figure 7. Top level block diagram of the Calypso-AMR C035(D751992AZHHR) 3.4.1. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- - Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.
  • Page 22 3. H/W Circuit Description 3.4.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
  • Page 23 3. H/W Circuit Description 3.4.3 RF Interface (TPU, TSP Block) Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPEN0 ABB Control Data Enable Signal TSPEN1...
  • Page 24 SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 150p 0.1u Figure 8. SIM Interface 3.4.5. UART Interface MG210 has two UART Drivers as follow : UART : Hardware Flow Control / Fax & Data Modem - 23 -...
  • Page 25 3. H/W Circuit Description UART MODEM (UART1) Resource Name Description TX_MODEM Transmit Data RX_MODEM Receive Data CTS_MODEM Clear To Send RTS_MODEM Request To Send GPIO 3 Data Set Ready Figure 3-4. UART Interface spec. - 24 -...

  • Page 26: Analog Baseband (Abb) Processor

    3. H/W Circuit Description 3.4.6. GPIO Map In total 16 allowable resources, MG210 is using 13 resources except 3 resources dedicated to SIM and Memory. MG210 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
  • Page 27 3. H/W Circuit Description • Battery charging control • Switch ON/OFF • 3V SIM card Interface • 4 internal & 4external ADC channels Figure 9. Top level block diagram of the IOTA Shrink(TWL3025) - 26 -...
  • Page 28 3. H/W Circuit Description 3.5.2. Audio Signal Processing & Interface The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
  • Page 29 3. H/W Circuit Description 3.5.3. Audio uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has a gain of typically 25.6 dB (±1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS).
  • Page 30 3. H/W Circuit Description 3.5.4. Audio downlink processing The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
  • Page 31 3.5.6. Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in MG210. - 30 -...
  • Page 32 3. H/W Circuit Description Figure 14. Power Supply Scheme - 31 -...
  • Page 33 3. H/W Circuit Description Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85V SIM card driver VRRTC 1.5V RTC &...
  • Page 34 3. H/W Circuit Description 3.5.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of MG210 is as follow. blink 4.2V~3.92V 3.91V~3.78V 3.77~3.70V 3.69V~3.62V 3.61V~3.51V 3.50V~3.35V Figure 15. Battery Block Indication 2.
  • Page 35 → IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. → CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG. 3.5.10. Memories MG210 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.5.11. Display & FPCB Interface LCD module include: →...
  • Page 36 3. H/W Circuit Description Connector Interface Spec.(Main PCB & FPCB) Pin # NAME Description V_IO 2.8V Power VBACKUP Backup Battery VBAT Battery Power LCD Read Control D(0) LCD Data D(1) LCD Data D(2) LCD Data D(3) LCD Data D(4) LCD Data D(5) LCD Data D(6)
  • Page 37 3. H/W Circuit Description 3.5.12. Keypad Switching & Scanning Table 3-10. Keypad Map KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 LEFT RIGHT DOWN KBR1 KBR2 VOL_UP KBR3 VOL_DOWN KBR4 SEND DBB supports 23 Key Map and Switch-ON Key is connected directly to ABB as (Figure18 ). SIDEKEY(VOLUME) CN302 R313...
  • Page 38 3. H/W Circuit Description 3.5.13. Keypad back-light Illumination There are 14 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA Shrink. KEY BACKLIGHT VBAT R333 LEDB R334 Figure 17. Keypad Back-light Scheme 3.5.14.
  • Page 39 Close to ABB Figure 19. Microphone system When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MG210. IOTA Shrink(ABB) provid es both 2.0V and 2.5V for MICBIAS to circuit designer. VA200, VA201 are employed to enhance ESD immunity.
  • Page 40 3. H/W Circuit Description Head set Jack Interface EAR-MIC Close to Ear-jack V_IO R218 HSMICBIAS C231 C232 4.7u R219 (1608) C233 R220 R221 (1608) 5.6K R222 HOOK_DETECT C235 Close to ABB C240 C241 C242 C244 CN200 L200 100nH L201 100nH C243 0.1u HSMICP...
  • Page 41 3. H/W Circuit Description Receiver / Speaker phone Circuits VBAT C230 0.1u DG3535DB-T5-E3 U202 SPKN RCV_SPK_SEL ANALOG S/W SPKP COM1 SPK_RCVN SPK_RCVP COM2 V_IO DG2011DX-T1-E3 U 203 C234 MIDI_SPK_I RCV_N R223 C237 C238 SPK_PHN_EN RCV_P R224 22 C239 Figure 21. Receiver and Speaker phone mode system switch A single analog switch is employed to support both voice and speaker Phone mode with RCV_P.
  • Page 42 3. H/W Circuit Description MIDI SOUND circuit description MIDI U200 YMU762C-QZ MCLK CLK1 HPOUT_R LCD_RESET _RST HPOUT_L C202 A(1) C200 R200 36K R201 C201 MIDI_SPK_I 1000p MIDI_CS C203 MELODY_INT _IRQ D(0:7) R202 120K D(0) D(1) D(2) VIBRATOR D(3) D(4) D(5) SPOUT1 SPKP D(6)
  • Page 43 3. H/W Circuit Description Receiver and Speaker circuit C300 C301 VA300 C302 CN300 EVL5M02200 L300 100nH SPK_RCVN SPK_RCVP L301 100nH LCD_RESET LCD_CS LCD_ID Figure 23. Receiver and Speaker Circuit SPK_RCVP, SPK_RCVN signals from Analog switch are connected to speaker through SPK+ and SPK-.

  • Page 44: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Main Components Placement CN200 U401 SW400 FL400 U300 U400 CN300 U402 U403 CN302 X400 U203 U200 U202 U100 D301 Q300 X100 U101 J300 Q200 U201 D300 Q301 CN301 - 43 -...

  • Page 45: Keypad Components Placement

    4. TROUBLE SHOOTING 4.2 KEYPAD Components Placement U301 MIC200 - 44 -...

  • Page 46: Fpcb Components Placement

    4. TROUBLE SHOOTING 4.3 FPCB Components Placement BAT1 4.4 Baseband Components - 45 -...

  • Page 47: Main Components (Description)

    4. TROUBLE SHOOTING 4.5 Main Components (Description) MAIN U301 Hall effect switch U402 UHS Triple Buffer CN300 LCD connector CN200 Ear-Mic jack U300 LCD Back Light LED charge pump MIC200 Microphone SW400 RF Mobile switch U400 RF Transceiver FL400 Quad FEM U401 Power Amplifier Module U403...

  • Page 48: Power On Trouble

    4. TROUBLE SHOOTING 4.6 Power On Trouble 4.6.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.6.2 Check Points •...

  • Page 49: Charging Trouble

    4. TROUBLE SHOOTING 4.7 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 5.2V • Charging temperature adc range • Charging time : under 3hours - ~ -5°C : charging. • Charging current : about 500mA - -5°C ~ 50°C : charging.
  • Page 50 4. TROUBLE SHOOTING Charging Procedure Trouble Shooting Setup • Connecting TA & Charger Detection • Connect Battery & TA to the handset. • Control the charging Current by ABB • Charging Current flows into the Battery Check Points Trouble Shooting Procedure •...

  • Page 51: Lcd Display Trouble

    4. TROUBLE SHOOTING 4.8 LCD Display Trouble FPCB CONNECTOR CN300 Check soldering around connector -FPCB CONNECTOR -LCD CONNECTOR LCD Control Signals From Main Board • WLED_A, WLED_C1, WLED_C2, LCD_CS, LCD_RESET, _WR, RD, LCD_ID • A(1), D(0)~D(15) Check Points • The Assembly status of the LCD Module. •...
  • Page 52 4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect LCD Module and board is OK? Module Resolder the MAIN CN300, FPCB CN2,CN3 MAIN CN300, FPCB is soldered well? CN2,CN3 Paths of LCD control Resolder signals are OK? FL300~303...

  • Page 53: Receiver Trouble

    4. TROUBLE SHOOTING 4.9 Receiver Trouble Block Diagram Block Diagram Control SPKP/ Calypso YMU762 RCV_SPK_SEL SPKN (U101) (U200) Analog SW SPK_RCVP/ SPK_PHN_EN (U203) SPK_RCVN RCV_P RECEIVER IOTA Analog SW & RC filter (U100) (U202) SPEAKER RCV_N Melody Generation • U200(YMU762,MIDI) is controlled by DBB. •...
  • Page 54 4. TROUBLE SHOOTING Folder FPCB Speaker/ Receiver Check the states these points ! Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. • Set audio part at test equipment as PRBS or continuous wave, not echo. •...
  • Page 55 4. TROUBLE SHOOTING 4.9.1. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. ABB is out of order. Does sine wave appear Change the boa rd. at R223, R224? Does sine wave appear Change the U203 at pin 4 of U203...
  • Page 56 4. TROUBLE SHOOTING 4.9.2. Speaker Trouble START Enter into Engineering Mode and → → go to menu "Baseband Alert Ring" Resolder the U200 Does sine wave appear V_SRAM otherwise Change it. at C205? is 2.8? Does sine wave appear at L300, L301? Connection Reconnect between FPCB and...

  • Page 57: Microphone Trouble

    4. TROUBLE SHOOTING 4.10 Microphone Trouble Circuit Diagram R211 MICBIAS C220 C221 4.7u (1608) R214 1.2K Close to MIC VA200 C222 R215 MIC200 C225 0.1u MICP C227 C228 R216 C226 0.1u MICN VA201 SUMY0010507 C229 R217 Close to ABB - 56 -...
  • Page 58 4. TROUBLE SHOOTING Microphone Signal Flow Check Points • MIC is enable by MICBIAS • Microphone bias • MICBIAS, MICP, MICN signals to ABB • Audio signal level of the microphone • Soldering of components Trouble Shooting Setup Trouble Shooting Procedure •...
  • Page 59 4. TROUBLE SHOOTING START Connect the handset to network equipment and setup call. Resolder the The soldering of R211 The voltage of R211 R211 is 2.5? is OK? ABB is out of order. Change the board. Soldering between MIC and Board is OK? Resolder the MIC Check the signal level at pin...

  • Page 60: Vibrator Trouble

    4. TROUBLE SHOOTING 4.11 Vibrator Trouble Block Diagram VIBRATOR VBAT VBAT R304 R305 R306 R307 VIBRATOR D300 R308 1SS302-T5L_F_H MOTOR Q301 EMZ2 Vibrator Operation Check Points • Vibrator is controlled by MIDI chip • VDD lines (V_SRAM) of MIDI chip •...
  • Page 61 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Vibrator U200 is out of order. Signal of pin3 of Q301 Voltage of R307 Change the U200. is OK? is 2.8V Q301 is out of order. Change the Q301. Resolder Check the soldering of Pin1 of Q301 is 3.1V~4.2V? R304,R305...

  • Page 62: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.12 Keypad Backlight Trouble Block Diagram KEY BACKLIGHT VBAT R333 LEDB R334 Backlight Operation • The keypad LED backlight is controlled with LEDB signal. • LEDB signal from ABB. • The LEDs are forward biased and turned on. Check LEDB signal R333, R334...
  • Page 63 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Keypad On The Voltage ABB is out of order. Check the soldering Of LEDB signal Change the Board. of R333 and R334 is about 0V? Power off and Measure the Resistor Value of all LEDs.

  • Page 64: Folder Open/Close Trouble

    4. TROUBLE SHOOTING 4.13 FOLDER Open/Close Trouble Block Diagram HALL EFFECT S/W V_IO V_IO FOLDER C316 C317 0.1u 0.1u Folder Operation • There is a magnet to detect the Flip status, opened or closed. • If a magnet is close to the hall-effect switch(U301), the voltage at pin 2 of U301 goes to 0V. Otherwise, V_IO.
  • Page 65 4. TROUBLE SHOOTING Caution! If use PIF jig, the START remote switch is turned off. Folder open status. Not magnetized Resolder the The all paths connected R321 to U301 are OK? ABB is out of order. Pin1 of U301 is 2.8V? Change the Board.

  • Page 66: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.14 SIM Detect Trouble Block Diagram V_IO V_SIM VRSIM DBBSIO SIM_IO DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 150p 0.1u J300 Connection between SIM and DBB • SIM_CLK, SIM_IO, SIM_RST Check Points • Contact between SIM and socket - Soldering of SIM socket Trouble Shooting Setup •...
  • Page 67 4. TROUBLE SHOOTING START Insert the SIM Card The soldering of SIM connector Resolder the J300. is OK? The all paths connected Resolder the to J300 are OK? C319,C320,R340 SIM card is broken. The SIM Card is OK? Change the SIM Card. The ABB(IOTA) is broken.

  • Page 68: Earphone Trouble

    4. TROUBLE SHOOTING 4.15 Earphone Trouble Block Diagram EAR_JACK SPEC EAR-MIC Receiver Close to Ear-jack V_IO R218 HSMICBIAS C231 C232 4.7u R219 (1608) C233 R220 R221 (1608) 5.6K R222 HOOK_DETECT C235 Close to ABB C240 C241 C242 C244 CN200 L200 100nH L201 100nH...
  • Page 69 4. TROUBLE SHOOTING This pin connects with Headset Input Pin Microphone of Ear-Mic Headset Output Pin This pin connects with Receiver of Ear-Mic JACK Detect Pin The components of HSO The components of HSMICP - 68 -...
  • Page 70 4. TROUBLE SHOOTING cf) PRBS : Pseudo Random Bit Sequence START Insert the earphone into the headset. Does the Audio profile change 1. Earphone detection problem to the earphone mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you Soldering...
  • Page 71 4. TROUBLE SHOOTING 1. Earphone detection problem The Voltage The soldering Resolder the at JACK_DETECT point Of R227, R228 R227, R228 is 0V? is OK? Pin3 and Pin4 of CN200 Change the CN200. are open? The ABB is out of order. Change the board.
  • Page 72 4. TROUBLE SHOOTING 2. Sending Path problem Set audio part of the test equipment to the echo mode. The voltage at R220 Resolder the is 1.1V ~ 1.3V? R218,R220 A few tens or hundreds Resolder soldering of C243,L200 of mV of signals at C243 the C243,L200,L201 and L201 is OK? are measured ?

  • Page 73: Rf Part Troubleshooting

    4. TROUBLE SHOOTING 4.16 RF Part Troubleshooting RF Components SW400 U401 FL400 U400 U402 X400 U403 Figure 8. RF Components Reference Description Reference Description SW400 Mobile S/W U403 LDO(Voltage Regulator) FL400 X400 VCTCXO(26MHz) U402 Triple Buffer U401 U400 RF Main Chip Table .
  • Page 74 4. TROUBLE SHOOTING Trouble Shooting of Receiver Part Checking Flow Checking Points START E5515C : Test Mode CH190, 7 level setting (TCH) CH190, -60 dBm setting (BCCH) Spectrum Analyzer setting Oscilloscope setting Check Regulator Circuit (1) Check VCTCXO Circuit (2) Figure .
  • Page 75 4. TROUBLE SHOOTING Checking Regulator Circuit (Rx pass continued) Checking Points Checking Flow Check Pin 1 3.4 ~ 4.2 V ? Check Battery Pin 6 High ? Check DBB[U101] Replace Regulator ≡ Pin 3 2.85V ? [U403] U403 Regulator Circuit is OK. PIN6 See next page to check PIN1...
  • Page 76 4. TROUBLE SHOOTING Checking VCTCXO Circuit (Rx pass continued) Checking Points Checking Flow Check Pin 3 of X400 VCTCXO circuit is OK 26MHz ? See next page to check PLL circuits Pin 4 2.85V ? Replace X400 Check U403 PIN3 PIN1 Crystal Output PIN4...
  • Page 77 4. TROUBLE SHOOTING Checking PLL Circuit (Rx pass continued) Checking Points S_CLK U403 S_EN S_DATA Control Signal Circuit Diagram Checking Flow Check S_CLK, S_EN, S_DATA R400 S_CLK R401 Signal is S_EN Download SW normal? R402 S_DATA RXQN PLL circuit is OK. See nest page to check FEM &...
  • Page 78 4. TROUBLE SHOOTING Checking FEM & Mobile SW (1) (Rx pass continued) Checking Flow Check SW400 Pin 1,2 with no RF cable connected Short ? Replace SW400 Check SW400 Pin 1,2 with RF cable connected Open ? Replace SW400 Rx standalone mode is needed Check ANT_SW1, ANT_SW2 of FL400 (Table 2-1) GSM850 RX ?
  • Page 79 4. TROUBLE SHOOTING Checking Points Pin22 Pin21 Pin20 ANT_SW1 ANT_SW2 ANT_SW3 Mobile S/W & FEM Circuits Diagram KMS-506 SW400 RF2.85V C410 C413 1000p FL400 YGHF-S006A GMS_RX- GSM_RX+ VCTRL1 EGSM_RX- VCTRL2 EGSM_RX+ VCTRL3 DCS_RX- DCS_RX+ GND1 PCS_RX- GND2 PCS_RX+ GND3 GND4 TX1G GND5 TX2G...
  • Page 80 4. TROUBLE SHOOTING Checking Rx I/Q (Rx pass continued) Checking Points Checking Flow Check I/Q Replace U400 I/Q is normal? Redownload the software & Calibration Rx IQ Circuit Waveform RXQP RXQP RXIP RXIP S_DATA RXQN RXQP RXIN RXIP 26MHZ TXQN R404 C411 560p...
  • Page 81 4. TROUBLE SHOOTING Trouble Shooting Transmitter Part Checking Flow Checking Points START ➅ E5515C : Test Mode CH190, 7 level setting (TCH) ➅ CH190, -60 dBm setting (BCCH) ➄ Spectrum Analyzer setting Oscilloscope setting ➂ Check Regulator Circuit (1) ➃ Check VCTCXO Circuit (2) ➁...
  • Page 82 4. TROUBLE SHOOTING Checking Regulator Circuit (Tx pass continued) Checking Points Checking Flow Check Pin 1 3.4 ~ 4.2 V ? Check Battery Pin 6 High ? Check DBB[U101] Replace Regulator ≡ Pin 3 2.85V ? [U403] U403 PIN6 Regulator Circuit is OK. See next page to check PIN1 PIN3...
  • Page 83 4. TROUBLE SHOOTING Checking VCTCXO Circuit (Tx pass continued) Checking Points Checking Flow Check Pin 3 of X400 VCTCXO circuit is OK 26MHz ? See next page to check PLL circuits Replace X400 Pin 4 2.85V ? Check U403 PIN1 PIN4 Crystal Input LDO Output...
  • Page 84 4. TROUBLE SHOOTING Checking PLL Circuit (Tx pass continued) Checking Points S_CLK U403 S_EN S_DATA Control Signal Circuit Diagram Checking Flow Check S_CLK, S_EN, S_DATA R400 S_CLK R401 Signal is S_EN Download SW normal? R402 S_DATA RXQN PLL circuit is OK. See nest page to check FEM &...
  • Page 85 4. TROUBLE SHOOTING Checking Tx I/Q (Tx pass continued) Checking Points TXQP,QN TXIP,IN Rx IQ Circuit S_DATA RXQN RXQP RXIN RXIP 26MHZ TXQN R404 C411 560p TXQP R405 TXIN R406 C420 560p TXIP R407 Checking Flow Waveform Check I/Q TXIP Replace U400 I/Q is normal? Redownload the software...
  • Page 86 4. TROUBLE SHOOTING Checking PAM Circuits (Tx pass continued) Checking Points Checking Flow Check VRAMP, PA_ON, PA_BAND Normal? Download the SW PA_BAND PA_ON Control signal is OK. See next page to VRAMP Check FEM & Mobile SW Tx PAM Circuit Diagram R412 PA_BAND C427...
  • Page 87 4. TROUBLE SHOOTING Waveform PA_ON VRAMP - 86 -...
  • Page 88 4. TROUBLE SHOOTING Checking FEM & Mobile SW (1) (Tx pass continued) Checking Points Tx standalone mode is needed Check RF Level FL500 Pin 10,12 (Table 2-1) ≥ 20dBm Replace U400 Check ANT_SW1, ANT_SW2, ANT_SW3 of FL400 GSM850/900(TX 1GHz) Replace ANT_SW1 : H the board ANT_SW2 : L...
  • Page 89 4. TROUBLE SHOOTING Checking Points Pin22 Pin21 Pin20 ANT_SW 1 ANT_SW2 ANT_SW3 Mobile S/W & FEM Circuits Diagram KMS-506 SW400 RF2.85V C410 C413 1000p FL400 YGHF-S006A GMS_RX- GSM_RX+ VCTRL1 EGSM_RX- VCTRL2 EGSM_RX+ VCTRL3 DCS_RX- DCS_RX+ GND1 PCS_RX- GND2 PCS_RX+ GND3 GND4 TX1G GND5...

  • Page 90: Download

    5. DOWNLOAD 5. DOWNLOAD 5.1 Download Setup 5.1.1 In case of using the Data kit Figure 5-1 Describes Download Setup Preparation • Target Handset • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V.

  • Page 91: Download Procedure

    5. DOWNLOAD 5.2 Download Procedure 5.2.1. Computer Program file -> MultiGSM.exe Click - 90 -...
  • Page 92 5. DOWNLOAD 5.2.2. Click the “Setting” button. Then, choose Configuration which is going to download. - 91 -...
  • Page 93 5. DOWNLOAD 5.2.3. Configuration Setting C:\GSMULTI\Model\MG210.dll - 92 -...
  • Page 94 5. DOWNLOAD 5.2.4. Press “Start Button”. MG210 - 93 -...
  • Page 95 5. DOWNLOAD 5.2.5. After “Start Button”, Which Stand-by condition MG210 - 94 -...
  • Page 96 5. DOWNLOAD 5.2.6. SW downloading Condition. MG210 - 95 -...
  • Page 97 5. DOWNLOAD 5.2.7. SW downloading END Condition. MG210 - 96 -...

  • Page 98: Service And Calibration

    6. SERVICE AND CALIBRATION 6. SERVICE AND CALIBRATION 6.1 Calibration 6.1.1 Equipment Setup GSM Test Set(8960) GPIB Cable Mobile Switch Cable Power Supply GPIB Cable Battery Simulator Figure 6-1 Calibration Equipment List - 97 -...
  • Page 99 6. SERVICE AND CALIBRATION 6.1.2 RF Calibration Program 1. Execute "Hot_KimchiD.exe" 2. Click on "APPLY" button. MG210 MG210 3. Click on "CALIBRATION START" - 98 -...
  • Page 100 6. SERVICE AND CALIBRATION 4. Click on "CALIBRATION START" button. MG210 MG210 - 99 -...
  • Page 101 - 100 -...

  • Page 102: Circuit Diagram

    MG210 Designer 05/11/25 H.C. KWAK KBR(0:4) UFLS Checked 06/02/03 S.R. LEE ON_SW ON_SW RPWON DRAWING VBAT VBAT Baseband Main NAME URXD Approved 06/02/03 I.Y. HWANG UTXD DRAWING Rev 1.0 Iss. Notice No. Date Name LG Electronics Inc. - 101 -...
  • Page 103 C247 L202 C248 C249 C250 100nH (1608) C246 Checked S.R. LEE R227 06/02/03 DRAWING JACK_DETECT AUDIO NAME C251 Approved 06/02/03 I.Y. HWANG DRAWING Rev 1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 102 -...
  • Page 104 R344 KBR(0) Checked 06/02/03 S.R. LEE DRAWING etc. NAME R345 Approved 06/02/03 I.Y. HWANG KBC(0) R346 KBC(1) R347 KBC(2) R348 KBC(3) R349 KBC(4) DRAWING Rev 1.0 Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 103 -...
  • Page 105 R422 MODEL MG210 Sheets C440 C441 4.7K C442 Designer 06/02/03 K.S.HWANG Checked 06/02/03 H.Y.SON DRAWING RF_AERO II NAME Approved 06/02/03 I.Y. HWANG DRAWING Rev 1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 104 -...

  • Page 106: Pcb Layout

    8. pcb layout - 105 -...
  • Page 107 8. pcb layout - 106 -...

  • Page 108: Engineering Mode

    [2-2-3] LCD Color [2-8-6] DAI Test [2-2-4] LCD Contrast [2-8-7] Loopback Test [2-2-5] Temperature Table [2-8-8] Speaker Gain [2-3] Font [3] MG210 Vers [2-3-1] Font 810 [4] ENG MODE [2-3-2] Font 810i [4-1] Cell Environ [2-3-3] Font 810b [2-3-4] Font 814...

  • Page 109: Standalone Test

    10. STANDALONE TEST 10. STANDALONE TEST 10.1 Setting Method 10.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 115200 • Leave the rest as default values 10.1.2 Tx Test 1.

  • Page 110: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW - 109 -...
  • Page 111 - 110 -...

  • Page 112: Replacement Parts

    MG210 SILVER Silver MDAE00 DECO,FOLDER(UPPER) MDAE0035502 MG210 SILVER Silver MDAY00 DECO MDAY0025901 MG210 deco indicator led Silver MGAD00 GASKET,SHIELD FORM MGAD0109601 MG210 UPPER GASKET SHIELD FOAM Black MIAA00 INDICATOR,LED MIAA0017901 MG210 Transparent MPBJ00 PAD,MOTOR MPBJ0030501 MG210 Black MPBN00 PAD,SPEAKER MPBN0027501...
  • Page 113 CAP,RECEPTACLE (common use) Dark Gray MCCF00 CAP,MOBILE SWITCH MCCF0034702 MG210 SILVER Silver MLAK00 LABEL,MODEL MLAK0006901 ADCA00 DOME ASSY,METAL ADCA0050601 MG210 METAL DOME ASS'Y (MAIN) Black MGAD00 GASKET,SHIELD FORM MGAD0109701 MG210 PCB EARJACK GASKET SHIELD FOAM Apple Green - 112 -...

  • Page 114: Main Component

    11. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0043701 PCB ASSY, SACB00 SACB0028601 FLEXIBLE,INSERT 3 V,1.2 mAh,COIN ,MATUESHITA Backup BATTERY...
  • Page 115 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLAB00 LABEL,A/S MLAB0000601 HUMIDITY STICKER MLAC00 LABEL,BARCODE MLAC0003301 EZ LOOKS(use for PCB ASSY MAIN(hardware)) PCB ASSY,MAIN,SMT SAFC00 SAFC0068101 BOTTOM C100 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C101 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP...
  • Page 116 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C200 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C201 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C202 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C203 CAP,CERAMIC,CHIP ECCH0000122...
  • Page 117 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C238 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C240 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C241 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C242 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C243 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C244 CAP,CERAMIC,CHIP ECCH0000110...
  • Page 118 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C407 CAP,CERAMIC,CHIP ECCH0000173 1.2 pF,16V ,B ,NP0 ,TC ,1005 ,R/TP C408 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C409 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C410 CAP,CERAMIC,CHIP ECCH0000122...
  • Page 119 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CONNECTOR, CN300 ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT BOARD TO BOARD CN301 CONNECTOR,I/O ENRY0003501 24 PIN,0.5 mm,ANGLE , , D200 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) D300 DIODE,SWITCHING EDSY0005301...
  • Page 120 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R105 RES,CHIP ERHY0000138 33K ohm,1/16W,F,1005,R/TP R106 RES,CHIP ERHY0000153 100K ohm,1/16W,F,1005,R/TP R107 RES,CHIP ERHY0000153 100K ohm,1/16W,F,1005,R/TP R108 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R109 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R110 RES,CHIP ERHY0000261...
  • Page 121 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R224 RES,CHIP ERHY0000208 22 ohm,1/16W,J,1005,R/TP R225 RES,CHIP ERHY0000222 120 ohm,1/16W,J,1005,R/TP R226 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R227 RES,CHIP ERHY0000138 33K ohm,1/16W,F,1005,R/TP R228 RES,CHIP ERHY0000266 22K ohm,1/16W,J,1005,R/TP R300 RES,CHIP ERHY0000280...
  • Page 122 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R408 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R409 RES,CHIP ERHY0000229 300 ohm,1/16W,J,1005,R/TP R410 RES,CHIP ERHY0000206 18 ohm,1/16W,J,1005,R/TP R411 RES,CHIP ERHY0000229 300 ohm,1/16W,J,1005,R/TP R412 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R413 RES,CHIP ERHY0000201...
  • Page 123 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark X400 VCTCXO EXSK0004901 26 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.2 , SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0067301 C316 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C317 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP...
  • Page 124 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R343 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R344 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R345 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R346 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R347 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R348 RES,CHIP ERHY0000237...

  • Page 125: Accessory

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,830 mAh,1 CELL,PRISMATIC ,FG101 SBPL00 BATTERY PACK,LI-ION SBPL0077901 RUSSV423450, Innerpack SGEY00...
  • Page 126 Note...
  • Page 127 Note...

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