KX-FLB802CX/KX-FLB812CX/KX-FLB802CXS/KX-FLB812CXS
15.5. HOW TO REPLACE A FLAT PACKAGE IC
15.5.1. PREPARATION
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 662°F ± 50°F (350°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note:
See ABOUT LEAD FREE SOLDER (PbF: Pb free) (P.6).
15.5.2. PROCEDURE
1. Tack the flat pack IC to the PCB by temporarily soldering two diagonally opposite pins in the correct positions on the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering iron along the tips of the pins while feeding enough solder to
the tip so that it flows under the pins as they are heated.
15.5.3. REMOVING SOLDER FROM BETWEEN PINS
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of the pin to draw the solder from between the adjacent pads.
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