Table Of Contents - Sony Net MD Walkman MZ-N1 Service Manual

Sony portable minidisc recorder service manual
Table of Contents

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CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
On power sources
• Use house curre nt, nikel metal hyd ride
rechargeable battery, LR6 (S G) battery, or car
battery.
For use in your house: For the s uppl ied battery
charging s tand, use the AC power adaptor
s uppl ied with this recorder. Do not use an y other
AC power adaptor s ince it ma y cause the recorder
to malfuncti on.
Polarity of the
plug
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚ C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚ C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚ C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

TABLE OF CONTENTS

1.
2.
................................................................... 5
3.
3-1. Disassembly Flow ........................................................... 6
3-2. Bottom Panel Assy .......................................................... 7
3-3. Upper Panel Section ........................................................ 7
3-4. LCD Module, Upper Panel Assy .................................... 8
3-5. MAIN Board Section ...................................................... 8
3-6. Battery Case Assy, MAIN Board .................................... 9
Chassis Assy .................................................................... 9
3-8. OP Service Assy (LCX-5R) ............................................ 10
3-9. Holder Assy ..................................................................... 11
3-10. DC Motor (Sled) (M602) ................................................ 11
4.
.............................................................. 13
5.
6.
6-1. Block Diagram - SERVO/USB Section - ...................... 30
6-2. Block Diagram - AUDIO Section - ............................... 31
POWER SUPPLY Section - ........................................... 32
Schematic Diagrams ....................................................... 33
- MAIN Board (Component Side) - ............................. 34
- MAIN Board (Conductor Side) - ............................... 35
6-11. IC Pin Function Description ........................................... 46
7.
7-1. Upper Panel Section ........................................................ 53
7-2. Bottom Panel Section ...................................................... 54
7-3. Chassis Section ............................................................... 55
7-4. Main Board Section ........................................................ 56
8.
MZ-N1
............................................... 4
......................... 19
............................... 58
3

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