Table of Contents
Advertisement
SE4400 Integration Guide
4.50 + 0.50
Polymide Stiffener
Far Side
4.35 +/- 0.01
Notes:
1. Dimensions are in mm.
2. Material: Base dielectric to be 1 mil polymide per IPC-4204/11 with 1/2 oz. copper clad.
Coverlayer(s) to be polymide per IPC-4203/1.
3. Finish: All exposed copper areas are to be white tin plated to a thickness of 25 microinches (average
thickness).
4. Workmanship standards shall be in accordance with IPC-6011 Class 2 and IPC-6013 type 1.
5. Supplied gerber data: Minimum conductor width 0.10 mm. Minimum spacing to be 0.08 mm. (except in
connector area).
6. Dimensions are to center of contact.
7. Scalloped ends are optional at covercoat termination in exposed finger areas.
8. Copper foil grain direction must be parallel with ZIF ends circuit conductors.
Figure 4-3. SE4400 to PL 4407-B000 Flex, p/n 50-16000-650
4-6
10.50
See Note 6 & 10
2X R 5.25 +/- 0.50
12X R 0.20
9.50
Advertisement
Table of Contents
