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3.6
Description of block diagram
Siemens Building T
echnologies
Cerberus Division
The transmitter
1
transmits the light pulses to the reflector
pulses back to the receiver
which is amplified in the preamplifier
(ASIC)
5
. The microprocessor (µP)
mitter pulses so that no external pulse is evaluated.
The sensor-specific functions are contained in the ASIC. It is used to filter signals, pro-
cess signals using fuzzy algorithms, amplify signals and for the entire sequence control
which is synchronized with the µP.
The µP communicates with the control unit via the line interface
the two-wire bus line. The detector receives commands which activate the type of opera-
ting mode, diagnostic stages etc. via the data interface which is integrated in the line inter-
face. The detector transmits response signals, the results of diagnostic polling and status
signals back to the control unit.
With the help of the isolation function, sections which malfunction are "isolated", so that in
the event of a short circuit, the entire bus line does not break down. Upon short circuit, two
"electronic switches" (FET) open automatically and isolate the line in the area where the
malfunction has occurred until the short circuit has been eliminated.
The internal response indicator (AI)
dication of alarm and are activated by the control unit.
The 6 DIP switches
11
allow parameterization of the detector (see section 6.1).
The REED contact
12
serves to initialize the detector during commissioning (see section
6.4).
A detector heating device, which prevents condensation of the lenses, can be connected
to detector heating terminal
The DZL1191 adjustment device can be connected via connector
function of the adjustment device is explained in section 6.3 (electronic alignment)
2
1
Transmitter
4
3
Pream-
ASIC
plifier
Receiver
Fig. 10 Block diagram
3
. The light pulses are proportional to the signal current,
4
and fed to the customer-specific integrated circuit
6
synchronizes the receiver pulses with the trans-
9
and the external response indicator
13
.
Detector heating
device
5
6
µP
interface
11
12
1
DIP switches
2
Reed internal AI
contact
3
4
4
5
6
2
. This transmits the light
via terminals
7
10
provide in-
14
. The purpose and
13
Test point for production
Reserve
8
7
Line
10
9
14
external AI
Adjustment
device
and
8
–
24V
9
e1276e
09.2000
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