Nvidia DGX-2 SYSTEM User Manual page 108

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Declaration of the presence condition of the Restricted Sustances Marking
單元
Parts
機箱
Chassis
印刷電路部件
PCA
處理器
Processor
主板
Motherboard
電源設備
Power supply
存儲設備
System memory
硬盤驅動器
Hard drive
機械部件 (風扇、散熱器、面板等)
Mechanical parts (fan, heat sink, bezel...)
線材/連接器
Cables/Connectors
焊接金屬
Soldering material
助焊劑,錫膏,標籤及其他耗材
Flux, Solder Paste, label and other consumable
materials
備考1:O:系指該限用物質未超出百分比含量基準值
Note 1: O:indicates that the percentage content of the restricted substance does not exceed the percentage of reference value of presence.
備考2: -:系指該项限用物質为排外项目。
Note 2:-:indicates that the restricted substance corresponds to the exemption.
此表中所有名稱中含 "-" 的部件均符合歐盟 RoHS 立法。
All parts named in this table with an "-" are in compliance with the European Union's RoHS Legislation.
注:環保使用期限的參考標識取决與產品正常工作的温度和濕度等條件
Note: The referenced Environmental Protection Use Period Marking was determined according to normal operating use conditions of the product such
as temperature and humidity.
DGX-2 System User Guide
限用物質含有情况標示聲明書
設備名稱:DGX-2
Equipment Name: DGX-2
限用物質及其化學符號
Restricted substances and its chemical symbols
(Pb )
(Hg)
(Cd)
-
O
O
-
O
O
-
O
O
-
O
O
-
O
O
-
O
O
-
O
O
-
O
O
-
O
O
O
O
O
O
O
O
Using DGX-2 System in KVM Mode
六價铬
多溴聯苯
多溴二苯醚
(Cr(VI))
(PBB)
(PBDE)
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
108

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