Table Of Contents - Sony CDP-XE700 Service Manual

Table of Contents

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CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
CAUTION
: INVISIBLE LASER RADIATION WHEN OPEN AND
INTERLOCKS DEFEATED. AVOID EXPOSURE TO BEAM.
ADVARSEL
: USYNLIG LASERSTRÅLING VED ÅBNING NÅR
SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION. UNDGÅ UDSAETTELSE
FOR STRÅLING.
VORSICHT
: UNSICHTBARE LASERSTRAHLUNG, WENN
ABDECKUNG GEÖFFNET UND SICHEREITSVERRIEGELUNG
ÜBERBRÜCKT. NICHT DEM STRAHL AUSSETZEN.
VARO!
: AVATTAESSA JA SUOJALUKITUS OHITETTAESSA OLET ALT-
TIINA NÄKYMÄTTÖMÄLLE LASERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
VARNING
: OSYNLIG LASERSTRÅLING NÄR DENNA DEL ÄR ÖPP-
NAD OCH SPÄRREN ÄR URKOPPLAD. BETRAKTA EJ STRÅLEN.
ADVARSEL
: USYNLIG LASERSTRÅLING NÅR DEKSEL ÅPNES OG
SIKKERHEDSLÅS BRYTES. UNNGÅ EKSPONERING FOR STRÅLEN.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED
LINE WITH MARK ! ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified as
a CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
This caution
label is located
inside the unit.

TABLE OF CONTENTS

Section
SECTION 1. SERVICING NOTE ...................................
3-1. Front Panel Assembly ......................................................... 5
SECTION 4. TEST MODE ..............................................
6-1. Circuit Boards Location ................................................... 10
6-3. Printed Wiring Board - BD Section - .......................... 13
6-4. Schematic Diagram - BD Section - ............................. 15
6-5. Printed Wiring Board - Main Section - ....................... 20
6-6. Schematic Diagram - Main Section - .......................... 23
SECTION 7. EXPLODED VIEWS
7-1. Front Panel Section .......................................................... 27
7-2. Chassis Section ................................................................. 28
7-3. CD Mechanism Section (CDM36-14) .............................. 29
7-4. Base Unit Section (BU-14) ............................................... 30
MODEL IDENTIFICATION
- BACK PANEL -
4-978-904-1π: AEP, German model
4-979-904-8π: UK model
- 2 -
Title
Page
...................................................... 4
3
6
8
31

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