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HP T1000 G4 Disassembly Instructions Manual page 2

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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Philips Screw Driver
Torx Head Screw Driver
Socket Wrench
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Disconnect all power cords, including battery connector;
2.
Remove top cover;
3.
Remove Front panel assy;
4.
Remove batery pack;
5.
Remove PCBA and TX
6.
Final Disassembly
7.
Remove Rubber foot Pads
8.
9.
10.
11.
12.
13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
#2
T10
M4
Page 2

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