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CD board
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
forward side
CW102
JW10
CW107
JW32
JW21
R E V
A H 4 1 - 0 0 9 2 3 A
G6HI-3CD
C407
C221
C219
CW105
reverse side
R 4 1 2
J 3
R 2 1 6
R 4 11
R 2 1 7
R 4 2 9
J 2 2
C 2 2 6
C 2 2 2
C 2 2 3
C 2 2 4
R 4 2 1
C 2 1 8
C 2 3 0
C 2 3 1
R 4 0 9
R 2 11
J 8
J 2
J 4
J 11
R 4 3 1
R 4 3 2
R 4 3 0
R 4 3 3
1
2-17
JW6
JW5
D301
00
C207
C210
C203
R210
C503
J 6
R 11 4
R 11 5
C 11 9
I C 3 0 1
C 2 0 2
C 2 1 5
R 2 1 3
C 2 1 4
I C 5 0 1
I C 2 0 1
C 2 1 6
C 2 3 2
2 2
CW101
JW2
JW15
JW30
IC401
C 1 2 7
C 1 2 6
R 1 2 0
C 1 2 5
J 9
R 11 9
C 1 2 4
C 1 2 3
J 2 1
R 11 7
R 11 6
C 1 2 1 C 1 2 2
J 1 4
R 11 8
I C 1 0 1
C 1 2 0
C 11 7
R 111
R 11 2
R 11 0
R 1 0 9
C 11 6
C 11 5
R 1 0 4
R 1 0 7
C 1 4 1
R 1 0 6
C 11 3
R 1 0 5
R 4 0 7
C 1 4 3
R 4 0 8
C 1 4 0
R 4 2 0
R 4 0 6
D 3 0 7
C 5 0 2
J 1 3
D 3 0 6
C 5 0 1
J 1 2
J 1 8
C 4 0 1
JW4
CW103
C212L
JW1
C206R
Q302
JW23
C303
D302
D305
C302
R 1 2 8
C 1 2 9
C 1 3 0
C 1 3 2
R 1 2 1
C 1 3 1
C 1 3 3
R 1 0 1
1 . D G N D
2 . + 5 V
3 . T R AY _ S E N
C 1 0 1
4 . O P _ S E N
5 . C L _ S E N
6 . M O D E _ S E N
7 . + 5 V
C 1 0 4
R 1 0 2
8 . D G N D
C 11 0
R 1 2 9
C 1 0 9
C 111
J 1 7
C 11 2
C 1 4 2
R 1 0 3
R 2 0 3 L
R 2 0 2 R
R 2 0 4 L
R 2 0 1 R
C 2 1 3 L
C 2 0 9 R
D 2 0 1
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