Samsung SL-C2670FW Service Manual page 3

Table of Contents

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2.2.5.2.
2.2.5.3.
2.2.5.4.
2.2.5.5.
2.2.5.6.
2.2.5.7.
2.2.5.8.
2.2.5.9.
2.2.5.10. Electrical Parts Location ................................................................................. 2 − 36
2.2.6.
Engine F/W Control Algorithm ...................................................................................... 2 − 40
2.2.6.1.
2.2.6.2.
2.2.6.3.
2.2.6.4.
2.2.7.
Software Descriptions .................................................................................................. 2 − 42
2.2.7.1.
2.2.7.2.
2.2.7.3.
3.
Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1.
Precautions when replacing parts ................................................................................................ 3 − 1
3.1.1.
Precautions when assembling and disassembling ............................................................... 3 − 1
3.1.2.
Precautions when handling PBA..................................................................................... 3 − 1
3.1.3.
Releasing Plastic Latches .............................................................................................. 3 − 2
3.2.
Screws used in the printer.......................................................................................................... 3 − 3
3.3.
Replacing the maintenance parts ................................................................................................. 3 − 5
3.3.1.
Toner Cartridge ........................................................................................................... 3 − 5
3.3.2.
Waste Toner Container ................................................................................................. 3 − 6
3.3.3.
ITB Unit .................................................................................................................... 3 − 7
3.3.4.
Fuser Unit .................................................................................................................. 3 − 9
3.3.5.
Pick up_Forward_Reverse roller..................................................................................... 3 − 10
3.4.
Replacing the main SVC parts.................................................................................................... 3 − 11
3.4.1.
Left and Right cover .................................................................................................... 3 − 11
3.4.2.
HVPS board ............................................................................................................... 3 − 12
3.4.3.
Outer Temperature Sensor ............................................................................................. 3 − 12
3.4.4.
Main Board ................................................................................................................ 3 − 13
3.4.5.
SMPS Fan.................................................................................................................. 3 − 13
3.4.6.
SMPS board ............................................................................................................... 3 − 14
3.4.7.
RADF Unit ................................................................................................................ 3 − 14
3.4.8.
OPE Unit ................................................................................................................... 3 − 15
3.4.9.
Platen Unit ................................................................................................................. 3 − 16
Copyright© 1995-2016 SAMSUNG. All rights reserved.
GUI OPE Controller ...................................................................................... 2 − 27
Fax Board .................................................................................................... 2 − 29
Wireless LAN board ...................................................................................... 2 − 29
SMPS board ................................................................................................. 2 − 31
HVPS board ................................................................................................. 2 − 33
ITB EEPROM PBA....................................................................................... 2 − 34
HUB PBA ................................................................................................... 2 − 34
SD-CARD PBA ............................................................................................ 2 − 35
Feeding ....................................................................................................... 2 − 40
Transfer....................................................................................................... 2 − 40
Fusing......................................................................................................... 2 − 41
LSU............................................................................................................ 2 − 41
Software system overview .............................................................................. 2 − 42
Architecture ................................................................................................. 2 − 42
Data and Control Flow ................................................................................... 2 − 43
Contents
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