HP 355 G2 Maintenance And Service Manual page 98

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f.
Speakers (see
g.
System board (see
Remove the heat sink:
1.
Turn the system board upside down with the front toward you.
2.
Disconnect the fan cable (1) from the system board.
3.
Following the 1 through 6 sequence stamped into the heat sink, loosen the six Phillips captive
screws (2) and (3) that secure the heat sink to the system board.
NOTE:
memory will only have the screws in location (2).
4.
Remove the heat sink (4).
NOTE:
the system board components, it may be necessary to move the heat sink from side to side to
detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is included
with the heat sink and system board spare part kits. thermal material is used in the following locations:
Thermal paste is used on the processor (1) and the heat sink section (2) that services it.
88
Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
Speakers on page
System board on page
The heat sink used on computer models equipped with a graphics subsystem with UMA
Due to the adhesive quality of the thermal material located between the heat sink and
76)
79)

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