Diagrams - Sony MZ-E510 Service Manual

MZ-E510
Common note on Printed Wiring Board:
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.
Replacement of IC501, IC601 on main board
*
requires a special tool.
• Lead Layouts
Lead layout of conventional IC
Common note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• % : indicates tolerance.
• C : panel designation.
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
• A : B+ Line.
• Total current is measured with Minidisc installed.
• Power voltage is dc 3V and fed with regulated dc power
supply from external power voltage jack.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PB
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: MD
26
SECTION 6

DIAGRAMS

surface
CSP (chip size package)
• Waveforms
1
IC501 9 (RFO)(TP540)
1.2Vp-p
500mV/DIV, 200ns/DIV
2
IC501 rd (TE)(SL501)
580mVp-p
500mV/DIV, 1ms/DIV
3
IC501 rs (FE)(SL502)
290mVp-p
200mV/DIV, 1ms/DIV
4
IC601 2 (OSCO)
(at the point of R601)
44.3ns
2.3Vp-p
500mV/DIV, 20ns/DIV
5
IC901 yd (CLK)
2.5Vp-p
5.67µs
1V/DIV, 2µs/DIV