Table Of Contents - Sony SRF-H11 Service Manual

SRF-H11

TABLE OF CONTENTS

Specifications ............................................................................ 1
1. SERVICING NOTE
2. GENERAL
Location and Function of Controls ................................. 4
3. DISASSEMBLY
3-1. Belt Removal ........................................................... 5
3-2. Driver (Headphone) (R) Removal ........................... 5
3-3. Driver (Headphone) (L) Removal ........................... 5
3-4. Main Board Removal .............................................. 6
3-5. Audio Board Removal ............................................. 6
4. GEAR (TUNING CAPACITOR)
INSTALLATION
........................................................ 7
5. ELECTRICAL ADJUSTMENTS
6. DIAGRAMS
6-1. Printed Wiring Boards ............................................. 11
6-2. Schematic Diagram ................................................. 12
7. EXPLODED VIEW
.................................................... 14
8. ELECTRICAL PARTS LIST
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
2
................................................... 3
.......................... 8
.................................. 15
• UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.