Sony HT-CT770 Service Manual page 30

Active speaker system
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HT-CT770
Ver. 1.1
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
: Internal component.
f
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen
(Conductor Side)
from the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
Caution:
Pattern face side:
Parts on the pattern face side seen
(SIDE B)
from the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
• HDMI and MAIN boards are multi-layer printed board.
However, the patterns of intermediate layers have not
been included in diagrams.
• Indication of transistor.
C
Q
These are omitted.
B
E
• Abbreviation
AUS
: Australian model
CH
: Chinese model
CND : Canadian model
EA
: Saudi Arabia model
SP
: Singapore model
TW
: Taiwan model
Note: When the complete MAIN board is replaced, refer
to "NOTE OF REPLACING THE IC3001 ON THE
MAIN BOARD AND THE COMPLETE MAIN
BOARD" on page 4.
HT-CT770
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
: Internal component.
f
• 2 : Nonfl ammable resistor.
• 5 : Fusible resistor.
• C : Panel designation.
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
• A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
: AUDIO (ANALOG)
F
J
: AUDIO (DIGITAL)
E
: VIDEO
: Bluetooth
N
• Abbreviation
AUS
: Australian model
CH
: Chinese model
CND : Canadian model
EA
: Saudi Arabia model
SP
: Singapore model
TW
: Taiwan model
Note: When the complete MAIN board is replaced, refer
to "NOTE OF REPLACING THE IC3001 ON THE
MAIN BOARD AND THE COMPLETE MAIN
BOARD" on page 4.
• Circuit Boards Location
RF modulator
(RF1)
HDMI board
IR board
30
30
MAIN board
IO board
NFC module
(NFC1)
KEY board
DISPLAY board
POWER board
bluetooth module
(BT1)

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