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6-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component.
f
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• H : adjustment for repair.
• Voltage and waveforms are dc with respect to ground
under no-signal conditions.
– CD/MP3 Board –
[
] : CD PLAY
– TU Board –
no mark : FM
(
) : AM
– MAIN Board –
no mark : FM
<
> : CD PLAY
– TC Board –
no mark : FM
(
) : PB
<
> : REC
[
] : CD PLAY
– Other Boards –
no mark : FM
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
f
: AM
J
: CD PLAY
• Abbreviation
E41
: AC 230V are in E model.
MX
: Mexican model.
6-4. WAVEFORMS
— CD/MP3 BOARD —
500mV/div 0.5µsec/div
2V/div 0.05µsec/div
1
4
0.85±0.2Vp-p
IC701
4
(RF)
IC701
2V/div 50nsec/div
5
2
100mV/div 200µsec/div
1.8V
Approx. 100mVp-p
IC701
qd
(FE)
IC701
t;
2V/div 50nsec/div
100mV/div 200µsec/div
6
3
1.8V
Approx. 100mVp-p
IC701
qg
(TE)
IC1001
CFD-G550CP
for printed wiring boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
W : indicates side identified with part number.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
C
Q
These are omitted.
B
E
Q
B C E
These are omitted.
Q
B
C
E
— TU BOARD —
0.5V/div 5µsec/div
1
6Vp-p
1.5Vp-p
16.9MHz
75kHz
(XOUT)
rk
IC2
w;
(XOUT)
6Vp-p
— MAIN BOARD —
60nsec
1V/div 0.2µsec/div
1
(FSX/16MIN (I))
4.2Vp-p
5MHz
7Vp-p
IC801
(X2)
ek
60nsec
(CKIN (I))
7
6-5. CIRCUIT BOARDS LOCATION
TRANS board
— TC BOARD —
0.1V/div 5µsec/div
1
4Vp-p
CONTROL 1 board
19.5µsec
Q301
C
(REC)
10V/div 5µsec/div
2
40Vp-p
19.5µsec
T301, HRP301 (YEL)
21
21
POWER board
CONTROL 2 board
VOL board
LCD board
BAT1 board
TC board
H/P board
MAIN board
CFD-G550CP
BAT2 board
CD/MP3 board
TU board
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