Samsung R530 Service Manual page 54

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
6. Material List
Level Code Assembled
......3 3301-001649 B506
......3 3301-001649 B507
......3 3301-001649 B508
......3 3301-001649 B509
......3 3301-001649 B510
......3 3301-001649 B511
......3 3301-001649 B512
......3 3404-001311 SW502
......3 3404-001311 SW503
......3 3701-001515 J508
......3 3701-001597 J515
......3 3708-002166 J512
......3 3708-002402 J513
......3 3708-002582 J518
......3 3710-002498 J505
......3 3710-002634 J504
......3 3710-002830 J509
......3 3711-000556 J507
......3 3711-000922 J516
......3 3711-002046 J501
......3 3711-002049 J510
......3 3711-007011 J503
......3 3711-007097 J506
......3 3722-002588 J520
......3 3722-002588 J521
......3 3722-002767 J519
......3 3722-002865 J511
......3 3722-002925 J502
......3 3722-002997 J500
......3 4309-001022 J522
......3 BA09-00021A U504
......3 BA41-01177A PCB
......3 BA61-01090A M500
......3 BA61-01090A M501
......3 BA68-03588A BIOS REV
......3 BA68-10191W SMT_SN
......3 BA68-40012N MICOM_REV
......3 BA70-00606A EMI1
......3 BA70-00606A EMI2
......3 BA81-07945B SMT1
......3 BA81-07945B SMT10
......3 BA81-07945B SMT2
......3 BA81-07945B SMT5
......3 BA81-07945B SMT6
......3 BA81-07945B SMT7
......3 BA81-07945B SMT8
......3 BA81-07945B SMT9
......3 BA99-07565A SMT SUB MATERIAL
........4 0201-000160 PART ADHESIVE
........4 0201-001002 ABLE BOND
........4 0202-001499 0.6 SMT
........4 0202-001520 SOLDER CREAM
........4 0202-001704 SOLDER CREAM
6-30
EA Description
1 BEAD-SMD 180ohm,1608,TP,226ohm/389MHz
1 BEAD-SMD 180ohm,1608,TP,226ohm/389MHz
1 BEAD-SMD 180ohm,1608,TP,226ohm/389MHz
1 BEAD-SMD 180ohm,1608,TP,226ohm/389MHz
1 BEAD-SMD 180ohm,1608,TP,226ohm/389MHz
1 BEAD-SMD 180ohm,1608,TP,226ohm/389MHz
1 BEAD-SMD 180ohm,1608,TP,226ohm/389MHz
1 SWITCH-TACT 12VDC,50mA,100gf,6.0x6.0x5.0mm,SPST
1 SWITCH-TACT 12VDC,50mA,100gf,6.0x6.0x5.0mm,SPST
1 CONNECTOR-DSUB 15P,3R,FEMALE,ANGLE,AU
1 CONNECTOR-HDMI 19P,2R,FEMALE,ANGLE,Au
1 CONNECTOR-FPC/FFC/ 25P,1.0mm,SMD-A,AU,Y,FLIP,BOTTOM
PIC
1 CONNECTOR-FPC/FFC/ 6P,1.0mm,SMD-A,SnBi,Y,SLIDE,BOTTOM
PIC
1 CONNECTOR-FPC/FFC/ 12P,0.5mm,SMD-A,Au,Y,FLIP,BOTTOM
PIC
1 SOCKET-BOARD TO 30P,2R,1mm,SMD-A,AU,NTR
CABLE
1 SOCKET-INTERFACE 13P,1R,1mm,ANGLE,AU,BLK
1 SOCKET-INTERFACE 7P,1R,2.5mm,ANGLE,AU,BLK
1 HEADER-BOARD TO BOX,12P,1R,1.25mm,SMD-A,SN,WHT
CABLE
1 HEADER-BOARD TO BOX,4P,1R,1.25mm,SMD-A,SN,WHT
CABLE
1 HEADER-BOARD TO BOX,12P,1R,1.25mm,SMD-S,SN,WHT
CABLE
1 CONNECTOR-HEADER BOX,6P,1R,1.25mm,SMD-A,SN,WHT
1 HEADER-BATTERY NOWALL,7P,1R,2.5mm,BATTERY TYPE,AU,BLK
1 HEADER-BATTERY NOWALL,7P,1R,2.5mm,DIP,Au,BLK
1 JACK-PHONE 6P,AU,BLK,ANGLE
1 JACK-PHONE 6P,AU,BLK,ANGLE
1 JACK-USB 4P/1C,AU,BLK,ANGLE,A
1 JACK-MODULAR 8P/8C,STANDARD,N,SMD-A,GRN/YEL,Au,1PORT
1 JACK-USB 4P/2C,AUF,BLK,ANGLE-OFFSET,A,-
1 JACK-DC POWER 3P,5.6PI,AUF,BLK
1 BATTERY-HOLDER CELL,PIN,25.4mm,28.45x19.30x4.98mm,TP,1.1g,1.1g
1 IC MICOM MEC1308-NU,-,128,3.3V,32.768KHz,Romless,16M,8,VTQFP,TRAY,
14mm*14mm*1.0mm,8,0~70,-,0,VTQFP,-
1 PCB MAIN Bremen-UL,FR-4,6L,-,1.1T,w238*L210mm,-,-,-,OSP,GCE,-
1 SUPPORT-MINICARD RIMINI,ALLOY,T1.5,W4.5,L1.5mm,NTR,-,-
1 SUPPORT-MINICARD RIMINI,ALLOY,T1.5,W4.5,L1.5mm,NTR,-,-
1 LABEL-SPI RIMINI,SEC,paper,-,W4.5,L4mm,white,white,SPI,Revsion,-,-,-
1 LABEL-BARCODE Note PC ALL,-,ARTPAPER,-,W6,L40mm,White,-,PCB-TOP/
BOTTOM,Barcode-SMT,-,-,-
1 LABEL-LOCATION NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-,-,-,-
1 GASKET-EMI SANTAFE,BERYLLIUM COPPER,T0.08,BRIGHT TIN,W3.0,-
,L2.0*H4.0mm,HV370-HV410
1 GASKET-EMI SANTAFE,BERYLLIUM COPPER,T0.08,BRIGHT TIN,W3.0,-
,L2.0*H4.0mm,HV370-HV410
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 LEAD-1005 NP,SMT_SHORT,SOLDER-CREAM,0 OHM,-,-,-
1 ASSY SUB/MATERIAL- N/P,SMT SUB/MATERIAL,RIBBON,SOLVENT,BOND,-
NP_SMT
0.001 ADHESIVE-TS D520,NTR
0.001 ADHESIVE-TS 8380,SIL,9000CPS,10cc
1 SOLDER-WIRE FLUX SR34 SUPER LFM-48,-,D0.6,96.5Sn/3Ag/0.5Cu,Flux_3.5%
6 SOLDER-CREAM LFM-48X TM-HP,D25-45um,96.5Sn/3Ag/0.5Cu,Flux 12.0%
6 SOLDER-CREAM NP303-CQS-2-F1,D22-32um,96.5Sn/3Ag/0.5Cu,Flux 11.5%
Spec.
R530/R730
Service