Functional Description; Baseband Overview; Introduction - Panasonic G600 Technical Manual

6

BASEBAND OVERVIEW

6.1

Introduction

All Baseband circuitry is contained on one PCB. The Baseband PCB has six layers made from FR4 material. Top
and bottom layers are gold-plated to prevent oxidization and enable better soldering. The board thickness is 1.0mm
(+0.0, -0.1mm).
The Baseband board is connected to the RF board via a 50 way dual in line connector.
A metallised plastic chassis is used to separate the Baseband and the RF PCB's. The continuous chassis design is
important for EMC purposes. When the chassis is sandwiched between the Baseband and the RF PCB's the
ground plane of the RF board together with the chassis forms an effective shielded enclosure, which prevents
spurious emissions.
6.2

Functional Description

The G600 baseband is based around a 2 chip GSM chipset. One chip carries out signal processing with DSP and
CPU, called GEMINI, and the other chip contains the analogue interface chip, called VEGA. The highly integrated
nature of these components means each contain a large number of functions.
3V to 5V
DC/DC
RAM
256k x 8
VOICE
MEMO
EEPROM
2k *8 serial
POWER KEY
KEYPAD
BACKLIGHT
Figure 1: Baseband Block Diagram
MCUK980101G8
Technical Guide
http://cxema.ru
GEMINI
JTAG
SIM
CONNECTOR
SIM
I/F
DSP ROM
FLASH
1M x 16
DSP RAM
IRQ
MEM
I/F
SERIAL I/F
I/O
VOLTAGE
3V
REGULATOR
GSM
TDMA
TIMER
TPU
VEGA
DSP
CORE
ARM
UART
BATTERY
Section 6
6 - 1
BASEBAND OVERVIEW
TIMING JTAG
I TX
Q TX
I RX
Q RX
PA RAMP
TCVCXO CONTROL
TCVCXO TEMP
10 bit
DAC
HANDS FREE
INTERFACE
600-0601
Issue 1
Revision 0