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National Semiconductor LMX9838DONGLE Hardware User's Manual page 3

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6.0
Design Consideration
6.1
POWER MANAGEMENT
3.3V output single LDO is used to provide power for
RS232 interface chip and Digital portion of the LMX9838.
7.0
Layout
The LMX9838 reference design is split into 2 sections, one
section is RS232 transceiver circuit for PC connection,
another section is LMX9838 main circuit for Host proces-
sor.
8.0
AUDIO CODEC Board
Sedona Lite Board contains an audio codec and two phone
jacks. This board can be used in conjuction with
LMX9838DONGLE to realize the audio (SCO) transmis-
sion and reception capabilities. (See Table 9)
7.1
7.2
Figure 3. LMX9838Dongle
Figure 4. Sedona Lite Audio Codec Board
3
PCB DESIGN
4 layers PCB
1.6 mm overall thickness
LAYERS CLASSIFICATION
Top layer is the components and connection wiring
Layer 2 is Ground plane
Layer 3 is Power plane
Bottom layer is interface signals
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