Usb 2.0 Headers; Usb 3.0 Header; Infrared Module Header; Front Panel Audio Header - ASROCK B75M-DGS R2.0 Manual

USB 2.0 Headers

(9-pin USB4_5)
(see p.2, No. 19)
(9-pin USB6_7)
(see p.2, No. 18)

USB 3.0 Header

(19-pin USB3_2_3)
(see p.2, No. 7)

Infrared Module Header

(5-pin IR1)
(see p.2, No. 25)

Front Panel Audio Header

(9-pin HD_AUDIO1)
(see p.2, No. 22)
1. High Deinition Audio supports Jack Sensing, but the panel wire on the
2. If you use AC'97 audio panel, please install it to the front panel audio
12
GND
PRESENCE#
MIC_RET
1
OUT2_R
MIC2_R
MIC2_L
chassis must support HDA to function correctly. Please follow the
instruction in our manual and chassis manual to install your system.
header as below:
A. Connect Mic_IN (MIC) to MIC2_L.
B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L.
ASRock B75M-DGS R2.0 Motherboard
Besides four default USB 2.0
ports on the I/O panel, there are
two USB 2.0 headers on this
motherboard. Each USB 2.0
header can support two USB 2.0
ports.
Besides two default USB 3.0
ports on the I/O panel, there is
one USB 3.0 header on this
motherboard. This USB 3.0
header can support two USB 3.0
ports.
This header supports an
optional wireless transmitting
and receiving infrared module.
This is an interface for front
panel audio cable that allows
OUT_RET
convenient connection and
control of audio devices.
OUT2_L
J_SENSE