Diagrams - Sony MZ-E501 Service Manual

MZ-E501
Note on Printed Wiring Boards: MAIN SECTION
• X : parts extracted from the component side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main boards is four-layer pritnted board.
However, the patterns of layer 2 and 3 have not been
included in this diagrams.
* Replacement of IC601 used in this set requires a special
tool.
• Lead Layouts
Lead layout of
CSP (chip size package)
conventional IC
Note on Schematic Diagram: MAIN SECTION
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• : internal component.
f
Note: The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
• : B+ Line.
• Power voltage is dc 1.5V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: Audio (Analog)
J
: Audio (Digital)
* Replacement of IC601 used in this set requires a special
tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
16
SECTION 6

DIAGRAMS

r
1
2
surface
3
4
WAVEFORMS
IC501 1 TE
Approx.
12 mVp-p
IC501 ed (RF OUT)
Approx.
1.2 Vp-p
IC501 rs (FE)
Approx.
10 mVp-p
X601 (OSCO)
2.7 V
22.1 ns