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MZ-E501
2-2. PRINTED WIRING BOARD – MAIN SECTION (SIDE A) –
1
2
3
MAIN BOARD
A
B
C
D
E
F
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION LR6)
1PC, 1.5V
G
H
I
4
5
6
(SIDE A)
*
IC 601
CSP (Chip Size Package)
S808
HOLD
IC 501
E
7
8
9
10
S801
S806
GROUP
S803
S804
VOL-
(INFO)
S805
S802
VOL+
Note on Printed Wiring Boards
• X : parts extracted from the component side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
• Main boards is four-layer pritnted board.
However, the patterns of layer 2 and 3 have not been
included in this diagrams.
4
4
11
12
13
E
IC 301
IC 901
1-681-868-
* Replacement of IC601 used in this set requires a special tool.
• Lead Layouts
Lead layout of
conventional IC
14
• Semiconductor
Location
Ref. No. Location
D101
C-13
D201
C-13
D801
G-10
D855
E-13
D902
H-13
D903
G-14
IC301
B-12
IC501
H-5
IC601
C-6
IC901
G-12
Q301
B-11
Q501
H-3
Q901
G-11
Q902
F-11
Q903
F-11
12
(12)
surface
CSP (chip size package)
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