Table of Contents
Advertisement
Doc. Title
2. Device Disassembling and Assembling Procedure
2.1 Tools list
level No. Item
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
Level 2 Memory Card with Diag. test program
5
(need be encoded by HTC)
Level 0 Memory Card with Diag. test program
L 1
6
(need be encoded by HTC)
7 3pin battery holder
8 Universal Leakage Current Tester
9
Power supply
10 Current Meter
11 Mobile tester
12 Special Made Plastic Stick
13 Hand tools
14 Oven for rework purpose
15 Mylar,Assembly jig, for navi and TW,black, Raphael
L 2
Mylar,Assembly jig, for navi and A-cover,black,
16
Raphael
17 Navi board keycap assembly jig
18 Barcode label printer (400dpi resolution and up)
19 Lead-free Soldering station
L 2.5
20 Hot air gun
HTC CONFIDENTIAL
HTC Corporation
.
Raphael Service Manual
Issued Date
2008/7/2
Revised Date
2008/12/01
Page
Vendor
HTC design
HTC design
HTC special tools
HTC special tools
HTC special tools
HTC special tools
76H02974-00M
76H02973-00M
HTC special tools
REV.
A10
18 of 98
P/N
DCT-00050
DCZ-00050
MLT-00006
MLT-00001
RTT-00006
RTT-00007
RTT-00016
SM-TP001-0704
Advertisement
Table of Contents
