Technical Specifications - Intel DZ77GA-70K Specifications

intel® Desktop board DZ77GA-70K

Technical Specifications

proceSSor
processor Support
• Highly Optimized for Intel® -K Processors
• Intel® Core™ i7 processors in the LGA 1155 package
Intel® Turbo Boost Technology 5
• Intel® Hyper-Threading Technology
6
• Integrated Memory Controller with support for up to
32 GB 7 of system memory DDR 3 1600 + O.C. SDRAM
• Intel® Fast Memory Access
• Supports Intel® 64 architecture
8
cHipSeT
intel® Z77 express chipset
• Intel® Z77 PCH
• Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)
• Intel® Smart Response Technology
• Intel® Rapid Start Technology
3
• Four SATA (6.0 Gb/s), four SATA (3.0 Gb/s) ports
and one eSATA (6.0 Gb/s)
uSb porTS
• Four Hi-Speed USB 2.0 ports via back panel, including
two fast charging high current ports (yellow)
• Six additional Hi-Speed USB 2.0 ports via four internal
headers
• Four Super-Speed USB 3.0 ports (blue) and four Super-
-Speed USB 3.0 via internal headers
SySTeM bioS
• 32 Mb Flash EEPROM with Intel® Platform Innovation
Framework for EFI Plug and Play, IDE drive auto-configure
• Advanced configuration and power interface V3.0b, DMI 2.5
FAST booT
• Fast Boot
• Intel® Express BIOS update support: BIOS update
via F7 function key
1 Warning: Altering clock frequency and/or voltage may (i) reduce system stability
and useful life of the system and processor; (ii) cause the processor and other
system components to fail; (iii) cause reductions in system performance; (iv) cause
additional damage; and (v) affect system data integrity. Intel has not tested, and
does not warranty, the operation of the processor beyond its specifications.
2 Responsive performance measurements performed using Intel Core Processor, Intel
Z68 Express Chipset, Intel® Solid-State Drive, and Intel® Rapid Storage Technology
driver. Performance as measured by PCMark Vantage v1.0.1 tests on systems
with Intel DZ68BC motherboard, Intel Core processor, Intel 6 Series chipset,
Microsoft Windows* 7 Ultimate 64-bit, SATA 2 for both SSD and HDD, Hitachi
7200 RPM 320 GB HDD, Intel 20 / 40 / 80 GB Solid-State Drives, Integrated Graphics,
4 GB 1066 MHz DDR 3 DRAM. System performance improvement on platforms
is configuration-dependent; as measured by PCMark* Vantage tests. Boot times
taken with Microsoft Velocity v4.3 and Microsoft PwrTest (included in Microsoft
WDK, for S4 times only).
3 BIOS Update may be required to support Rapid Start Technology features. This
Feature may not be available at initial launch of product.
4 OC Assistant software and BIOS capability for this features may be available shortly
after launch of product.
5 Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost
Technology capability. Intel Turbo Boost Technology performance varies depend-
ing on hardware, software, and overall system configuration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology.
See www.intel.com/technology/turboboost for more information.
HArDWAre MANAGeMeNT FeATureS
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 3.0 b
iNTeL® pro 10/100/1000 NeTWorK coNNecTioN
• Dual Intel® LAN on the back panel
• New low-power design can meet Energy Star* 5.0
specifications
eXpANSioN cApAbiLiTieS
• Two PCI Express* 3.0 × 16 connectors
(configured as × 8/ × 8 in dual graphics mode)
• Two PCI Express 2.0 × 1 slots
• Two PCI slots
AuDio
• 10-channel Intel® High Definition Audio codec
9
• 8-channel via the back panel
• 2-channel via the front panel
• Back panel support for output via optical cable
• One internal header for S/PDIF output for HDMI* support
SySTeM MeMory
Memory capacity
• Four 240-pin DIMM connectors supporting dual-channel
memory. Two double-sided DIMMs per channel
• Maximum system memory up to 32 GB 10 using 8 GB
double-sided DIMMs
Memory Types
• DDR3 1600 + O.C. SDRAM memory support
• Non-ECC Memory
6 Intel® Hyper-Threading Technology requires a computer system with a proces-
sor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and
operating system. Performance will vary depending on the specific hardware and
software you use. For more information including details on which processors
support HT Technology, see www.intel.com/info/hyperthreading.
7 Maximum peak memory bandwidth requires four DDR 3 modules to be populated
in each of the blue memory slots. DDR 3 2400 memory support on this motherboard
requires advanced knowledge of BIOS and memory tuning; individual results may
vary. For specific supported memory for this motherboard, please visit www.intel.
com/products/motherboard/ for more details.
8 64-bit computing on Intel® architecture requires a computer system with a proces-
sor, chipset, BIOS, operating system, device drivers, and applications enabled for
Intel® 64 architecture. Processors will not operate (including 32-bit operation)
without an Intel 64 architecture-enabled BIOS. Performance will vary depending
on your hardware and software configurations. See http://developer.intel.com/
technology/intel64/index.htm for more information.
9 Intel® High Definition Audio requires a system with an appropriate Intel® chipset
and a motherboard with an appropriate codec and the necessary drivers installed.
System sound quality will vary depending on actual implementation, controller,
codec, drivers, and speakers. For more information about Intel® HD Audio, refer
to www.intel.com/design/chipsets/hdaudio.htm.
10 System resources and hardware (such as PCI and PCI Express*) require physical
memory address locations that can reduce available addressable system memory.
This could result in a reduction of as much as 1 GB or more of physical addressable
memory being available to the operating system and applications, depending on the
system configuration and operating system.
Extreme Series
Memory Voltage
• 1.35 V low voltage
• 1.5 V standard JEDEC voltage
• Support for Intel® XMP extended voltage profiles
JuMperS AND FroNT pANeL coNNecTorS
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front panel connectors
• Reset, HD LED, Power LEDs, power on /off
• Four front-panel Hi-Speed USB 2.0 headers
• One front-panel Super-Speed USB 3.0 headers
• Front-panel audio header
• One IEEE 1394a header
MecHANicAL
board Style
• ATX
board Size
• 11.6" × 9.6" (29.46 cm × 24.38 cm)
baseboard power requirements
• ATX 12 V
eNViroNMeNT
operating Temperature
• 0° C to + 55° C
Storage Temperature
• – 20 ° C to + 70 ° C
reGuLATioNS AND SAFeTy STANDArDS
united States and canada
UL 1950, Third edition – CAN/CSA C22.2
No. 950-95 with recognized U.S. and Canadian
component marks
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PROD-
UCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR
OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining ap-
plications. Intel may make changes to specifications and product descriptions at any
time, without notice.
All products, dates, and figures specified are preliminary based on current expecta-
tions, and are subject to change without notice. Availability in different channels
may vary.
Actual Intel® Desktop Board may differ from the image on the box.
*Other names and brands may be claimed as the property of others.
Copyright© 2012 Intel Corporation 03/12/FB/MED/PDF 327273-001US
europe
Nemko certified to EN 60950 International
Nemko certified to IEC 60950 (CB report with
CB certificate)
eMc reGuLATioNS
(tested in representative chassis)
united States
FCC Part 15, Class B
FCC Part 15, Class B open-chassis
(cover off) testing
canada
ICES-003, Class B
europe
EMC directive 89/336/EEC; EN 55022:1998
Class B; EN 55024:1998
Australia/New Zealand
AS/NZS 3548, Class B
Taiwan
CNS 13438, Class B International
CISPR 22:1997, Class B
environmental compliance
Complies with US CRF via EN55022 +6 db in system configura-
tions with an open chassis and EU Directive 89/336/EEC and
use via EN55022 and EN50082-1 in a representative chassis.
Lead-Free: The symbol is used to identify electrical and elec-
tronic assemblies and components in which the lead (Pb) con-
centration level in any of the raw materials and the end product
is not greater than 0.1% by weight (1000 ppm). This symbol is
also used to indicate conformance to lead-free requirements and
definitions adopted under the European Union's Restriction on
Hazardous Substances (RoHS) directive, 2002/95/EC.
For ordering information, visit
www.intel.com
For the most current product information, visit
www.intel.com/go/idb