Table of Contents
Advertisement
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
• Keep the temperature of soldering iron around 270˚C
TABLE OF CONTENTS
·········································································· 4
·································································· 6
···································································· 13
6-1. Circuit Board Location ················································· 23
6-2. Block Diagrams ···························································· 24
6-3. Printed Wiring Board
6-4. Schematic Diagram
6-5. Printed Wiring Board
6-6. Schematic Diagram
····························· 17
······························· 17
BD Section ···························· 26
BD Section ······························· 27
Main Section ························· 28
Main Section (1/3) ··················· 29
6-7. Schematic Diagram
6-8. Schematic Diagram
6-10. Schematic Diagram
6-11. Schematic Diagram
6-12. Printed Wiring Board
6-13. Schematic Diagram
CND model) ································································· 36
CND model) ································································· 37
model) ··········································································· 38
model) ··········································································· 39
6-19. Printed Wiring Board
6-20. Printed Wiring Board
6-21. Schematic Diagram
6-22. Schematic Diagram
6-23. Printed Wiring Board
6-24. Schematic Diagram
6-25. Printed Wiring Board
6-26. Schematic Diagram
6-27. Printed Wiring Board
6-28. Schematic Diagram
6-29. IC Pin Function Description ······································· 50
6-30. IC Block Diagrams ····················································· 56
7-1. Main Section ································································· 60
7-2. Front Panel Section ······················································· 61
7-3. Chassis Section ····························································· 62
7-7. Base Unit Section (BU-30BD60) ································· 66
MODEL IDENTIFICATION
- BACK PANEL -
MODEL
US model
CND model
AEP model
MX model
E51 model
MX
: Mexican model
Main Section (2/3) ··················· 30
Main Section (3/3) ··················· 31
DSP Section ·························· 32
DSP Section (1/2) ··················· 33
DSP Section (2/2) ··················· 34
OPT Section ························ 35
OPT Section ··························· 35
Surround Amp Section ··········· 40
Surround Amp Section ········ 40
Panel Section ······················· 41
Panel Section (1/2) ················· 42
Panel Section (2/2) ················· 43
Leaf SW Section ·················· 44
Leaf SW Section ···················· 45
Driver Section ······················ 46
Driver Section ························ 47
Trans Section ······················· 48
Trans Section ·························· 49
······································· 67
PARTS No.
PARTS No.
4-231-829-0s
4-231-829-1s
4-231-829-2s
4-231-829-5s
4-231-829-6s
3
Advertisement
Table of Contents
