HP Compaq dx2700 Microtower and Small Form Factor Overview page 8

QuickSpecs
System Details
Chassis Chassis Chassis Chassis
Unit Environment and Unit Environment and Unit Environment and Unit Environment and
Operating Conditions Operating Conditions Operating Conditions Operating Conditions
Front Panel Front Panel Front Panel Front Panel
Cooling Solutions Cooling Solutions Cooling Solutions Cooling Solutions
Supported Supported Supported Supported
Slots Supported Slots Supported Slots Supported Slots Supported
Front I/O Front I/O Front I/O Front I/O
Rear I/O Rear I/O Rear I/O Rear I/O
Drive Bays Drive Bays Drive Bays Drive Bays
Physical Security features Physical Security features Physical Security features Security Loop for external pad lock Physical Security features
Power Supply Power Supply Power Supply Power Supply
General Unit Operating Guidelines General Unit Operating Guidelines General Unit Operating Guidelines General Unit Operating Guidelines
Keep the computer away from excessive moisture, direct moisture and the extremes of heat and
cold, to ensure that unit is operated within the specified operating range.
Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required
airflow.
Never restrict airflow into the computer by blocking any vents or air intakes.
Do not stack computers on top of each other or place computers so near each other that they are
subject to each other's re-circulated or preheated air.
Occasionally clean the air vents on the front, back, and any other vented side of the computer.
Lint, dust and other foreign matter can block the vents and limit the airflow.
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must
be provided on the enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Temperature Range Temperature Range Temperature Range
Relative Humidity Relative Humidity Relative Humidity Relative Humidity
Maximum Altitude Maximum Altitude Maximum Altitude Maximum Altitude
(unpressurized)
NOTE: NOTE: NOTE: NOTE: Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above
sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be
limited by the type and number of options installed.
DA - 12661 Worldwide — Version 1 — March 21, 2007
HP Compaq dx2700 Microtower and Small Form Factor HP Compaq dx2700 Microtower and Small Form Factor HP Compaq dx2700 Microtower and Small Form Factor HP Compaq dx2700 Microtower and Small Form Factor
Power button
Power LED
HDD LED
Power Supply Fan (variable speed)
Active heatsink (variable speed)
Chassis fan (variable speed)
3 PCI slots + PCIex1 slot full height for MT
3 PCI slots + PCIex1 slot low profile for SFF
Two (2) USB 2.0 ports, Headset and Microphone
Standard uATX I/O connectors, including Six (6) USB 2.0 ports
Two (2/1) 5-1/4" external – MT/SFF
One (1) 3-1/2" external – MT/SFF
Two (2/1) 3-1/2" internal – MT/SFF
Micro-tower: Micro-tower: Micro-tower: Micro-tower:
Standard 250 watt ATX PFC or non-PFC power supply as default
300W non-PFC power supply as option for India/SEAT/HK
Small Form Factor: Small Form Factor: Small Form Factor: Small Form Factor:
Only 250W PFC or non-PFC power supply selectable
Operating Temperature: 41° to 104° F (5° to 40° C)
Non-operating Temperature: -22° to 140° F( -30° to 60° C)
Operating Humidity 10% to 90% (non condensing at ambient)
Non-operating Humidity 5% to 95% (non condensing at ambient)
Operating: 8,000 ft (2500 m)
Non-operating: 30,000 ft (9000 m)
MT/SFF MT/SFF MT/SFF
MT/SFF
MT/SFF MT/SFF
MT/SFF MT/SFF MT/SFF
Business PC Business PC Business PC Business PC
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