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7
MODULE SPECIFICATION
7.1 Overall System
The notebook system consists of the following PCB assembly and modules.
7.1.1 Board assembly
Processor
Main Board
Inverter Board
TOUCH PAD
SO-DIMM Module
Modem Board
7.2 Processor
Feature:
[CPU Cooling System]
Function:
S62 series Hardware Technical Specification Rev. 1.0 06/04/20
Upgradeable CPU (u-PGA 479)
Main System board
LCD Module Back-light
5 LED Indicators, 2 Touch Pad Button
Memory Expansion
MDC
Intel Yonah processor with on-die L2 cache.
u-PGA 479
For cooling the CPU
Cooling of CPU by heat sink and FAN. FAN is
controlled by a thermal sensor and BIOS/ACPI OS.
ASUSTeK Confidential
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