Asus S62 Series Service Overview
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Asus S62 Series Service Overview

Asus S62 Series Service Overview

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Service Overview
Carefully read through this chapter for a look at various components of
the notebook and necessary cautions and tools before performing any
service and repairs.
T
o provide the best service and support for the ASUS S62 Series, we have provided the
below information for technicians from distributors and resellers to perform the
complete notebook disassembly and assembly. But before performing the procedures,
please be sure to read through the overview in this chapter for component overview,
cautions and tools to avoid any unwarranted damages to the notebook's hardware.
The following chapter includes:
• S62 Series Overview
• Components
• Precautions
• Appropriate Tools
1-1
service overview
1
Chapter

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Summary of Contents for Asus S62 Series

  • Page 1 ASUS S62 Series, we have provided the below information for technicians from distributors and resellers to perform the complete notebook disassembly and assembly.
  • Page 2 S62 Series Overview and Components The ASUS S62 Series Notebook is a product combining the power of Intel® Pentium-M CPU. In this section, an overview for the S62 Series, along with its components, will be presented. S62 Series Overview O V E R V I E W The illustrations below show the notebook’s overview from front view, right side view,...
  • Page 3 service overview USB (2.0) ports Modem port slot PCMCIA LAN port 1394 port VGA Port Optical Drive Device Air vents Kensington Lock DC Power Input Jack Battery Module 1 - 3...
  • Page 4 The illustrations below show the components of the S62 Series. LCD Panel* L C D The illustration below shows the LCD display panel. The S62 Series notebook comes with 15.0” TFT LCD Panel. Inverter Board I N V E R T E R...
  • Page 5 service overview LCD bracket L C D The illustration below shows the LCD brackets. B R A C K E T S Hinge Cover H I N G E C O V E R The illustration below shows the Hinge Cover. LCD Case L C D C A S E...
  • Page 6 service overview Keyboard K E Y B O A R D The illustration below shows the keyboard plate. It can be exchanged with keyboard plates with different language layouts, such as U.S., German, Russian, British, Italian and others. Top Case Module T O P C A S E The illustration below shows the top case of the notebook.
  • Page 7 service overview Optical Drive Device O P T I C A L The illustration below shows the Optical Drive Device D R I V E D E V I C E Hard Disk Drive H D D The illustration below shows the 2.5” industry-standard HDD with 9.5mm height. HDD Bracket H D D B R A C K E T The illustration below shows the HDD Bracket that is placed over the HDD.
  • Page 8 service overview CPU Thermal Module C P U The illustration below shows the thermal module for the CPU. It’s located on the top of T H E R M A L CPU. M O D U L E Memory Module M E M O R Y The illustration below shows the industry-standard 200pin SO-DIMM DDR SDRAM module for the notebook.
  • Page 9 service overview Modem Module M O D E M The illustration below shows the modem module of the notebook. M O D U L E WALN Module W A L N The illustration below shows the WALN module of the notebook. M O D U L E Top Case T O P...
  • Page 10 service overview Service Overview Please pay special attention to the cautions below to prevent any damages to the notebook and also please be sure to select the appropriate tools described in this section to perform any services desired. Precautions C A U T I O N S Before you perform any service and/or repair on the notebook, please follow the steps below first.
  • Page 11 service overview Appropriate Tools T O O L S The illustrations below show the appropriate tools that should be used for the notebook’s service and repair. Phillips-head Screwdriver C R O S S Use a Phillips-head screwdriver to fasten/remove the K- or B-typed screws. S C R E W - D R I V E R Single-Slotted Screwdriver...

  • Page 12: Disassembly Procedure

    Be sure to use proper tools described before. SUS S62 Series Notebook consists of various modules. This chapter describes the procedures for the complete notebook disassembly. In addition, in between procedures, the detailed disassembly procedure of individual modules will be provided for your service needs.
  • Page 13 Disassembly procedure Battery Module B A T T E R Y The illustration below shows how to remove the battery module. B A T T E R Y 1. Unlock and hold the latch No (1). M O D U L E R E M O V A L 2.

  • Page 14: Hdd Module

    Disassembly procedure HDD Module H D D The illustrations below show how to remove the HDD module from the notebook. M O D U L E Removing HDD Module H D D M O D U L E Remove 3 screws (M2.5*4L (K)), then remove the HDD door. R E M O V A L M2.5*4L Lift the HDD module and then remove it.

  • Page 15: Wireless Lan Module

    Memory Module M E M O R Y The S62 Series Notebook does not have RAM onboard. There is one SO-DIMM M O D U L E sockets for installing SO-DIMM RAM. It can upgrade the total memory size up to 1GB .
  • Page 16 Disassembly procedure 2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to an angle of 30°, then pull out the memory module in that angle (No. 3). CPU Module C P U M O D U L E The illustrations below show how to remove the CPU module from the notebook.
  • Page 17 Disassembly procedure Disconnect the Fan cable and remove 2 screws (M2.5*4L (K)) then take away the CPU thermal module. M2.5*4L Turn the non-removable screw here 180 degrees counter-clockwise to loosen the CPU. Unlock Squeeze the vacuum handling pump and use it to lift the CPU away. 2 - 6...
  • Page 18 Disassembly procedure ODD Module O P T I C A L The illustration below shows how to remove the ODD module. D R I V E D E V I C E Remove 1 screw (M2.5*4L (K)). O D D R E M O V A L M2.5*4L Push the ODD Module out by a pair of tweezers.
  • Page 19 Disassembly procedure Keyboard K E Y B O A R D The illustration of below shows how to remove the keyboard. Removing Keyboard K / B R E M O V A L 1. Push the 4 latches in (No.1, No.2, No.3, No.4) with a pair of tweezers or a single-slotted screwdriver and lift the keyboard plate up.
  • Page 20 Disassembly procedure Removing Keyboard Cable C A B L E R E M O V A L 1. Use a flexible connector tool to unlock the cable connector on both ends (no. 1). 2. Carefully pull out the keyboard cable (no. 2) with a pair of tweezers. 3.
  • Page 21 Disassembly procedure 2. Use a pair of tweezers to remove both hinge Cover. 3. Disconnect the LANCH cable and touchpad FFC on the top case. LANCH cable Touchpad FFC 4. Turn over the NB and remove 1 screws (M2*3L (K)). M2*3L 2 - 10...
  • Page 22 Disassembly procedure 5. Disconnect the Coaxial & inverter cable. Coaxial cable Inverter cable 6. Arrange the Coaxial & inverter cable and antenna on the bottom case. 7. Remove 15 screws (M2.5*6L (K)) and 1 screw (M2.5*4L) (K)) on the bottom case. B O T T O M C A S E R E M O V A L...
  • Page 23 Disassembly procedure 8. Before separate the bottom case, remove a little bit bottom case and let the cable and antennas through out of hole. Inverter & camera cable Antenna 9. Separate the bottom case from the top case. 10. Remove 2 screws (M2.5*6L (K)) on both hinge. M2.5*6L 2 - 12...
  • Page 24 Disassembly procedure 11. Separate the LCD module from the Top Case module 12. Remove 2 screws (M2.5*4L (K)) and take away the LANCH board. T O P C A S E R E M O V A L M2.5*4L 13. Remove the LANCH board cable. 2 - 13...
  • Page 25 Disassembly procedure 14. Disconnect the touch pad FFC and remove 1 piece of tape then take away the touch pad FFC. 15. Remove 5 screws (M2.5*4L (K)) and take away the touchpad bracket. M2.5*4L 16. Take away the touchpad. 2 - 14...
  • Page 26 Disassembly procedure Motherboard M O T H E R B O A R D The illustrations below show how to disassemble and remove the Motherboard. Removing Motherboard M O T H E R B O A R D R E M O V A L 1.
  • Page 27 Disassembly procedure 4. Disconnect the Bluetooth & Speaker cables then take away the Motherboard. Bluetooth cable Speaker cable 5. Remove 1 screw (M2*3L (K)) on the IO bracket. M2*3L 6. Use a single-slotted screwdriver to remove 2 screws HEX 5mm then take away the IO bracket.
  • Page 28 Disassembly procedure 7. Remove 1 screw (M2*3L (K)) and take away the TPM board . M2*3L 8. Remove 4 pieces of tapes and disconnect the modem cable. 9. Remove 2 screws (M2*3L (K)) and take away the modem board. M2*3L 2 - 17...
  • Page 29 Disassembly procedure Bottom Case Module B O T T O M The illustrations below show how to remove and disassemble the Bottom case module. C A S E The module contains Bluetooth board, speaker cable. M O D U L E Disassembling Bottom case Module B O T T O M C A S E...
  • Page 30 Disassembly procedure LCD Module L C D M O D U L E The illustrations below show how to remove and disassemble the LCD module. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. L C D M O D U L E Disassembling LCD Module D I S A S S E M B L Y...
  • Page 31 Disassembly procedure Disconnect the LCD cable. 7. Remove 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) and take away the LCD panel. M2.5*4L M2.5*6L 5. Remove 4 screws(M2*3L(K)) on the right LCD bracket to disassemble the LCD bracket. M2*3L 2 - 20...
  • Page 32 Disassembly procedure 6. Remove 4 screws(M2*3L(K)) on the left LCD bracket to disassemble the other LCD bracket. M2*3L 7. Remove 2 pieces of tapes and disconnect the coaxial cable then take it away. 8. Remove 1 screw (M2x 4L). M2*4L 2 - 21...
  • Page 33 Disassembly procedure 9. Lift a little bit the inverter board and disconnect the inverter cable and then take it away. 6. Remove 2 screws (M2x 6L) on both hinge and take them away. M2.5*6L M2.5*6L 2 - 22...
  • Page 34 Disassembly procedure 7. Disconnect the camera cable and remove the microphone. 8. Remove the cable and remove mylar then take away the cable. 9. Take away the Camera module from the LCD back cover. 10. Remove 1 screw (M2x 4L) and remove 3 pieces of tapes then take away the wireless black wire.
  • Page 35 Disassembly procedure 11. Remove 1 screw (M2x 4L) and remove 3 pieces of tapes then take away the wireless white wire. 2 - 24...

  • Page 36: Assembly Procedure

    Assembly procedure Chapter Assembly Procedure Please follow the information provided in this section to perform the complete assembly procedure of the notebook. Be sure to use proper tools described before. fter you have completed the previous chapter of complete disassembly, please follow this chapter to assemble the notebook back together.
  • Page 37 Assembly procedure LCD Module L C D M O D U L E The illustrations below show how to assemble and install the LCD module of the notebook. 1. Install the wireless white wire module and secure 1 screw (M2x 4L) then paste 3 L C D M O D U L E pieces of tapes to secure it.
  • Page 38 Assembly procedure 4. Install the microphone on the LCD cover and connect the camera cable. 5. Lay the inverter cable through the locking trench on the LCD back cover. 6. Lay the inverter cable through the locking trench on the LCD back cover. 3 - 3...
  • Page 39 Assembly procedure 7. Install the both hinge on LCD back cover and secure 2 screws (M2x 6L) to secure them. M2.5*6L M2.5*6L 8. Install the inverter board on LCD back cover and connect the inverter cable. 9. Secure 1 screw (M2x 4L) to secure it. M2*4L 3 - 4...
  • Page 40 Assembly procedure Assembly LCD Module Connect the coaxial cable and paste 2 pieces of tapes to secure it. Install the left LCD bracket and secure 4 screws (M2*3L (K)) to fix it. M2*3L Install the right LCD bracket and 4 screws(M2*3L(K)) and secure 4 screws (M2*3L (K)) to fix it.
  • Page 41 Assembly procedure Install the LCD panel and secure 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) to secure it. M2.5*4L M2.5*6L Connect the LCD cable. Combine the LCD bezel and LCD Cover properly and press on all four edges until them snap into position.
  • Page 42 Assembly procedure Secure74 screws (M2.5 x 6L) on LCD front bezel then paste 7 rubber pads above. M2.5*6L Bottom Case Module B O T T O M The illustrations below show how to assembly the Bottom case module. The module C A S E contains Bluetooth board, speaker cable.
  • Page 43 Assembly procedure 2. Install the Bluetooth board on the bottom case. 3. Connect the Bluetooth cable and lay it through the locking trench on bottom case. Motherboard M O T H E R B O A R D The illustrations below show how to assemble and install the motherboard of the notebook.
  • Page 44 Assembly procedure 2. Connect the modem cable and paste 4 pieces of tape to fix the cable. 3. Install the TPM board and secure 1 screw (M2*3L (K)) to secure it. M2*3L 4. Install the IO bracket and use a single-slotted screwdriver to secure 2 screws HEX 5mm.
  • Page 45 Assembly procedure 5. Secure 1 screw (M2*3L (K)) on the IO bracket to secure it. M2*3L 6. Connect the Bluetooth & Speaker cables, before install the Motherboard to the bottom case. Bluetooth cable Speaker cable 7. Combine the Motherboard and the bottom case. 8.
  • Page 46 Assembly procedure 9. Secure 2 screws (M2.5*4L (K)) to secure the motherboard. Top Case Module T O P C A S E The illustrations below show how to assemble and install the top case module of the notebook. M O D U L E 1.
  • Page 47 Assembly procedure 3. Connect the touch pad FFC and paste 1 piece of tape. 4. Connect the LANCH board cable. 5. Install the LANCH board and secure 2 screws (M2.5*4L (K)). M2.5*4L 3 - 12...
  • Page 48 Assembly procedure 1. Combine the Top case module and LCD module. T O P C A S E M O D U L E A S S E M B L Y 2. Secure 2 screws (M2.5*6L (K)) to fix the hinge. M2.5*6L 1.
  • Page 49 Assembly procedure 2. Before secure the bottom case, let the cable and antennas through in the hole. Inverter & camera cable Antenna 3. Secure 15 screws (M2.5*6L (K)) and 1 screw (M2.5*4L) (K)) to secure the bottom case. M2.5*4L M2.5*6L 4.
  • Page 50 Assembly procedure 5. Connect the Coaxial & inverter cable and lay the cables through the locking trench on bottom case. Coaxial cable Inverter cable 6. Secure 1 screws (M2*3L (K)) to secure cables. M2*3L 7. Turn over the NB and connect the LANCH cable and touchpad FFC on top case. LANCH cable Touchpad FFC 3 - 15...
  • Page 51 Assembly procedure 8. Install the both hinge Cover. H I N G E C O V E R A S S E M A B L Y 9. Install the MIDDLE cover. 3 - 16...
  • Page 52 Assembly procedure Assembling Keyboard K E Y B O A R D The illustrations below show how to assemble and install the Keyboard of the notebook. K E Y B O A R D 1. Place the Keyboard module on front side of the top case. Then connect Keyboard A S S E M B L Y FPC Cable with a pair of tweezers.
  • Page 53 Assembly procedure ODD Module O D D M O D U L E The illustrations below show how to assemble and install the ODD Module of the notebook. Insert the ODD module. O D D M O D U L E I N S T A L L A T I O N Secure 1 screw (M2.5*4L (K)) to secure it.
  • Page 54 Assembly procedure 2. Turn the non-removable screw here 180 degrees clockwise to lock the CPU. Lock 3. Install the CPU thernal module gently and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L 4. Secure 4 screws (M2*3L (K)) by order. M2*3L 5.
  • Page 55 Assembly procedure Assembling Memory Module The illustrations below show how to assemble and install the memory module to the M E M O R Y notebook. M O D U L E 1. Insert the Memory module into the memory socket by an angle of 30 degree, and push down to latch the memory module.
  • Page 56 Assembly procedure Connect the MAIN & AUX antenna and paste 1 piece of tape to secure antennas. HDD Module H D D The illustrations below show how to assemble and install the HDD module of the M O D U L E notebook Secure 4 screws [M3 * 4(L)] to fix HDD into HDD housing.
  • Page 57 Assembly procedure Install the bottom case and secure 3 screws (M2.5*4L(K)) to fix it. M2.5*4L Battery Module B A T T E R Y The illustrations below show how to install battery module of the notebook. M O D U L E 1.
  • Page 58 Follow the individual procedures in this chapter to perform the notebook’s upgrade and replacement of various major components. sus S62 Series Notebook is a 2 spindles product, which means there are less options for you to upgrade to. The key upgradeable and replaceable items include the CPU module, memory module, HDD module, and ODD module.

  • Page 59: Cpu Upgrade

    Upgrade & Replacement CPU Upgrade C P U The S62 Series Notebook comes standard with a Intel® Micro-FCPGA Socket on the motherboard, which means it can support all Intel Micro-FCPGA CPUs up to 2.13 GHz. Upgrading CPU Remove battery module 1.
  • Page 60 Upgrade & Replacement Removing CPU Module C P U Remove 2 screws (M2.5*4L (K)), then remove the CPU door. R E M O V A L M2.5*4L Remove 4 screws (M2*3L (K)) by order. M2*3L Disconnect the Fan cable and remove 2 screws (M2.5*4L (K)) then take away the CPU thermal module.
  • Page 61 Upgrade & Replacement Turn the non-removable screw here 180 degrees counter-clockwise to loosen the CPU. Unlock Squeeze the vacuum handling pump and use it to lift the CPU away. Installing CPU C P U The illustration below shows how to install CPU and the heat sink of the I N S T A L L A T I O N notebook.
  • Page 62 Upgrade & Replacement 3. Install the CPU thermal module gently and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L 4. Secure 4 screws (M2*3L (K)) by order. M2*3L 5. Install the CPU door and secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L Install battery module 1.
  • Page 63 Second Memory Upgrade M E M O R Y The S62 Series Notebook does not have RAM onboard. There are two SO- DIMM sockets for installing SO-DIMM RAM. It can upgrade the total memory size up to 1GB with a 512MB module on each socket.
  • Page 64 Upgrade & Replacement Removing Memory module M E M O R Y R E M O V A L 1. Remove 2 screws (M2.5*4L (K)), then remove the DIMM door. M2.5*4L 2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to an angle of 30°, then pull out the memory module in that angle (No.
  • Page 65 Upgrade & Replacement 2. Install the DIMM door and secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L Install battery module 3. Install the battery module. Slide the battery latch to close the battery lock. B A T T E R Y I N S T A L L A T I O N 4 - 8...
  • Page 66 Upgrade & Replacement HDD Upgrade H D D The S62 Series Notebook uses an industry-standard 2½” HDD with IDE interface. You can replace the HDD to any capacity of your choice within our approval and prior test. Upgrading HDD Remove battery module 1.
  • Page 67 Upgrade & Replacement Removing HDD Module H D D M O D U L E Remove 3 screws (M2.5*4L (K)), then remove the HDD door. R E M O V A L M2.5*4L Lift the HDD module and then remove it. Remove 4 screws [M3 * 4(L)] to separate HDD from HDD housing.
  • Page 68 Upgrade & Replacement Installing new HDD module Secure 4 screws [M3 * 4(L)] to fix HDD into HDD housing. H D D I N S T A L L A T I O N M3*4L Insert the HDD module to connect the FPC connector until it’s installed properly.
  • Page 69 Upgrade & Replacement Wireless LAN Module W I R E L E S S The illustration below shows how to remove the Wireless LAN module. L A N Replacing WLAN Remove battery module W A L N 1. Unlock and hold the latch No (1). R E M O V A L 2.
  • Page 70 Upgrade & Replacement Removing WALN Module Remove 1 piece of tape and disconnect the MAIN & AUX antenna. O D D R E M O V A L And open the two latches to pop the MINI PCI MODULE up then pull it out. Installing new WALN module W A L N M O D U L E...
  • Page 71 Upgrade & Replacement Connect the MAIN & AUX antenna and paste 1 piece of tape to secure antennas. Install battery module Install the battery module. Slide the battery latch to close the battery lock. B A T T E R Y I N S T A L L A T I O N 4 - 14...
  • Page 72 Upgrade & Replacement ODD Replacement O D D The S62 Series Notebook can support DVD-ROM (8x DVD), COMBO (CD-R 24x/ CD-RW 24x / DVD-ROM 8x/ CD 24x), and DVD-Dual (DVD-R/RW: 4x/2x, DVD+R/RW: 4x/2.4x, CD-R/RW: 24x/ 10x, DVD: 8x, CD: 24x).
  • Page 73 Upgrade & Replacement Removing ODD Module Remove 1 screw (M2.5*4L (K)). O D D R E M O V A L M2.5*4L Push the ODD Module out by a pair of tweezers. Installing new ODD module Insert the ODD module. O D D M O D U L E I N S T A L L A T I O N...
  • Page 74 Upgrade & Replacement Secure 1 screw (M2.5*4L (K)) to secure it. M2.5*4L Install battery module Install the battery module. Slide the battery latch to close the battery lock. B A T T E R Y I N S T A L L A T I O N 4 - 17...

  • Page 75: Hardware Specifications

    HARDWARE SPECIFICATION Chapter Hardware Specifications You can enjoy and utilize the S62 series Notebook more effectively with a better comprehension of detailed hardware specifications of the notebook. his chapter lists the detailed specifications of the notebook’s main system and modules.
  • Page 76 HARDWARE SPECIFICATION MARKETING SPEC S62 Specification (Two-Spindle Design) Product Family Dimension 328 x 288x 27-38mm Weight Color Silver-Gray CPU Type Intel Yonah 1M/2M Speed 1.66G,1.83G,2.0G,2.16G Package Micro-PGA 479M Socketable L2 Cache Size On-die cache memory Memory Type DDR II SDRAM without ECC...
  • Page 77 HARDWARE SPECIFICATION North Bridge INTEL 945GM South Bridge INTEL ICH7M Super IO SMSC LPC47N217 Thermal Sensor ADT7461ARMZ Micro-Processor ITE8510E ITE8510E Flash ROM (ISA) Graphic Accelerator Intel 950 internal GPU Controller Intel Internal graphic AGP Support Dual view/Dual App Graphic Memory Share Memory TV Out Support PCMCIA...
  • Page 78 HARDWARE SPECIFICATION Spec Azalia MDC Jack RJ-11 RJ-11 port ACPI V.90 Voice Phone Digital Line Protection Wake On Ring BT-183 Controller Chip antenna Jack RJ-45 RJ-45 port Wake On LAN Controller RealTEK RTL8110SB Internal Keyboard Vendor 88 Keys (W/ MS-Windows function keys) Stroke/Pitch Function Key...
  • Page 79 HARDWARE SPECIFICATION PC Speaker Volume Fn + F11 Volume decrease Number Lock Fn + Ins Scroll Lock Fn + Del Instant Keys Power Saving Power 4 Gear E-mail Direct button Internet Browser Direct button Disable TouchPad Direct button Status Indication 8 LEDs (Machine Base x 8) Power Status Yes (Green on LED when Power on.
  • Page 80 HARDWARE SPECIFICATION Reset/Force Off Yes (Force Off switch) I/O Port All ports support hot-plug Parallel 15-pin D-sub Port Bar port III Mouse/Keyboard IrDA Port Fax/Modem RJ11 LAN Jack RJ45 Line In Mic In Jack Mono Head Phone Jack Stereo out USB port 4 Ports DC-In...
  • Page 81 HARDWARE SPECIFICATION PM On TBD. Power Management AMI BIOS LCD Close/Open LCD Back-light Suspend/Resume Hibernation (S2D) Thermal Control DTS/Thermal diode ACPI DMI 2.0 Support DMI BIOS 2.1 Security Password Password overridden by Master password Security Lock Kensington Lock Hole Infineon TPM 1.2 Option Install OS WinXP...
  • Page 82 HARDWARE SPECIFICATION LAN Port 5- 8...
  • Page 83 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 CHIPSET LIST Chipset Summary Table Function HW ACPI/PC99 Intel Yonah Not required SRAM (L2 Cache) Not required North Bridge Intel 945GM South Bridge Intel ICH7M MEMORY DDR II SDRAM Not required BIOS ROM...
  • Page 84 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.1 CPU Processor Type: Intel Yonah Processor Processor frequency: 1.66 /1.83 /2.0/2.16 GHz Construction method: u-PGA479 with socket Supply voltage: Code:1.25V(High_Frequency_Mode)~0.725V(lowest_Freque ncy_Mode) Function feature: On-die , primary 32-KB instruction cache and 32-KB write- back data cache.

  • Page 85: Dram Memory

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.2 CHIPSET 2.2.1 North Bridge Function: Full support 32bits AGTL+ host bus addressing Supports 400/533/667 DDR2 device Integrates the graphic controller Support Intel Rapid Memory power management DMI x2/x4 Interface connect to ICH...

  • Page 86: Expansion Memory

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.3.2 EXPANSION MEMORY Number of sockets: Two 200 pin SO-DIMM socket Bus: 64-bit data path Supply voltage: 1.8V Functional features: Supports up to 16 simultaneous open pages Hardware features: Supports DDR2 400/533/667 DDR devices...

  • Page 87: I/O Interface Controller

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.6 I/O INTERFACE Controller Function: Full ACPI 1.0 and PC98/99 compliant Support channel options Integrated PC/AT Floppy Disk Controller Support 5.25”/3.5”/2.5” FDD Support 3-mode FDD Integrated Serial Port RS- 232C Controller Integrated Infrared Controller Support IrDA 1.0...

  • Page 88: Keyboard Controller

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.7 PCMCIA Controller Function: PC99, ACPI power management 1.1 Design compliant Integrated PC Card Controller Support 1995 PC Card (PCMCIA 2.2) Integrated Card Bus Controller PC98/99/2001 compliant Single Chip PCI-CardBus/1394 Bridge Compliant with PCI Specification2.2...

  • Page 89: Audio Codec

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.9 AUDIO CODEC Function features: Fully Compliant HD Audio Compliant. 20-bit Stereo Digital to Analog Converters. 18-bit Stereo Analog to Digital Converters. High-quality pseudo-Differential CD input. Meets or exceeds the Microsoft PC99 Audio Performance requirements.
  • Page 90 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Vendor: Realtek Parts Number: RTL8110SB Package: 128-Pin LQFP 2.11.2 MODEM Function features: V.90 and K56 flex support Integrated PnP functionality PC99 compliant Support both APM and ACPI power management Support Wake-on-ring functionality...

  • Page 91: Key Parts List

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 KEY PARTS LIST Key Parts Summary: S62 Project Keyparts List Priority Vendor Model No. ASUS Part No. INT CO667 DC 2.16G T2600 Intel L8VN Intel INT CO667 DC 2.0G T2500 L8VP INT CO667 DC 1.83G T2400...
  • Page 92 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 ASUS MODEM 56K Azalia(Green) 61-BMM011-01 CMOS Camera Module YA HSIN N03P1BG_SM9 04G370030100 CHICONY CMN5622 04G370030000 HGST HTS421260H9AT00 17G013131708 HGST HTS421280H9AT00 17G013132708 HGST HTS421210H9AT00 17G013134701 Fujitsu MHV2060AT PL 17G013131119 Fujitsu MHV-2100AT PL 17G013134114...
  • Page 93 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Delta SADP65KB-BFJ REV:01 04G266003163 SO-DIMM 512MB DDR2 533 UNIFOSA GU33512AGHYQ612L3PC 04G001616673 NANYA NT512T64UH8A1FN-37B 04G001616619 1GB DDR2 533 NANYA NT1GT64U8HA0BN-37B 04G001617633 512MB DDR2 667 Infineon M470T6554CZ3-CE6 04G00161662F Nanya NT512T64UH8A1FN-3C 04G00161661B 1GB DDR2 667...
  • Page 94 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 3.1 Display WXGA Technology: Active color (TFT: Thin Film Transistor) Size: 14.1”W Resolution: WXGA (1280 X 800) Dimension: Pixel Pitch: 0.279mm x 0.279mm Display Colors: 262,144 Vendor: AUO/CMO/Hansstar Technology: Active color (TFT: Thin Film Transistor)
  • Page 95 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Hardware features: Standard I/O addresses: 1F0h to 1F7h and 3F6h Support of minimum IRQ 14 Support of at least 3 DMA channels, if DMA is supported Easily removable and exchangeable for user’s future...
  • Page 96 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 3.5 Touch Pad Dimensions: 65 mm(W) x 49 mm(H) x 2.82 mm(T) Sensor effective areas: 62.5 mm(W) x 46.5 mm(H) Interface: PS/2 X/Y position resolution: 40 points / mm (graphics mode) Customizing: Custom color can be printed on the sensor pad.
  • Page 97 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Chemistry: Li-ion rechargeable battery Voltage: Nominal 11.1V (= 3.7V cell 3pcs in serial, 2pcs in parallel) Capacity: 2400mAH/Cell Vendor: Celxpert Duration: Minimum 4 hour (w/o PMU) Charge Method: Fast Charge: 2.5A, 3.0 hour (while System off)
  • Page 98 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Regulatory: EMI: FCC Class B Safety: CISPR 22 Class B .Dimension: (L) 114.5 x (W) 49.5 x (H) 29 mm ASUSTeK Confidential Page...
  • Page 99 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 SYSTEM 4.1 System diagram ASUSTeK Confidential Page...
  • Page 100 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4.2 Main components block diagrams ASUSTeK Confidential Page...
  • Page 101 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4.3 System resource 4.3.1 IRQ Map IRQ# Description IRQ 0 System Timer IRQ 1 Keyboard IRQ 2 [Cascade] IRQ 3 IrDA IRQ 4 USB Controller IRQ 5 VGA / USB Controller IRQ 6...
  • Page 102 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4.3.3 PCI INT Map Description INTA Giga LAN Chip INTB CARDBUS, 1394, INTC INTD 4.3.4 PCI Bus Master Map Description REQ0 CARDBUS, 1394 REQ1 REQ2 REQ3 None REQ4 None 4.3.5 IDSEL IDSEL...
  • Page 103 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 I/O PORT PIN ASSIGNMENT FUNCTION DESCRIPTION .CRT Display (Analog) KEYBOARD TOUCHPAD&LED BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-In .FAN .INVERTER .MDC .1394 .USB Universal Serial Bus Port Bar 3 USB, CRT, Parallel Port, RJ-45 LAN &...
  • Page 104 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 BLUE Video (analog) Blue this DAC analog output drives the CRT interface. MONITOR ID Bit 2 GROUND Ground RED Return (ground) Ground GREEN Return (ground) Ground BLUE Return (ground) Ground SYNC Return (ground)
  • Page 105 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.2 Hard disk pin assignment Vendor Part No. Pin No. ALLTOP 44 Pin (SMT) C17851-144A1-L No. Signal Description Type IDERST#_5S Reset primary disk Ground PDD7 Primary disk data 7 PDD8 Primary disk data 8...
  • Page 106 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Ground PIORDY_3S Primary disk IO channel ready CSEL Cable select (device configuration) PDDACK#_3S Primary DMA acknowledge Ground IRQ14_3S Primary disk interrupt HIOCS16# Indication to the host PDA1_3S Primary disk address 1 PDIAG#...
  • Page 107 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 13. IDE_PDD4 14. IDE_PDD12 15. IDE_PDD3 16. IDE_PDD13 17. IDE_PDD2 18. IDE_PDD14 19. IDE_PDD1 20. IDE_PDD15 21. IDE_PDD0 22. IDE_PDDREQ 23. GND 24. IDE_PDIOR# 25. IDE_PDIOW# 26. GND 27. IDE_PIORDY 28. IDE_PDDACK# 29.
  • Page 108 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.4 LCD pin assignment Vendor Part No. Pin No. ENTERY 3761-Q30C-01R 30 Pin (SMT) Signal Description Type LVDS_U1N Data channel 1- of Channel A LVDS_L0N Data channel 0+ of Channel B LVDS_U1P...
  • Page 109 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 EDID_CLK EDID Clock PID_0 Panel ID bit 0 EDID_DAT EDID DATA LCD_VCC +3V power supply LCD_VCC +3V power supply ASUSTeK Confidential Page...
  • Page 110 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.5 Internal keyboard pin assignment Vendor Part No. Pin No. ENTERY 6905-E28N-00R 28 Pin (SMT) Signal Description Type KSI1 Keyboard matrix column 1 KSO7 Keyboard matrix row 7 KSI7 Keyboard matrix column 7...
  • Page 111 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 KEYDETECT0 Keyboard ID bit 0 Ground KEYDETECT1 Keyboard ID bit 1 5.6 Internal Touch Pad Pin assignment Vendor Part No. Pin No. ENTERY 6701-20 10 Pin (SMT) Signal Description Type +5VS Power...
  • Page 112 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.7 1 Battery pin assignment Signal Description Type BAT_CON Battery input/output voltage BAT_CON Battery input/output voltage BAT1_CNT1# NVDC control pin 1 BAT1_CNT2# NVDC control pin 2 SMCLK_BAT SMB Bus Clock SMDATA_BAT SMB Bus DATA...
  • Page 113 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 INTSPKR- Internal speaker left sound negative INTSPKL+ Internal speaker signal channel positive INTSPKL- Internal speaker left sound negative 5.9.2 Headphone Jack Vendor Part No. Pin No. SINGATRON 2SJ-A373-001 10 Pin (DIP) Signal...
  • Page 114 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.10 Fan Pin Assignment Vendor Part No. Pin No. ACES 85205-03701 3 Pin (SMT) Signal Description Type +5VS_FAN 5V Power Supply FANSP1 FAN speed signal input Ground 5.11 Inverter pin assignment Vendor Part No.
  • Page 115 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Ground INTMIC_A_GND Audio Ground Ground INVMIC_A Internal MIC 5.12 MDC signal Vendor Part No. Pin No. 1-179397-2 12 Pin (SMT) Signal Description Type Ground None SDOUT DATA OUT None Ground Power +3V...
  • Page 116 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 LTPA0+ Twisted-pair cable A positive 5.14 USB pin assignment Vendor Part No. Pin No. SUYIN 020122MR008S523ZA 8 Pin (DIP) Signal Description Type +5V_USB01 USB 5V power USB_P0- USB port 0 negative signal...
  • Page 117 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 ALLTOP C10089-112A4-Y 12 Pin (DIP) Signal Description Type None None RJ11_RING Modem signal RJ11_TIP Modem signal None None LAN_TXP Transmit data positive signal LAN_TXN Transmit data negative signal LAN_RXP Receive data positive signal...

  • Page 118: Power Management

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 MS_CD MS_DATA3 SD_CMD MS_SCLK MS_VCC SD_DAT3 SD_DAT2 SD_WP SD_CD POWER MANAGEMENT 6.1 System power plane Power Group Power Control Controlled Devices +12V SUSC# Control SUSC# PCMCIA Slot 5V, USB +3.3V SUSC# NB, DDR, PCMCIA Controller, PCMCIA Slot 3.3V, Keyboard Controller +2.5VS...
  • Page 119 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.2 Power management mode 6.2.1 Full-On mode All system devices are not power managed and the system can respond to applications with maximum performance. 6.2.2 Doze mode The CPU clock is slow down but all other devices are full on.
  • Page 120 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 IRQ 1-15 Stand by Stand by Time out Predefined Memory/IO range access Stand by hot key pressed Battery Warning Battery Low Ring Indicator Keystroke Mouse movement Schedule Alarm Suspend Time out Power Button...
  • Page 121 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.3.1 Lid switch Display mode State Lid close Lid open Full on LCD OFF No action Stand by LCD OFF No action STR/STD LCD OFF No action Full on No action No action...
  • Page 122 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Super I/O Power down Power Off Power Off Audio CODEC Power Off Power Off Audio Amplifier Power down Power Off Power Off LCD Backlight Power Off Power Off Power Off Power down...
  • Page 123 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.4.1 Device PM control during Stand By mode Device Power Controlled by Description Hardware Controlled by LDTSTP# PCMCIA Controller Software Enter PCI PM D3Hot state Super I/O Chip Working Keyboard Controller Working...
  • Page 124 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.4.2 Device PM control during STR mode Device Power Down Description Controlled by Super I/O Hardware Power Down Hardware Power Off CD-ROM Hardware Power Off Internal Modem Software Power Off Software Power Down...
  • Page 125 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.4.3 Device PM control during STD mode Device Power Down Description Controlled by Core Logic Hardware Power off (except Resume Well) Super I/O Hardware Power off VGA Chip Hardware Power off Hardware...

  • Page 126: Module Specification

    S62 series Hardware Technical Specification Rev. 1.0 06/04/20 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the following PCB assembly and modules. 7.1.1 Board assembly Processor Upgradeable CPU (u-PGA 479) Main Board Main System board Inverter Board LCD Module Back-light...
  • Page 127 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.3 Main board 7.3.1 Main system module spec Feature: CPU socket, Intel 945GM, Intel ICH7M, Clock generator, SDRAM & its expansion sockets, PC/AT compatible system (RTC, DMA, INT, Timer, … etc) IDE controller with PIO Mode 4 & Ultra-33/66/100, PCMCIA /Cardbus controller &...
  • Page 128 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.3.2 DC/DC module spec Controller: MAX1987, TPS5130, LTC3728, TL494 Input voltage: 8-20V Output voltage/current: Voltage Current Ripple Regulation +5V/+5VS 4.5A 75mV +-3% +3.3V/+3.3VS 4.5A 75mV +-3% +12V/+12VS 150mA 200mV +-5% +3VALWAYS 50mA...
  • Page 129 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Input: Adapter Contain Typ. Charge current (3S3P) Charge current (3S2P) Ripple & Noise 500mV Efficiency 7.4 Inverter Board Inverter spec Input voltage: 12~20V Output current: 6.5mA(max) Start voltage: 1500Vrms(min) Efficiency: 80%(min) Brightness adjusted by input voltage.
  • Page 130 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.5 Adapter spec 7.5.1 Input Input voltage: 90~240VAC, Full range Input frequency: 47~63Hz Input current: 1.5A(max)/100VAC Inrush current: 60A(max)/100VAC, 120A(max)/240VAC Efficiency: 80%(min) 7.5.2 Output 65W power output Output Voltage/Current: 18.05~19.95V/3.42A Ripple: 500mV 7.5.3...
  • Page 131 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.7 LAN Spec Controller: REALTEK RTL8110SB Interface: PCI Compliant to PCI 2.2 Support ACPI , PCI power management Support for Wake-On-LAN during S3,S4 Integrated IEEE 802.3x 10BASE-T and 100 BASE-TX and Giga LAN compatible PHY and...
  • Page 132 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 MISCELLANEOUS 8.1 Indicators Power LED Feature: Show System power status 5ψLED Type: Color: Green Indication: On: System in ON Mode Flash (0.3Hz): System in SUSPEND Mode Off: System in OFF Mode Location:...
  • Page 133 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Indication: On: RF on Off: No ststus Location: On board Hard Disk Drive LED Feature: On: While HDD Read/Write access 5ψLED Type: Color: Green Location: LED Board (in top of System) Caps LOCK LED...
  • Page 134 S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Europe P-CORD 1.8m 250V 2.5A EUR 2-PIN WS-027-T Well shin Austria P-CORD 1.8m 250V 2.5A AUS 2-PIN WS-027-T Well shin South P-CORD 1.8m 125V 7A WS016+WS027 WS-027-T Well shin Asia 8.3 Safety/ EMI Appliance (TBD):...

  • Page 135: Software Specifications

    BIOS SPECIFICATION Chapter Software Specifications Get to know more about the S62 series Notebook with a detailed look at the software specifications. he information contained in the chapter can be quite useful when you are troubleshooting the system’s hardware. Each item has its individual usage for you to...
  • Page 136 Hotkeys implementation and other BIOS features are also included in. S62 series is an IBM PC/AT compatible notebook PC. The system BIOS of S62 series is designed to comply with following specifications: .
  • Page 137 BIOS SPECIFICATION 2. Summary of Hardware Configuration 2.1 KEY COMPONENTS LIST The key components used on S62 series are listed below. Table 2-1 Key components Item Vendor Part’s Name Revision Intel Yonah 1.6G/1.8G/2.0G/2.16G North Bridge Intel Calitoga-945GM South Bridge Intel...
  • Page 138 BIOS SPECIFICATION One IEEE 1394 B Type Jack One PCMCIA One Memory card reader(SD/MMC/MS) Power Supply AC adapter : Output : 19 VDC, 3.42A, 65W, Input : 100~240V AC, 50/60Hz universal Battery Pack : Main : Li-Ion 6 cells, 14.8V, 4800mAh, 65W battery pack Run-down life 5.5hrs Charging time, 2hrs Quick charge 90% (Power off) / 4hrs (Power on)
  • Page 139 BIOS SPECIFICATION USB1 Intel 8086h 27C9h 1043h 1297h USB2 Intel 8086h 27CAh 1043h 1297h USB3 Intel 8086h 27CBh 1043h 1297h USB2.0 Intel 8086h 27CCh 1043h 1297h PCI2PCI Bridge Intel 8086h 2448h 1043h 1297h LPC Bridge Intel 8086h 27B9h 1043h 1297h IDE Controller Intel 8086h 27DFh...
  • Page 140 Crisis Recovery Recover BIOS from a hard disk, a host PC connected to parallel port, or a proprietary debug card of ASUS. BIOS Update Update BIOS at DOS or Windows, or from a proprietary debug card, or from a host PC via parallel port.

  • Page 141: System Security

    CMOS byte as well as setting the new brightness level. In S62 series, there are 16 levels for brightness control. The setting values of these 16 levels are different between AC-powering and DC-powering modes. Table 4.3 shows the brightness level for each stage used by BIOS.

  • Page 142: Resource Allocation

    BIOS SPECIFICATION The configuration index/data I/O ports are 2Eh/2Fh. And only Parallel Port function is enabled by BIOS. The Parallel Port Mode can be adjusted in BIOS SETUP MENU during POST. Table 4.4 shows all modes supported by BIOS. Table 4.4 Parallel Port Mode supported by BIOS Parallel Port Mode SPP/Bi-Directional EPP/SPP...
  • Page 143 SCI of ACPI O.S. 4.6 POWER MANAGEMENT In addition to C1, C2/C2E, C3 and C4/C4E states at system full on state, the S62 series platform must also support suspend states described in next two sections. 4.6.1 ACPI-Enabled Environment...
  • Page 144 Geyserville III technology system can provide the required 1200MHz of performance without waste any additional power. 4.6.4 Battery management S62 series supports Lithium-Ion battery pack and a battery calibration menu items in “Power Menu Group” for users to calibrate a battery. 4.7 THERMAL AND FAN CONTROL The settings of cooling policies are based on the CPU temperature read back from the “Intel Digital...
  • Page 145 BIOS SPECIFICATION THRM Throttle On THRM_ON Threshold THRM Throttle Off THRM_OFF Threshold Fan Failure Temp Point FANERR Fan Stop Threshold STEP Trip Point 1 STEP Trip Point 2 STEP Trip Point 3 STEP Trip Point 4 STEP Trip Point 5 STEP Trip Point 6 STEP Trip Point 7 STEP Trip Point 8...
  • Page 146 BIOS SPECIFICATION 4.8 NUMERIC PAD CONTROL There is a control switch in setup menu item for enabling or disabling numeric pad lock of an internal keyboard. 4.9 TOUCH PAD CONTROL In ACPI environment, BIOS will notify ATK0100 to enable/disable Touch Pad when the Touch Pad Enable/Disable instant key is pressed.
  • Page 147 BIOS SPECIFICATION 5. GPIO Pin Assignment The following tables are the definition of GPIO pins. Some of GPIO pins need to be initialized by system BIOS and some of them need the driver to support. Please check the Description column for reference. Table 5-1.
  • Page 148 BIOS SPECIFICATION N/A GPIO41 N/A GPIO42 N/A GPIO43 N/A GPIO44 N/A GPIO45 N/A GPIO46 N/A GPIO47 GPIO48/GNT4# GNT4# Native Function CPUPWRGD H_PWRGD Processor I/F power well 1. Power field: M -> main power will, R-> resume power well 2. pins in light gray: used as Native Function pins 3.
  • Page 149 BIOS SPECIFICATION Table 5-2. KBC GPIO Definition Port Input Pin Name Output Pin Description Type Pull-up/down Default Value BRIGHT_PWM Used to adjust LCD backlight BAT1_CNT1# High BAT1_CNT1# signal to battery CHG_LED_UP# High When battery is charging, charging LED will be turned on by this pin PWR_LED_UP# High When system is powered on, power LED will...
  • Page 150 BIOS SPECIFICATION FA16 To FLASH I/F FA17 To FLASH I/F FA18 To FLASH I/F THRM_CPU# THRM_CPU# signal from external thermal sensor PMTHERM# PMTHERM# signal to ICH7-M VSUS_ON VSUS_ON signal to power circuit VSUS_GD# VSUS_GD# signal from power circuit IMVPOK# IMVPOK# signal from power circuit PM_PWRBTN# High PM_PWRBTN# signal to ICH7-M...
  • Page 151 BIOS SPECIFICATION Table 5-3. Super I/O GPIO Definition PIN# GPI I/O Type Name Activat Description Level SIOSMI# * : NC -> Not Connected, SI -> Selection ID. 6-17...
  • Page 152 BIOS SPECIFICATION 6. Devices 6.0 CPU The CPU supported by S62 series system is Intel mobile Yonah dual core processor. The supported frequency is from 1.66GHz to 2.16GHz. 6.1 NORTH BRIDGE (CALISTOGA) 6.1.1 DRB Registers (dram row boundary registers) The DRAM Row Boundary Register defines the upper boundary address of each pair of DRAM rows with granularity of 128MB.
  • Page 153 The ICH7-M supports two types of DMA: LPC and PC/PCI. DMA via LPC is similar to ISA DMA. LPC DMA and PC/PCI DMA use the ICH7-M’s DMA Controller. S62 series uses LPC DMA I/F for Parallel Port because LPC LN47N217 Super I/O is used to support those functions.
  • Page 154 Ultra DMA/100 : DMA protocol that redefines signals on the IDE cable to allow both host and target throttling of data and transfer rates of up to 100 MB/s. 6.2.4 Audio S62 series uses the internal High Definition Audio Host Controller of ICH7-M. 6.2.5 USB 2.0 (EHCI) 6.2.5.1 Overview The ICH7-M contains an Enhanced Host Controller Interface(EHCI) compliant host controller which supports up to 8 USB 2.0 specification compliant root ports.
  • Page 155 6.3 – SMBUS CONTROLLER 6.3.1 – Devices on SMBUS On S62 series platform, totally there are 3 devices connected to ICH7-M SMBUS. They are Clock Generator ICS954310, SODIMM0 and SODIMM1. The slave addresses used by each device are listed in Table 6-5.
  • Page 156 BIOS SPECIFICATION 7. CMOS Setup Utility S62 series system BIOS allows users to change some system hardware/function settings during POST (power on self test) stage, users may hit F2 key to enter SETUP mode in POST, the setup feature is categorized into 7 menus described as below: 7.1 MAIN MENU...

  • Page 157: Advanced Menu

    BIOS SPECIFICATION 7.2 ADVANCED MENU: In advanced menu, users can configure I/O device resource such as I/O base, interrupt vector or DMA(Direct Memory Access) channel, some auxiliary settings may be changed as well. Detailed I/O device settings are described below: Core Multi-Processing:[Enable] ->...
  • Page 158 BIOS SPECIFICATION 7.2.1 IDE Configuration: 7.2.1.1 Primary Master/Slave IDE At system boot, the Intel Ultra ATA Storage Driver configures each ATA/ATAPI device to transfer data at particular transfer modes. These transfer modes are defined by ATA standards, and are either Programmed I/O (PIO) or Direct Memory Access (DMA or UltraDMA) type transfers.
  • Page 159 BIOS SPECIFICATION 7.2.2 SuperIO Configuration: Users can enable/disable Parallel port function and set Parallel Port mode in this page. The Parallel Port modes supported by this system are listed below. 1. SPP/Bi-Directional 2. EPP/SPP 3. ECP 4. ECP/EPP 6-25...

  • Page 160: Security Menu

    BIOS SPECIFICATION 7.3 SECURITY MENU: BIOS supports two levels of password for security protection: Supervisor password: Users may set, change or erase system password, the password data is saved in non-volatile device (CMOS), system password check is done during POST(Power On Self Test). The BIOS will prompt a dialog message to ask user for password check when: The system has password stored, and “Password on boot”...

  • Page 161: Power Menu

    BIOS SPECIFICATION 7.4 POWER MENU: LCD Power Saving: LCD exhausts the most part of power while the system is operating. S1A notebook system BIOS support auto backlight saving mode. When the system BIOS detects AC adapter removal, the LCD brightness is tuned down to 80﹪of its original setting, and back to normal when AC adapter is back inserted.
  • Page 162 In this menu users can decide the boot sequence, as long as the device with highest boot priority exists, system BIOS will boot from it, device boot priority is adjusted by pressing “+”,”-“ or space key on the selected (highlighted) item. 3 bootable devices for S62 series system are listed in this menu (BIOS default boot sequence): Removable Device: ←...
  • Page 163 BIOS SPECIFICATION 7.6 EXIT MENU: Exit BIOS setup, users may make final decision if they want to save the change just made, or load BIOS default setting, lists are: Save changes and Exit Discard changes and Exit Discard changes Load optimal Defaults Load manufacture Defaults 6-29...
  • Page 164 BIOS SPECIFICATION 8. BIOS Flash Utility There are two utilities for updating S62 series BIOS. One is DOS mode utility and the other is Windows mode utility. The detailed information is in Table 8-1. Table 8-1: BIOS Flash Utilities Utility Name...

  • Page 165: Instant Keys

    BIOS SPECIFICATION 9. Embedded Controller (EC) 9.1 HOTKEYS S62 series supported Fn+Hotkeys are listed in following table. Table 9-1 Fn+Hotkey Table Legacy ACPI Description Hotkey Function Fn+F1 Standby Hotkey In ACPI OS, user needs to set sleep button behavior to “Standby” in property of Power Option.
  • Page 166 BIOS SPECIFICATION When pressing Internet instant key, BIOS will notify ATK to launch Internet browser application. 9.3.3 Email Key When pressing Email instant key, BIOS will notify ATK to launch email application. 9.3.5 Touch Pad Enable/Disable Key When pressing Touch Pad Enable/Disable instant key, BIOS will notify ATK to enable/disable Touch Pad.

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