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8. Remove the fan/heat sink assembly 6.
✎
Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board
components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly.
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed. Thermal paste is applied to the fan/heat sink assembly to
correspond with components on the system board as follows: capacitors and their contacts 1, the processor and
contact 2, and the graphics subsystem chip and contact 3. Replacement thermal material is included with all
fan/heat sink assembly, system board, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Maintenance and Service Guide
Removal and replacement procedures
4–43
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