Intel BLKDQ965GFEKR Technical Product Specification page 7

4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 87
4.2 BIOS Beep Codes ............................................................................ 87
4.3 BIOS Error Messages ....................................................................... 87
4.4 Port 80h POST Codes ....................................................................... 88
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 93
5.1.1 Safety Regulations................................................................ 93
5.1.2 European Union Declaration of Conformity Statement ................ 94
5.1.3 Product Ecology Statements................................................... 96
5.1.4 EMC Regulations .................................................................. 99
5.1.5 Product Certification Markings (Board Level)............................100
5.2 Battery Disposal Information............................................................101
Figures
1. Major Board Components.................................................................. 14
2. Block Diagram ................................................................................ 16
3. Memory Channel Configuration and DIMM Configuration........................ 21
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 22
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 22
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 23
7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 24
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 24
9. Flex Mode Configuration with Two DIMMs............................................ 25
10. Front/Back Panel Audio Connector Options .......................................... 35
11. LAN Connector LED Locations ............................................................ 37
12. Thermal Sensors and Fan Headers ..................................................... 40
13. Location of the Onboard Power Indicator LEDs ..................................... 47
14. Detailed System Memory Address Map ............................................... 50
15. Back Panel Connectors ..................................................................... 57
16. Component-side Connectors and Headers ........................................... 58
17. Connection Diagram for Front Panel Header ........................................ 64
18. Connection Diagram for Front Panel USB Headers ................................ 66
19. Connection Diagram for IEEE-1394a Header ........................................ 66
20. Location of the Jumper Block............................................................. 67
21. Board Dimensions ........................................................................... 68
22. I/O Shield Dimensions for Boards with IEEE-1394a and
PS/2 Connectors ............................................................................. 70
23. I/O Shield Dimensions for Boards without PS/2 Connectors ................... 71
24. I/O Shield Dimensions for Boards without IEEE-1394a and
PS/2 Connectors ............................................................................. 72
25. Localized High Temperature Zones..................................................... 76
Contents
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