Intel BLKDQ965WCEKR Technical Product Specification

Desktop board
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Intel® Desktop Board
DQ965WC
Technical Product Specification
®
The Intel
Desktop Board DQ965WC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DQ965WC Specification Update.
September 2006
Order Number: D56018-001US

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Summary of Contents for Intel BLKDQ965WCEKR

  • Page 1 Order Number: D56018-001US ® The Intel Desktop Board DQ965WC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DQ965WC Specification Update.
  • Page 2: Revision History

    Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
  • Page 3: Intended Audience

    Preface This Technical Product Specification (TPS) specifies the board layout, components, ® connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DQ965WC. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DQ965WC and its components to the vendors, system integrators, and other engineers and technicians who need this level of information.
  • Page 4 Intel Desktop Board DQ965WC Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#). Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1, 073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
  • Page 5: Table Of Contents

    ® vPro™ Technology Support ............24 1.7 Intel ® Q965 Express Chipset ............. 25 1.7.1 Intel Q965 Graphics Subsystem ..........25 1.7.2 USB ................... 28 1.7.3 Serial ATA Interfaces ............28 1.7.4 Real-Time Clock, CMOS SRAM, and Battery ......29 1.8 Audio Subsystem ................
  • Page 6 Intel Desktop Board DQ965WC Technical Product Specification 2.6 PCI Interrupt Routing Map ..............51 2.7 Connectors and Headers..............52 2.7.1 Back Panel Connectors ............53 2.7.2 Component-side Connectors and Headers ........ 54 2.8 Jumper Block .................. 61 2.9 Mechanical Considerations ..............62 2.9.1...
  • Page 7 Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance..............85 5.1.1 Safety Regulations ............... 85 5.1.2 European Union Declaration of Conformity Statement....86 5.1.3 Product Ecology Statements ..........88 5.1.4 EMC Regulations ..............91 5.1.5 Product Certification Markings (Board Level) ......92 5.2 Battery Disposal Information.............
  • Page 8 Intel Desktop Board DQ965WC Technical Product Specification 10. Wake-up Devices and Events ............39 11. System Memory Map ............... 47 12. DMA Channels................. 47 13. I/O Map ..................48 14. PCI Configuration Space Map ............49 15. Interrupts ..................50 16.
  • Page 9 Product Description What This Chapter Contains 1.1 Overview..................10 1.2 Online Support................15 1.3 Processor ..................15 1.4 System Memory ................16 1.5 Intel Virtualization Technology ............23 ® 1.6 Intel vPro™ Technology Support ............24 ® 1.7 Intel ®...
  • Page 10: Overview

    Interfaces • Two IEEE-1394a interfaces: one back panel connector and one front-panel header • Four Serial ATA interfaces ® LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82566DM Gigabit Ethernet Controller ® BIOS • Intel BIOS (resident in the SPI Flash device) •...
  • Page 11: Product Description

    Expansion One PCI Express x16 bus add-in card connector Capabilities ® Hardware Monitor • Intel Quiet System Technology implemented through the ICH8 Manageability Engine Subsystem • Voltage sense to detect out of range power supply voltages • Thermal sense to detect out of range thermal values •...
  • Page 12: Board Layout

    Intel Desktop Board DQ965WC Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
  • Page 13: Board Components Shown In Figure 1

    IEEE-1394a front panel header Front panel USB headers [2] PCI Express x16 connector Main Power connector Front chassis fan header Intel 82801HO I/O Controller Hub (ICH8DO) BIOS Setup configuration jumper block Chassis intrusion header Front panel header Auxiliary front panel power LED header...
  • Page 14: Block Diagram

    Intel Desktop Board DQ965WC Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Gigabit Ethernet Controller Connector LPC Bus Component System Bus LGA775 (1066/800/533 Processor MHz) Socket Back Panel/Front Panel PCI Express...
  • Page 15: Online Support

    Processor The board is designed to support the following processors: • Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz system bus • Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz system bus •...
  • Page 16: System Memory

    Intel Desktop Board DQ965WC Technical Product Specification System Memory The board has four DIMM sockets and supports the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported.
  • Page 17: Memory Operating Frequencies

    Product Description NOTE Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz.
  • Page 18: Memory Configurations

    Intel Desktop Board DQ965WC Technical Product Specification 1.4.1 Memory Configurations The Intel 82Q965 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal.
  • Page 19: Dual Channel (Interleaved) Mode Configuration With Two Dimms

    Product Description 1.4.1.1 Dual Channel (Interleaved) Mode Configurations Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs. Channel A, DIMM 0 1 GB Channel A, DIMM 1 Channel B, DIMM 0 1 GB Channel B, DIMM 1...
  • Page 20: Dual Channel (Interleaved) Mode Configuration With Four Dimms

    Intel Desktop Board DQ965WC Technical Product Specification Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
  • Page 21: Single Channel (Asymmetric) Mode Configuration With One Dimm

    Product Description 1.4.1.2 Single Channel (Asymmetric) Mode Configurations NOTE Dual channel (Interleaved) mode configurations provide the highest memory throughput. Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated. Channel A, DIMM 0 512 MB Channel A, DIMM 1...
  • Page 22: Flex Mode Configuration With Two Dimms

    Intel Desktop Board DQ965WC Technical Product Specification 1.4.1.3 Flex Mode Configuration NOTE The use of flex mode requires DIMMs to be installed in both channels. Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows: •...
  • Page 23: Intel ® Virtualization Technology (Intel ® Vt)

    Intel Virtualization Technology (Intel VT) offers silicon-level support for core ® virtualization processes and a new, dedicated space in the software stack for an Intel ® Lightweight Virtual Machine Monitor (Intel LVMM) — a software layer that controls and prioritizes each partition’s access to the system hardware.
  • Page 24: Intel ® Vpro™ Technology Support

    INTEGRATOR’S NOTE In addition to the hardware support on the board (the Intel 82801HO ICH8DO and the Intel 82566DM Gigabit Ethernet Controller), Intel vPro technology requires the use of an Intel Core 2 Duo processor and compatible third-party applications.
  • Page 25: Intel ® Q965 Express Chipset

    Q965 Express Chipset ® The Intel Q965 Express chipset consists of the following devices: • Intel 82Q965 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801HO I/O Controller Hub (ICH8DO) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, PCI Express, and the DMI interconnect.
  • Page 26 Intel Desktop Board DQ965WC Technical Product Specification ⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz ⎯ Vertex cache ⎯ Anti-aliased lines ⎯ OpenGL version 1.5 support with vertex buffer and EXT_Shadow extensions • 2D Graphics enhancements ⎯...
  • Page 27: Dvi Port Status Conditions

    NOTE The use of DVMT requires operating system driver support. 1.7.1.3 Configuration Modes A list of supported modes for the Intel GMA 3000 graphics controller is available as a downloadable document. For information about Refer to Supported video modes for the board Section 1.2, page 15...
  • Page 28: Usb

    Intel Desktop Board DQ965WC Technical Product Specification 1.7.2 The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers. The ICH8DO provides the USB controller for all ports. The port arrangement is as follows: •...
  • Page 29: Real-Time Clock, Cmos Sram, And Battery

    Product Description 1.7.3.2 Serial ATA RAID The ICH8DO supports the following RAID (Redundant Array of Independent Drives) levels: • RAID 0 - data striping • RAID 1 - data mirroring • RAID 0+1 (or RAID 10) - data striping and mirroring •...
  • Page 30: Audio Subsystem

    Back panel – Blue Back panel – Green Back panel – Pink 1.8.1 Audio Subsystem Software Audio software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining audio software and drivers Section 1.2, page 15...
  • Page 31: Audio Connectors And Headers

    Product Description 1.8.2 Audio Connectors and Headers The board contains audio connectors and headers on both the back panel and the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors.
  • Page 32: Lan Subsystem

    • PCI Conventional bus power management ⎯ Supports ACPI technology ⎯ Supports LAN wake capabilities ⎯ LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. ® 1.9.1 Intel 82566DM Gigabit Ethernet Controller The Intel 82566DM Gigabit Ethernet Controller supports the following features: •...
  • Page 33: Rj-45 Lan Connector With Integrated Leds

    NOTE Software with AMT capability is required to take advantage of Intel AMT platform management capabilities. The key features of Intel AMT include: •...
  • Page 34: Alert Standard Format (Asf) 2.0 Support

    • System Defense Feature - an Intel AMT feature for stopping the propagation of worms and viruses through the use of programmable packet filters in the integrated LAN controller. The packet filters inspect all incoming and all outgoing packets and determine whether to block or pass the packets as configured.
  • Page 35: 1.10 Hardware Management Subsystem

    Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed 1.10.2 Fan Monitoring Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.11.2.2, page 40...
  • Page 36: Thermal Monitoring

    Intel Desktop Board DQ965WC Technical Product Specification 1.10.4 Thermal Monitoring Figure 12 shows the locations of the thermal sensors and fan headers. Item Description Thermal diode, located on processor die Thermal diode, located on the GMCH die Thermal diode, located on the ICH8DO die...
  • Page 37: 1.11 Power Management

    Product Description 1.11 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯...
  • Page 38: Power States And Targeted System Power

    Intel Desktop Board DQ965WC Technical Product Specification 1.11.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.
  • Page 39: Hardware Support

    Product Description 1.11.1.2 Two-Watt Standby In 2001, the U.S. government issued an executive order requiring a reduction in power for appliances and personal computers. This board meets that requirement by operating at 1.5 W (or less) in S5 (Standby) mode. Two-Watt operation applies only to the S5 state when the computer is turned off, but still connected to AC power.
  • Page 40: Power Connector

    Intel Desktop Board DQ965WC Technical Product Specification • Resume on Ring • Wake from USB • WAKE# signal wake-up support LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line. Resume on Ring enables telephony devices to access the computer when it is in a power-managed state.
  • Page 41: Lan Wake Capabilities

    Product Description 1.11.2.3 LAN Wake Capabilities CAUTION For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.
  • Page 42: Wake From Usb

    Intel Desktop Board DQ965WC Technical Product Specification 1.11.2.6 Wake from USB USB bus activity wakes the computer from ACPI S3 state. NOTE Wake from USB requires the use of a USB peripheral that supports Wake from USB. 1.11.2.7 WAKE# Signal Wake-up Support When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.
  • Page 43: Location Of The Onboard Power Indicator Leds

    Product Description Item Description LED color +5 V standby power indicator LED Green Memory power indicator LED Figure 13. Location of the Onboard Power Indicator LEDs...
  • Page 44: Trusted Platform Module (Tpm)

    Intel Desktop Board DQ965WC Technical Product Specification 1.12 Trusted Platform Module (TPM) The TPM 1.2 component is specifically designed to enhance platform security above- and-beyond the capabilities of today’s software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—...
  • Page 45: Technical Reference

    Technical Reference What This Chapter Contains 2.1 Memory Map................... 45 2.2 DMA Channels................. 47 2.3 Fixed I/O Map ................. 48 2.4 PCI Configuration Space Map ............49 2.5 Interrupts ..................50 2.6 PCI Interrupt Routing Map ..............51 2.7 Connectors and Headers..............52 2.8 Jumper Block ..................
  • Page 46: Detailed System Memory Address Map

    Intel Desktop Board DQ965WC Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 14 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
  • Page 47: Dma Channels

    Technical Reference Table 11 lists the system memory map. Table 11. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K...
  • Page 48: Fixed I/O Map

    Intel Desktop Board DQ965WC Technical Product Specification Fixed I/O Map Table 13. I/O Map Address (hex) Size Description 0000 - 00FF 256 bytes Used by the Desktop Board DQ965WC. Refer to the ICH8DO data sheet for dynamic addressing information. (Note 1)
  • Page 49: Pci Configuration Space Map

    Table 14. PCI Configuration Space Map Device Function Number (hex) Number (hex) Number (hex) Description Memory controller of Intel 82Q965 component (Note 1) PCI Express x16 graphics port Integrated graphics controller Intel High Definition Audio Controller USB UHCI controller 1 USB UHCI controller 2...
  • Page 50: Interrupts

    Intel Desktop Board DQ965WC Technical Product Specification Interrupts The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the Advanced Programmable Interrupt Controller (APIC) portion of the ICH8DO component. The PIC is supported in Windows 98 SE and Windows ME and uses the first 16 interrupts.
  • Page 51: Pci Interrupt Routing Map

    Technical Reference PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices.
  • Page 52: Connectors And Headers

    Intel Desktop Board DQ965WC Technical Product Specification Connectors and Headers CAUTION Only the following connectors have overcurrent protection: Back panel and front panel USB and VGA. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals.
  • Page 53: Back Panel Connectors

    Technical Reference 2.7.1 Back Panel Connectors Figure 15 shows the locations of the back panel connectors. OM18353 Item Description VGA port DVI-D connector (digital output only) USB ports [2] USB ports [2] IEEE-1394a USB ports [2] Audio line in Mic in Audio line out Figure 15.
  • Page 54: Component-Side Connectors And Headers

    Intel Desktop Board DQ965WC Technical Product Specification 2.7.2 Component-side Connectors and Headers Figure 16 shows the locations of the component-side connectors and headers. Figure 16. Component-side Connectors and Headers...
  • Page 55: Component-Side Connectors And Headers Shown In Figure 16

    Technical Reference Table 17 lists the component-side connectors and headers identified in Figure 16. Table 17. Component-side Connectors and Headers Shown in Figure 16 Item/callout from Figure 16 Description IEEE-1394a front panel header Front panel USB header Front panel USB header PCI Express x16 add-in card connector Front chassis fan header Main power connector...
  • Page 56: Serial Ata Connectors

    Intel Desktop Board DQ965WC Technical Product Specification Table 21. Serial ATA Connectors Signal Name Ground Ground Ground Table 22. High Definition Audio Link Header Signal Name Signal Name BCLK Ground 3.3 V/1.5 V I/O SYNC Ground 3.3V_CORE +12 V No connect...
  • Page 57: Processor Core Power Connector

    Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When...
  • Page 58: Connection Diagram For Front Panel Header

    Intel Desktop Board DQ965WC Technical Product Specification 2.7.2.3 Front Panel Header This section describes the functions of the front panel header. Table 26 lists the signal names of the front panel header. Figure 17 is a connection diagram for the front panel header.
  • Page 59: States For A One-Color Power Led

    Technical Reference 2.7.2.3.2 Reset Switch Header Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.7.2.3.3 Power/Sleep LED Header Pins 2 and 4 can be connected to a one- or two-color LED.
  • Page 60: Connection Diagram For Front Panel Usb Headers

    Intel Desktop Board DQ965WC Technical Product Specification 2.7.2.5 Front Panel USB Headers Figure 18 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the front panel USB headers is fused.
  • Page 61: Jumper Block

    Technical Reference Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode.
  • Page 62: Mechanical Considerations

    Intel Desktop Board DQ965WC Technical Product Specification Mechanical Considerations 2.9.1 Form Factor The board is designed to fit into a BTX-form-factor chassis. Figure 21 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 8.0 inches by 10.50 inches [203.20 millimeters by 266.70 millimeters].
  • Page 63: I/O Shield

    I/O shields relative to chassis requirements are described in the BTX specification. NOTE The I/O shield drawing is for reference only. I/O shields compliant with the BTX specification are available from Intel. 172.93 REF [6.808] 13.00 TYP [0.512]...
  • Page 64: 2.10 Electrical Considerations

    Intel Desktop Board DQ965WC Technical Product Specification 2.10 Electrical Considerations 2.10.1 DC Loading Table 31 lists the DC loading characteristics of the board. This data is based on a DC analysis of all active components within the board that impact its power delivery subsystems.
  • Page 65: Power Supply Considerations

    Technical Reference 2.10.4 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.
  • Page 66: 2.11 Thermal Considerations

    Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm...
  • Page 67: Localized High Temperature Zones

    Technical Reference Item Description Intel 82Q965 GMCH Intel 82801HO ICH8DO 1.5 V core and front side bus voltage regulator areas Processor Processor voltage regulator area Figure 23. Localized High Temperature Zones...
  • Page 68: 2.12 Reliability

    Intel Desktop Board DQ965WC Technical Product Specification Table 33 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.
  • Page 69: 2.13 Environmental

    Technical Reference 2.13 Environmental Table 34 lists the environmental specifications for the board. Table 34. Desktop Board DQ965WC Environmental Specifications Parameter Specification Temperature Non-Operating -40 ° C to +70 ° C 0 ° C to +55 ° C Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second²...
  • Page 70 Intel Desktop Board DQ965WC Technical Product Specification...
  • Page 71: Overview Of Bios Features

    3.10 BIOS Security Features ..............78 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support.
  • Page 72: Bios Flash Memory Organization

    Intel Desktop Board DQ965WC Technical Product Specification Table 35 lists the BIOS Setup program menu features. Table 35. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Sets Configures Selects Saves or Clears Displays Configures passwords and...
  • Page 73: System Management Bios (Smbios)

    Overview of BIOS Features System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components.
  • Page 74: Bios Updates

    The Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about The Intel World Wide Web site Section 1.2, page 15...
  • Page 75: Bios Recovery

    For information about Refer to BIOS recovery http://support.intel.com/support/motherboards/desktop Boot Options In the BIOS Setup program, the user can choose to boot from a hard drive, CD-ROM, or the network. The default setting is for the hard drive to be the first boot device.
  • Page 76: Booting Without Attached Devices

    Intel Desktop Board DQ965WC Technical Product Specification 3.8.3 Booting Without Attached Devices For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: •...
  • Page 77: Bios Boot Optimizations

    It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.
  • Page 78: 3.10 Bios Security Features

    Intel Desktop Board DQ965WC Technical Product Specification 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •...
  • Page 79: Error Messages And Beep Codes

    Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker ..................79 4.2 BIOS Beep Codes ................79 4.3 BIOS Error Messages ............... 79 4.4 Port 80h POST Codes ............... 80 4.1 Speaker The board-mounted speaker provides audible error code (beep code) information during POST.
  • Page 80: 4.4 Port 80H Post Codes

    Intel Desktop Board DQ965WC Technical Product Specification 4.4 Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h.
  • Page 81: Port 80H Post Codes

    Error Messages and Beep Codes Table 43. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor Cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory...
  • Page 82 Intel Desktop Board DQ965WC Technical Product Specification Table 43. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS2 only)
  • Page 83 Error Messages and Beep Codes Table 43. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...
  • Page 84: Typical Port 80H Post Sequence

    Intel Desktop Board DQ965WC Technical Product Specification Table 44. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase...
  • Page 85: Regulatory Compliance And Battery Disposal Information

    Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance..............85 5.2 Battery Disposal Information............. 93 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DQ965WC: • Safety regulations • European Union Declaration of Conformity statement •...
  • Page 86: European Union Declaration Of Conformity Statement

    European Union Declaration of Conformity Statement We, Intel Corporation, declare under our sole responsibility that the product Intel ® Desktop Board DQ965WC is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and Council Directive 73/23/EEC (Safety/Low Voltage Directive).
  • Page 87 Regulatory Compliance and Battery Disposal Information Portuguese Este produto cumpre com as normas da Diretiva Européia 89/336/EEC & 73/23/EEC. Español Este producto cumple con las normas del Directivo Europeo 89/336/EEC & 73/23/EEC. Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 89/336/EEC a 73/23/EEC.
  • Page 88: Product Ecology Statements

    请参考 了解此计划的详情,包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der...
  • Page 89 Regulatory Compliance and Battery Disposal Information Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
  • Page 90: Lead-Free Board Markings

    Intel Desktop Board DQ965WC Technical Product Specification Türkçe Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur. Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını...
  • Page 91: Emc Regulations

    Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Desktop Board DQ965WC complies with the EMC regulations stated in Table 47 when correctly installed in a compatible host system. Table 47. EMC Regulations Regulation Title FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B, Radio Frequency Devices.
  • Page 92: Product Certification Markings (Board Level)

    Intel Desktop Board DQ965WC Technical Product Specification Korean Class B statement translation: this is household equipment that is certified to comply with EMC requirements. You may use this equipment in residential environments and other non-residential environments. 5.1.5 Product Certification Markings (Board Level) Desktop Board DQ965WC has the product certification markings shown in Table 48: Table 48.
  • Page 93: Battery Disposal Information

    Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect.
  • Page 94 Intel Desktop Board DQ965WC Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
  • Page 95 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
  • Page 96 Intel Desktop Board DQ965WC Technical Product Specification...

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