Product Description; Overview; Feature Summary - Intel BLKDQ67SW Technical Product Specification

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Product Description

1.1

Overview

1.1.1

Feature Summary

Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Chipset
Memory
Graphics
Audio
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
• Intel ® Core™ i7, Intel ® Core™ i5, Intel
processors in an LGA1155 socket with up to 95 W TDP:
― Integrated graphics processing (processors with Intel
Technology)
― External graphics interface controller
― Integrated memory controller
®
Intel Q67 Express Chipset consisting of the Intel
Hub (PCH)
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Integrated graphics support for processors with Intel
― DVI-I
― DVI-D
― DisplayPort*
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
• Intel ® High Definition Audio:
― Realtek* ALC888S audio codec
― S/PDIF audio header
― DisplayPort Digital Audio
― Front panel audio header
― Mono speaker header
® Core™ i3, and Intel ® Pentium
®
Graphics
®
Q67 Platform Controller
® Graphics Technology:
®
continued
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