Table Of Contents - Intel BLKDH57JG Technical Product Specification

Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
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1.5 Intel H57 Express Chipset ............................................................... 15
1.6 System Memory .............................................................................. 15
1.6.1 Memory Configurations ......................................................... 16
1.7 Graphics Subsystem ........................................................................ 18
1.7.1 Integrated Graphics .............................................................. 18
1.7.2 PCI Express x16 Graphics ...................................................... 19
1.8 USB............................................................................................... 20
1.9 SATA Interfaces .............................................................................. 20
1.10 Legacy I/O Controller ....................................................................... 21
1.10.1 Serial Port ........................................................................... 21
1.11 Audio Subsystem............................................................................. 21
1.11.1 Audio Subsystem Software .................................................... 22
1.11.2 Audio Connectors and Headers ............................................... 22
1.12 LAN Subsystem ............................................................................... 24
1.12.1 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.13 Real-Time Clock Subsystem .............................................................. 26
1.14 Hardware Management Subsystem .................................................... 26
1.14.1 Hardware Monitoring and Fan Control...................................... 26
1.14.2 Fan Monitoring ..................................................................... 27
1.14.3 Chassis Intrusion Detection.................................................... 27
1.14.4 Thermal Monitoring .............................................................. 28
1.15 Power Management ......................................................................... 29
1.15.1 ACPI................................................................................... 29
1.15.2 Hardware Support ................................................................ 32
1.15.3 ENERGY STAR* 5.0, E-Standby, and ErP Compliance ................. 36
2 Technical Reference
2.1 Memory Resources .......................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.1.2 Memory Map........................................................................ 39
2.2 Connectors and Headers................................................................... 39
2.2.1 Back Panel Connectors .......................................................... 40
2.2.2 Component-side Connectors and Headers ................................ 41
2.3 Jumper Block .................................................................................. 50
2.4 Mechanical Considerations ................................................................ 52
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