Intel BLKD945GNTL - LGA775 1066 800FSB 4DDR2 A/V Lan SATA ATX 10Pack Motherboard Technical Product Specification page 7

3.8 Adjusting Boot Speed................................................................................................... 86
3.8.1 Peripheral Selection and Configuration ......................................................... 86
3.8.2 BIOS Boot Optimizations............................................................................... 86
3.9 BIOS Security Features ............................................................................................... 87
4 Error Messages and Beep Codes
4.1 Speaker ....................................................................................................................... 89
4.2 BIOS Beep Codes........................................................................................................ 89
4.3 BIOS Error Messages .................................................................................................. 89
4.4 Port 80h POST Codes ................................................................................................. 90
Figures
1. Board Components ...................................................................................................... 12
2. Block Diagram.............................................................................................................. 14
3. Memory Channel and DIMM Configuration .................................................................. 17
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs .............................. 18
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 18
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 19
7. Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 20
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................ 20
9. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem .... 29
10. 8-channel (7.1) Audio Subsystem Block Diagram........................................................ 30
11. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem .... 31
12. 6-Channel (5.1) Audio Subsystem Block Diagram....................................................... 31
13. LAN Connector LED Locations .................................................................................... 33
14. LAN Connector LED Locations .................................................................................... 34
15. Thermal Sensors and Fan Connectors ........................................................................ 38
16. Location of the Standby Power Indicator LED ............................................................. 44
17. Detailed System Memory Address Map ....................................................................... 48
18. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ................................... 56
19. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ................................... 57
20. Component-side Connectors ....................................................................................... 58
21. Connection Diagram for Front Panel Connector .......................................................... 64
22. Connection Diagram for Front Panel USB Connectors................................................ 66
23. Connection Diagram for IEEE 1394a Connectors........................................................ 66
24. Location of the Jumper Block....................................................................................... 67
25. Board Dimensions........................................................................................................ 68
26. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............ 69
27. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............ 70
28. Processor Heatsink for Omni-directional Airflow.......................................................... 73
29. Localized High Temperature Zones ............................................................................. 74
Tables
1. Feature Summary ........................................................................................................ 10
2. Manufacturing Options ................................................................................................. 11
3. Board Components Shown in Figure 1 ........................................................................ 13
4. Supported Memory Configurations .............................................................................. 16
5. LAN Connector LED States ......................................................................................... 33
Contents
vii