Download Print this page

Murata GRM32ER71A476ME15L Reference Sheet

Chip monolithic ceramic capacitor for general

Advertisement

Quick Links

Chip Monolithic Ceramic Capacitor for General
GRM32ER71A476ME15_ (1210, X7R:EIA, 47uF, DC10V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
  
2.MURATA Part NO. System
(Ex.)
GRM
32
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
3.2±0.3
2.5±0.2
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
Temp. coeff
or Cap. Change
-15 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
L
EMBOSSED W8P4
f330mm Reel
K
EMBOSSED W8P4
Product specifications in this catalog are as of Mar.7,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM32ER71A476ME15-01
E
R7
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
2.5±0.2
0.3 min.
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 125 °C
DC 10 V
(25 °C)
Packaging Unit
1000 pcs./Reel
4000 pcs./Reel
1A
476
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
1.0 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
47 uF
±20 %
1
Reference Sheet
M
E15
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 125 °C
L

Advertisement

loading
Need help?

Need help?

Do you have a question about the GRM32ER71A476ME15L and is the answer not in the manual?

Questions and answers

Summarization of Contents

Capacitor Specifications and Test Methods
Temperature Characteristics of Capacitance
Defines capacitance change relative to temperature and specifies testing conditions.
Adhesive Strength of Termination
Specifies the method for testing the adhesion of the capacitor's terminations.
Environmental and Thermal Stress Tests
Temperature Sudden Change Test
Evaluates capacitor performance after rapid temperature transitions.
High Temperature High Humidity Test
Assesses capacitor reliability under prolonged high temperature and humidity conditions.
Tape Carrier Packaging Details
Minimum Quantity per Reel
Specifies the minimum quantity of capacitors per reel for different tape types and sizes.
Tape Dimensions and Hole Layout
Details the dimensions of tape carrier packaging and the layout of sprocket holes.
Tape Carrier Packaging Dimensions
GRM03/15 Dimensions and Tape Code
Provides chip dimensions and tape codes for GRM03 and GRM15 series.
GRM033/155 Tape Code Details
Details tape carrier specifications for GRM033 and GRM155 series.
GRM18/21/31/32 Tape Carrier Packaging
Paper Tape Specifications for GRM18/21/31
Details chip dimensions and tape specifications for paper tape packaging.
Plastic Tape Specifications for GRM21/31/32
Details chip dimensions and tape specifications for plastic tape packaging.
GRM43/55 Tape Carrier Packaging Dimensions
GRM43 Chip Dimensions and Tape Details
Provides chip dimensions and tape specifications for GRM43 series.
GRM55 Chip Dimensions and Tape Details
Provides chip dimensions and tape specifications for GRM55 series.
Reel and Taping Diagrams
Package Chip and Reel Dimensions
Illustrates package chips and dimensions of carrier reels.
Taping Diagram and Tape Widths
Shows the taping diagram and specifies tape widths for different capacitor series.
Tape Carrier Specifications
Tape Leader and Vacant Section Lengths
Specifies the lengths of leader and vacant sections in the tape carrier.
Tape Break Down Force
Defines the minimum break down force for top and bottom tapes.
Storage and Operation Conditions
Recommended Storage Conditions
Specifies temperature and humidity requirements for storing capacitors.
Corrosive Gas Storage Warning
Warns against storing capacitors in corrosive gas atmospheres.
Measurement and Applied Voltage Guidelines
Capacitance Measurement Considerations
Addresses factors affecting capacitance measurement and AC voltage effects.
Applied Voltage Limits and Overvoltage Effects
Details maximum voltage limits and consequences of overvoltage application.
Voltage Characteristics and Capacitance Aging
DC and AC Voltage Capacitance Characteristics
Explains how capacitance changes with DC and AC applied voltages.
Capacitance Aging Phenomenon
Describes the decrease in capacitance value over time for high dielectric constant capacitors.
Mounting Position and Precautions
Component Mounting Position Guidelines
Recommends optimal positions to minimize stress during PCB flexing or bending.
Information Before Mounting
Provides essential checks and confirmations before proceeding with component mounting.
Pick and Place Machine Maintenance
Nozzle Position and Pressure Adjustment
Guides on adjusting nozzle position and pressure to avoid excessive force on chips.
Nozzle and Claw Maintenance
Emphasizes periodic maintenance of suction nozzles and locating claws.
Reflow Soldering Process Guidelines
Reflow Soldering Temperature and Time
Specifies recommended temperature profiles and time limits for reflow soldering.
Solder Paste Amount and Application
Advises on optimum solder paste amount to prevent chip cracking or detachment.
Flow Soldering Process Guidelines
Flow Soldering Temperature and Time
Details recommended temperature and time for flow soldering applications.
Solder Fillet Height for Flow Soldering
Recommends solder fillet height to prevent board bending stress.
Correction of Soldered Portion Procedures
Soldering Iron Correction Method
Provides guidelines for using a soldering iron to correct soldered portions.
Spot Heater Correction Method
Details using a spot heater for thermal shock reduction during correction.
PCB Handling and Processing Precautions
Electrical Testing PCB Support
Details procedures for positioning and supporting the PCB during electrical testing.
PCB Cropping Methods and Stress
Explains methods to prevent stress on capacitors during PCB separation.
PCB Separation Jig Examples
Hand Separation Jig Examples
Illustrates recommended and not recommended hand separation jigs for PCBs.
Disc Separator Operation and Design
Details disc separator operation, including misalignment and V-groove design.
Router Separator and Assembly Handling
Router Type Separator Operation
Describes router type separators for stress-free board separation.
Assembly Handling Precautions
Covers handling, component mounting, and screw tightening to prevent board bending.
Operation and Other Precautions
Equipment Operation Environment
Specifies suitable operating environments and lists unsuitable conditions.
Emergency Procedures and Disposal
Outlines emergency responses and proper disposal methods for capacitors.
Operating Temperature and Atmosphere Guidelines
Operating Temperature Limits
Defines maximum operating temperature and self-heating considerations.
Atmosphere Surroundings Restrictions
Restricts operation in environments causing corrosion or moisture penetration.
PCB Design for Pattern Forms
Pattern Forms: Prohibited vs. Correct
Illustrates prohibited and correct pattern forms to prevent chip cracking.
Land Dimensions for Soldering
Land Dimensions for Flow Soldering
Provides recommended land dimensions for flow soldering applications.
Land Dimensions for Reflow Soldering
Specifies recommended land dimensions for reflow soldering applications.
Board Design, Adhesive, and Flux Guidelines
Board Design for Strain Reduction
Guides on board design to minimize strain and prevent capacitor damage.
Adhesive Application and Coverage
Details correct adhesive amount, viscosity, and coverage for bonding.
Flux Selection for Soldering
Specifies suitable flux types and halide content for soldering.
Soldering and Washing Procedures
Flow and Reflow Soldering Guidelines
Summarizes key points for flow and reflow soldering to prevent termination leaching.
Washing Procedures and Solvent Selection
Recommends washing procedures and solvent selection to maintain capacitor reliability.
Transportation and System Evaluation
Transportation Conditions
Specifies conditions to protect capacitors from temperature, humidity, and shock during transport.
Actual System Characteristics Evaluation
Emphasizes evaluating performance in the actual system, considering dependencies.