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Chip Monolithic Ceramic Capacitor for General
GRM32ER71H106KA12_ (1210, X7R:EIA, 10uF, DC50V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GRM
32
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
3.2±0.3
2.5±0.2
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
Temp. coeff
or Cap. Change
-15 to 15 %
5.Package
mark
(8) Packaging
f180mm Reel
L
EMBOSSED W8P4
f330mm Reel
K
EMBOSSED W8P4
Product specifications in this catalog are as of Mar.7,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GRM32ER71H106KA12-01
E
R7
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
2.5±0.2
0.3 min.
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
-55 to 125 °C
DC 50 V
(25 °C)
Packaging Unit
1000 pcs./Reel
4000 pcs./Reel
1H
106
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
1.0 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
10 uF
±10 %
1
Reference Sheet
K
A12
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 125 °C
L
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Related Manuals for Murata GRM32ER71H106KA12L
Summarization of Contents
Specifications and Test Methods
Rated Voltage Specification
Details the rated voltage specification and the associated test method.
Appearance Inspection Criteria
Specifies visual inspection criteria for defects and abnormalities.
Dimensional Verification
Confirms that the capacitor dimensions are within the specified limits.
Voltage Proof Test
Details the voltage proof test method and the required specification.
Insulation Resistance (I.R.) Measurement
Specifies minimum insulation resistance values based on capacitance.
Capacitance Measurement Conditions
Specifies the conditions under which capacitance is measured.
Q or Dissipation Factor (D.F.) Requirements
Details Q factor or D.F. requirements and test conditions.
Temperature Characteristics of Capacitance
Explains capacitance change with temperature and the test steps involved.
Adhesive Strength of Termination Test
Specifies criteria for termination adhesion and the associated testing.
Vibration Test Parameters
Details vibration test conditions, specifications, and procedures.
Substrate Bending Test Procedure
Describes substrate bending test procedures and acceptance criteria.
Solderability Test Methods
Defines solderability requirements and the test methods used.
Resistance to Soldering Heat
Specifies resistance to soldering heat and the related testing.
Temperature Sudden Change Test
Outlines sudden temperature change test procedures and acceptance criteria.
High Temperature High Humidity (Steady) Test
Details test conditions for evaluating high temperature and humidity stability.
Durability Test Criteria
Specifies durability test conditions and acceptance criteria.
Tape Carrier Packaging Details
Minimum Quantity per Reel
Lists minimum quantities per reel for various tape types and packaging codes.
Storage and Operation Conditions
Recommended Storage Conditions
Specifies recommended storage conditions for optimal performance and shelf life.
Corrosive Gas Storage Hazard
Warns against storing in corrosive gas atmospheres to prevent poor solderability.
Moisture and Sunlight Effects on Performance
Warns about potential deterioration from moisture condensation and direct sunlight.
Capacitor Rating Considerations
Temperature Dependent Characteristics
Explains how temperature affects capacitor characteristics and provides guidance.
Capacitance Measurement Procedures
Measurement Process and Voltage Confirmation
Emphasizes measuring capacitance using specified voltage/frequency and confirming voltage.
AC Voltage Impact on Capacitance
Notes the impact of AC voltage on high dielectric constant capacitor values.
Applied Voltage Guidelines
Voltage Limits and Over-Voltage Risks
Prohibits exceeding rated voltage and explains risks of over-voltage.
Applied Voltage and Self-heating
Operating Conditions for AC/Pulse Voltage and Self-heating
Advises confirming operating conditions to avoid excessive current and self-heating.
Voltage-Capacitance Characteristics
Capacitance Variation with DC Voltage
States that capacitance varies with applied DC voltage.
Capacitance Variation with AC Voltage
Notes that AC voltage affects high dielectric constant capacitor values.
Capacitance Aging Effects
Capacitance Decrease Over Time
Explains capacitance decrease over time for high dielectric constant capacitors.
Vibration and Shock Considerations
Handling Vibration and Shock
Advises confirming vibration and shock conditions to ensure safe operation.
Impact of Dropping on Capacitors
Warns that dropping may cause damage or cracks in the dielectric material.
Soldering and Mounting Guidelines
Mounting Position and Stress Minimization
Recommends optimal mounting position and direction to minimize stress.
Pre-mounting Checks and Considerations
Lists essential checks and considerations before mounting components.
Pick and Place Machine Maintenance
Preventing Excessive Forces During Mounting
Instructs to prevent excessive forces during mounting to avoid capacitor damage.
Reflow Soldering Process
Heat Impact on Component Strength and Solderability
Explains heat impact on component strength and solderability, recommends preheating.
Temperature Difference During Solvent Immersion
Advises maintaining temperature difference when immersing components in solvent.
Optimum Solder Amount for Reflow
Discusses the impact of solder paste thickness on chip reliability.
Flow Soldering Process
Flow Soldering Restrictions and Precautions
Restricts flow soldering to specified types and warns about heat and time effects.
Temperature Difference During Solvent Immersion
Advises maintaining temperature difference when immersing components in solvent.
Optimum Solder Amount for Flow Soldering
Discusses solder fillet height relative to component thickness to prevent cracking.
Correction of Soldered Portion
Rework Using Soldering Iron and Spot Heater
Guidelines for rework using soldering iron and spot heater, including preheating and speed.
Optimum Solder Amount for Rework
Advises on correct solder amounts for rework to ensure adhesion and prevent cracking.
PCB Cleaning and Testing
Precautions for PCB Cleaning Process
Warns against excessive ultrasonic oscillation and recommends proper cleaning.
Test Procedures and Stress Avoidance
Emphasizes correct test setup and avoiding stress on PCBs during testing.
Stress Avoidance During PCB Cropping
Warns against applying stress to mounted capacitors and recommends checking cropping methods.
PCB Separation Methods
Jigs for Single-Side Mounting
Shows an example jig for single-side mounting to minimize stress.
Measures for Double-Sided Mounting
Provides measures for double-sided mounting to prevent stress on components.
Disc Separator Operation and Cracking Causes
Explains disc separator operation and potential causes of capacitor cracking.
Assembly and Handling Precautions
Router Type Separator Operation
Describes router type separator operation for stress-free board separation.
Capacitor Handling During Assembly
Advises on proper handling of boards with mounted capacitors and component attachment.
Component Insertion and Screw Tightening
Gives advice on inserting components and tightening screws to avoid board bending.
Operational and Emergency Procedures
Operational Environmental Restrictions
Lists environmental and operational restrictions during equipment use.
Emergency Response and Waste Disposal
Provides emergency procedures and proper disposal methods for used capacitors.
Circuit Design and General Remarks
Offers advice on circuit design and general remarks.
Rating and Environmental Factors
Operating Temperature and Atmosphere
Discusses operating temperature limits and environmental restrictions.
Piezo-electric Phenomenon Effects
Explains piezo-electric effects and potential noise generation in capacitors.
Soldering and Mounting Best Practices
PCB Design for Stress Prevention
Provides guidance on PCB pattern design to prevent chip cracking.
Prohibited and Correct Pattern Forms
Illustrates prohibited and correct pattern forms for mounting components.
Land Dimensions for Soldering
Land Dimensions for Flow Soldering
Provides land dimensions for flow soldering according to chip size.
Land Dimensions for Reflow Soldering
Provides land dimensions for reflow soldering according to chip size.
Board Design and Adhesive Application
Strain Impact of Board Design Factors
Explains how board design factors influence strain and potential cracking.
Adhesive Requirements for Chip Mounting
Emphasizes adhesive amount, viscosity, and coverage for secure mounting.
Adhesive Curing and Flux Usage
Highlights issues from insufficient curing and advises on flux application.
Soldering Process Best Practices
Flow Soldering Temperature and Time Limits
Specifies temperature and time limits for flow soldering to prevent termination leaching.
Reflow Soldering and Washing Precautions
Warns about solder paste effects and recommends proper cleaning methods.
Coating Resin Selection Guidelines
Discusses resin selection for coating to prevent cracks and moisture absorption.
Transportation and System Evaluation
Transportation Environmental Protection
Outlines requirements for protecting capacitors during transportation.
Actual System Performance Evaluation
Stresses the importance of evaluating capacitors in the actual system for performance confirmation.
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