HP 2000fc Replacement Instructions
Family modular smart array chassis and midplane replacement instructions
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Also See for 2000fc:
- Reference manual (330 pages) ,
- Cli reference manual (282 pages) ,
- User manual (150 pages)
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HP StorageWorks
2000 Family Modular Smart
Array
chassis and midplane
replacement instructions
Printed on at least 50% total recycled fiber with at least 10%
post-consumer paper
© Copyright 2008 Hewlett-Packard Development Company, L.P.
First edition: March 2008
Product names mentioned herein may be trademarks of their
respective companies as reflected by an associated footnote. The
information in this document is subject to change without notice.
Printed in the US.
www.hp.com
481596-001
About this document
The chassis field replacement unit (FRU) replaces a chassis that has
been damaged or whose midplane has been damaged. To make a
fully functional chassis, you must install the following components
from the replaced chassis:
•
Drive modules and air management modules
•
Two power-and-cooling modules
•
One or two controller modules (for a controller enclosure)
•
One or two I/O modules (for a drive enclosure)
This document details procedures for removing drive modules/air
management modules, power-and cooling-modules, controller
modules, and I/O modules from the failed chassis and installing
them into the replacement chassis of an HP StorageWorks 2000
Family Modular Smart Array.
NOTE:
Make sure you obtain the latest version of these
instructions from http://www.hp.com/go/msa. Select MSA SAN
Arrays, select your product, and go to Support.
Before you begin
•
Turn the power-and-cooling supply modules off and disconnect
the power cables.
•
Disconnect and label all cables.
CAUTION:
Parts can be damaged by electrostatic discharge.
Use proper anti-static protection:
•
Keep the replacement component in the ESD bag until needed.
•
Wear an ESD wrist strap grounded to an unpainted surface of
the chassis.
•
If an ESD wrist strap is unavailable, touch an unpainted surface
of the chassis before handling the component.
•
Never touch connector pins.
Removing drive modules
NOTE:
Air management modules are removed and installed
using the same procedure as removing and installing drive modules.
Page 1
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Summary of Contents for HP 2000fc
-
Page 1: Before You Begin
Printed on at least 50% total recycled fiber with at least 10% • Never touch connector pins. post-consumer paper © Copyright 2008 Hewlett-Packard Development Company, L.P. Removing drive modules First edition: March 2008 Product names mentioned herein may be trademarks of their... - Page 2 Removing power-and-cooling modules Press and slide the release latch button to the right to disengage the latch. Turn the thumbscrew (1) until it is disengaged from the power-and-cooling module. Rotate the latch (2) downward to disconnect the power module from the internal connector, and slide it out from the slot (3). Release latch button Thumbscrew Latch...
- Page 3 Removing I/O modules Press both latches downward to disconnect the module from the midplane. Turn the thumbscrews (2) until the screws disengage from the I/O module. Pull outward on the latches to slide the module out of the enclosure. Latch Thumbscrew Press both latches downward to disconnect the I/O module from the midplane.
-
Page 4: Additional Information
Installing I/O modules Loosen the controller’s thumbscrews; press the latches downward. Slide the I/O module into the enclosure as far as it will go (1). Press the latches upward to engage the I/O module (2); turn the thumbscrews finger-tight. Verifying component installation •...