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Family: Profiler
Software Version 7.31/7.35
P-16+ / P-6
User's Guide
KLA-TENCOR CONFIDENTIAL
Product Line: Profiler P1X / PX
MNL, USER
One Technology Drive., Milpitas, CA 95035
Phone: (408) 875-3000 FAX: (408) 571-2722
Model: P-16+ / P-6
PN- 0142530-000 AB

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Summarization of Contents

Chapter 1 Introduction & Safety
INSTRUMENT OVERVIEW
Provides a summary of the P-16+/P-6 Profiler system's capabilities and head configurations.
SAFETY
Outlines critical safety information, including warnings, cautions, and lockout/tagout procedures.
Chapter 2 Basic Skills
OVERVIEW
Introduces fundamental skills for operating the P-16+/P-6 Profiler, including system startup and application usage.
ERGONOMIC CONSIDERATIONS
Details best practices for ergonomic setup and keyboard usage to ensure user safety and comfort.
POWERING UP THE PROFILER
Explains the step-by-step procedure for turning on the computer and launching the Profiler software.
LOGGING INTO PROFILER SECURITY
Guides users through the process of logging into the Profiler system security using valid credentials.
STARTING THE PROFILER APPLICATION
Describes how to launch the Profiler application, which serves as the interface for scan operations.
Chapter 3 Scan Recipes
INTRODUCTION
Explains the role of recipes in setting scan parameters and enabling high-resolution 2D and 3D scans.
ACCESSING THE SCAN RECIPE CATALOG SCREEN
Details how to navigate and access the primary screen for managing scan recipes.
CREATING AND EDITING A SCAN RECIPE
Provides instructions on accessing the Recipe Editor for creating and modifying scan recipes.
Chapter 4 XY VIEW SCREEN
INTRODUCTION
Introduces the XY View screen, its purpose for sample viewing, positioning, and scan setup.
STARTING THE XY VIEW APPLICATION
Guides users on how to launch the XY View application from the Catalog screen.
SETTING THE MAGNIFICATION
Explains how to adjust the optical zoom function for feature identification and scan placement.
POSITIONING THE SCAN SITE
Covers moving the stage in X, Y, and theta directions for accurate scan positioning.
USING DIE GRID NAVIGATION (OPTIONAL FEATURE, P-16+ ONLY)
Describes how to use die grid navigation for teaching scan and sequence sites by die location.
Chapter 5 View Scan Window
2D SCREEN FUNCTION
Explains the View Scan Window's role in observing scan progress and adjusting parameters for 2D scans.
3D SCREEN FUNCTION
Details the 3D View Scan screen's functionality for 3D analysis and operator monitoring.
Chapter 6 Sequence Recipe and Data
INTRODUCTION
Introduces the Sequence Recipe and Data applications, their capabilities, and components.
STARTING THE SEQUENCE EDITOR APPLICATION
Guides users on how to access and open the Sequence Editor.
CREATING A SEQUENCE RECIPE
Provides a step-by-step procedure for creating a sequence recipe, including die grid navigation.
Chapter 7 Analyzing 3D Scan Data
INTRODUCTION
Explains that 3D scan data analysis displays the 3D scan image and trace information after a scan.
STARTING THE 3D ANALYSIS APPLICATION
Guides users on how to open the Catalog window and select 3D scan data for analysis.
3D ANALYSIS SCREEN FEATURES
Describes the features of the 3D Analysis screen, including image orientation and toolbars.
CUSTOMIZING THE SCAN IMAGE
Explains how to adjust image proportions, shading mode, and scan height colors for better visualization.
CUSTOMIZING THE VIEW
Details how to change image colors, scan height colors, and remove banding using line leveling.
USING IMAGE ARITHMETIC TO COMPARE DATA
Explains how to compare two 3D scans using image arithmetic to evaluate noise and roughness.
SAVING SCAN DATA
Provides instructions on how to save scan data for later review and reanalysis with different parameters.
Creating and Saving 2D Slice Data from a 3D Scan
Guides users on how to create and save 2D slice data from a 3D scan using the Analysis screen tools.
Chapter 8 APEX 2D/3D - GETTING STARTED
INTRODUCTION
Provides information about configuring Apex 2D/3D software to work with the Profiler system.
LICENCE AGREEMENT
Outlines the copyright laws, intellectual property rights, and licensing terms for the software product.
OVERVIEW OF APEX 2D/3D
Introduces the Apex 2D/3D software, its capabilities, and how to start the application.
Starting the Software
Explains how to start the Apex 2D/3D software by clicking the desktop shortcut or Start Menu.
Chapter 9 STRESS (OPTIONAL FEATURE)
Introduction
Explains how stress is generated in films and wafers, and the importance of monitoring film stress data.
THEORY
Discusses the theoretical basis of stress measurement, including the Stoney Equation.
Stoney Equation
Presents the Stoney equation for stress calculation in thin-film layers deposited on a substrate.
Polynomial Fit
Explains the Polynomial Fit method for fitting data to local irregularities and calculating stress.
Least Square Fit
Details the Least Square Fit method for fitting local sections of data to circular arcs for curvature calculation.
Chapter 10 3D STRESS (OPTIONAL FEATURE, P-16+ ONLY)
Introduction
Explains 3D stress analysis capabilities for full wafer stress measurements using Apex software.
Definitions
Defines common terms referenced in the 3D Stress chapter, providing clarity on terminology.
The 3D Stress Application Window
Describes the 3D Stress Catalog window and its navigation buttons for accessing recipes and data.
Creating a 3D Stress Recipe
Guides users on creating new 3D stress recipes using the Stress Catalog window and editor.
Chapter 11 SYSTEM SECURITY
INTRODUCTION
Explains the Profiler system security design for user membership and access control.
KLA-Tencor Operating System Security
Details how the Profiler software integrates with Windows XP security for user and feature control.
LOGIN AND LOGOUT PROCEDURE
Describes how to change access levels by logging off and logging back into the Profiler software.
CONFIGURING KLA-TENCOR SECURITY
Explains how to define security settings using the Security Configuration Editor for access control.
PROCEDURE TO MODIFY SECURITY SETTINGS
Provides steps to navigate and modify security settings within the Security Configuration Editor.
ACCESS POLICY SETTINGS
Details how Access Policy Settings control user access to Windows XP functions and features.
APPLICATION LIFECYCLE
Allows users to define programs that automatically start with Windows XP logon for system convenience.
GLOBAL SETTINGS
Explains how to enable or disable automatic logon into Windows XP for system security and ease of use.
SECURITY GROUPS
Describes the default Windows XP and Profiler software security groups for user access control.
COMPUTER MANAGEMENT/USER ACCOUNTS
Explains the Windows XP security interface for managing user accounts and creating new ones.
Chapter 12 CALIBRATIONS
STANDARD CALIBRATION MATRIX
Outlines the interconnected calibrations and their prerequisites for system accuracy.
APPLIED FORCE CALIBRATION
Details the procedure for calibrating the force applied by the stylus tip to the sample surface.
VIDEO CALIBRATION
Ensures stage position correlates to the video image, calculating video pixels per micron.
SCAN POSITION OFFSET CALIBRATION
Calculates X-, Y-axis offsets for accurate positioning of the sample stage relative to optics and stylus.
STEP HEIGHT CALIBRATION
Describes the automated procedure for calibrating step height for each range using standards.
P-16 SERIES LEVEL CALIBRATIONS
Explains the Tilt and Level calibrations required for parallel stage motion and accurate scans.
Level Calibration Procedure
Provides the automated procedure for performing the Level calibration to ensure stage surface flatness.
WAFER CENTER CALIBRATION
Calibrates the wafer center as the (0,0) reference point for accurate sequence transportability.
Chapter 13 STYLUS CHANGE PROCEDURE
INTRODUCTION
Introduces stylus types, handling requirements, and color-coding for radius identification.
STYLUS REMOVAL AND REPLACEMENT
Contains procedures for changing the stylus in the sensor assembly, emphasizing safe handling.
Stylus Removal
Details the steps for safely removing the current stylus from the sensor assembly.
Stylus Replacement
Guides users on how to properly install a new stylus, including seating and tightening procedures.
Scan Position Offset Calibration
Explains the procedure to calculate X-, Y-axis offsets for accurate sample stage positioning.
Chapter 14 CONFIGURATION
OPERATING ENVIRONMENT
Describes the system's operating environment requirements, including vibration isolation and air space.
SYSTEM GEOMETRY
Displays handler and manual load positions, emphasizing the importance of correct setup.
STAGE CONFIGURATION
Details editable items within the Stage Configuration area, noting which require specific procedures.
LICENSE OPTIONS
Provides the interface for importing and exporting license files based on the tool's MAC address.
RECIPE TRANSPORT OPTIONS
Sets default paths for exporting scan and sequence recipes and data, including path configuration.
SEQUENCE EXECUTION OPTIONS
Automatically saves sequence data under lot ID and/or operator ID, with prompts before each sequence.
PROXIMITY SENSOR CONFIGURATION (P-16+ ONLY)
Explains configurable parameters for the proximity sensor that signals near proximity to the sample surface.
PRECISION LOCATORS (P-16+ ONLY)
Describes fixtures for exact sample positioning, including wafer, disk, and stress precision locators.
Chapter 15 Preventive Maintenance
INTRODUCTION
Introduces the chapter on preventive maintenance (PM) procedures for reliable system operation.
PERIODIC PREVENTIVE MAINTENANCE
Details maintenance procedures divided into categories: weekly, monthly, and semi-annual PMs.
Weekly PM Procedures
Outlines essential weekly tasks including calibration, disk capacity check, and backup.
Chapter 16 BACKUP AND RESTORE
Introduction
Explains the purpose of Backup and Restore procedures for preventing data loss and system settings.
Profiler Backup Procedure
Provides step-by-step instructions for performing a backup of the Profiler software and its data.
Profiler Restore Procedure
Guides administrators on restoring configuration, calibrations, recipes, and data from backup files.
Appendix A HAZARDOUS MATERIALS
INTRODUCTION
Identifies environmentally hazardous materials within the product according to WEEE and RoHS directives.
HAZARDOUS MATERIAL CONTENT
Lists common hazardous materials found in electronic components, cables, and casings.
HAZARDOUS MATERIALS LIST
Provides a detailed list of materials and their corresponding used components for proper disposal.
Appendix B P SERIES PROFILER - PREPARING FOR SHIPMENT
INTRODUCTION
Provides guidelines and steps for the proper and safe shipment of P series Profiler tools.
Required tools
Lists the minimum parts required for preparing the Profiler for shipment.
PROCEDURE
Details the step-by-step procedure for preparing the Profiler for shipment, covering hardware and software.

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