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Summary of Contents for Epcos B72714D0160H060
- Page 1 CeraDiodes High-speed series Series/Type: Date: May 2009 © EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
- Page 2 CeraDiodes High-speed series Features Single chip Very low capacitance values 0.6 up to 10 pF ESD protection to IEC 61000-4-2, level 4 Bidirectional ESD protection in one component No change in ESD protection performance at temperatures up to 85 °C (temperature derating) 4-fold array Low parasitic inductance Low leakage current...
- Page 3 B72755D0050H062 Array, 2/4 data + 1 supply, 1012, SOT-23 6L CDA6C05GTH B72735D0050H062 Array, 4-fold, 0508, no semiconductor diode equivalent CDA4C16GTH B72714D0160H060 16 Array, 4-fold, 0612, no semiconductor diode equivalent CDA5C16GTH B72724D0160H062 16 Single, 0201, no semiconductor diode equivalent CDS1C05GTH B72440D0050H060...
- Page 4 CeraDiodes High-speed series Dimensional drawings Single device Dimensions in mm Case (inch) 0201 0402 0603 1003 size (mm) 0603 1005 1608 2508 Min. Max. Min. Max. Min. Max. Min. Max. 0.57 0.63 0.85 1.15 1.45 1.75 2.34 2.74 0.27 0.33 0.4 0.27 0.33 0.4 0.13 0.75 Array devices...
- Page 5 CeraDiodes High-speed series Recommended solder pads Single device Dimensions in mm Case size (inch) 0201 0402 0603 1003 (mm) 0603 1005 1608 2508 0.25 1.45 Array devices 4-fold array 2/4 data + 1 supply Dimensions in mm Case size (inch) 0506 0508 0612...
- Page 6 CeraDiodes High-speed series Pin configurations Single device Description I/O line Array devices 4-fold array Description I/O line 1 I/O line 2 I/O line 3 I/O line 4 2/4 data + 1 supply Description I/O line 1 I/O line 2 I/O line 3 I/O line 4 Please read Cautions and warnings and Page 6 of 22...
- Page 7 CeraDiodes High-speed series Termination Single device Array device Please read Cautions and warnings and Page 7 of 22 Important notes at the end of this document.
- Page 8 B72590D0050H260 0402 Cardboard 10000 CDS2C15GTH B72590D0150H060 0402 Cardboard 10000 CDS2C16GTH B72590D0160H060 0506 Blister 3000 CDA3C05GTH B72755D0050H062 0508 Cardboard 4000 CDA4C16GTH B72714D0160H060 0603 Cardboard 4000 CDS3C05HDMI1 B72500D0050H160 0603 Cardboard 4000 CDS3C16GTH B72500D0160H060 0603 Cardboard 4000 CDS3C30GTH B72500D0300H060 0612 Blister 3000 CDA5C16GTH...
- Page 9 CeraDiodes High-speed series Taping and packing for chip and array CeraDiodes Cardboard tape (taping to IEC 60286-3) Dimensions in mm 0402 0603 1003 0508 Tolerance Case size (inch) 0201 0603 1005 1608 2508 1220 (mm) 0.38 ±0.05 0.6 ±0.2 Compartment width 0.95 0.68 ±0.05 1.15 ±0.2...
- Page 10 CeraDiodes High-speed series Blister tape (taping to IEC 60286-3) Dimensions in mm 0506 0612 1012 Tolerance Case size (inch) 1216 1632 2532 (mm) ±0.2 Compartment width ±0.2 Compartment length Compartment height max. Sprocket hole diameter +0.1/ Compartment hole diameter min. ±0.1 Sprocket hole pitch ±0.05...
- Page 11 CeraDiodes High-speed series Reel packing Dimensions in mm Dimensions Tolerance Dimensions Tolerance ±2 Reel diameter +0/ –3 Reel width (inside) +1.5/ –0 +1.5/ –0 Reel width (outside) 14.4 max. 14.4 max. Package: 8-mm tape Reel material: Plastic Packing units ∅ 180-mm reel ∅...
- Page 12 CeraDiodes High-speed series Soldering directions Reflow soldering temperature profile Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Profile feature Sn-Pb eutectic assembly Pb-free assembly Preheat and soak 100 °C 150 °C - Temperature min smin 150 °C 200 °C - Temperature max smax - Time...
- Page 13 CeraDiodes High-speed series Soldering guidelines The use of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of the PCB. The components are suitable for reflow soldering to JEDEC J-STD-020D. Solder joint profiles / solder quantity Cement quantity The component is fixed onto the circuit board with cement prior to soldering.
- Page 14 CeraDiodes High-speed series 3.3.1 Solder joint profiles for nickel barrier termination Good and poor solder joints caused by amount of solder in infrared reflow soldering Please read Cautions and warnings and Page 14 of 22 Important notes at the end of this document.
- Page 15 CeraDiodes High-speed series Solderability tests Test Standard Test conditions / Test conditions / Criteria / test results Sn-Pb soldering Pb-free soldering Wettability Immersion in Immersion in Covering of 95% 60068-2-58 60/40 SnPb solder Sn96.5Ag3.0Cu0.5 of end termination, using non-activated solder using non- or checked by visual flux at 215 ±3 °C for low activated flux...
- Page 16 CeraDiodes High-speed series Notes for proper soldering Preheating and cooling The average ramp-up rate must not exceed 3 °C/s. The cooling rate must not exceed 8 °C/s. Repair / rework Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for making repairs.
- Page 17 CeraDiodes High-speed series Placement of components on circuit board It is of advantage to place the components on the board before soldering so that their two termi- nals do not enter the solder oven at different times. Ideally, both terminals should be wetted si- multaneously.
- Page 18 CeraDiodes High-speed series Symbols and terms CeraDiode Semiconductor diode Maximum capacitance Typical capacitance (Reverse) current @ breakdown voltage (Reverse) leakage current leak Current @ clamping voltage Peak pulse current Peak pulse power Operating temperature Storage temperature (Reverse) breakdown voltage Minimum breakdown voltage BR,min Clamping voltage clamp...
- Page 19 CeraDiodes for a particular customer application. As a rule, EPCOS is either unfamiliar with indi- vidual customer applications or less familiar with them than the customers themselves. For these...
- Page 20 , Cl). Use CeraDiodes as soon as possible after opening factory seals such as polyvinyl-sealed pack- ages. Solder CeraDiodes after shipment from EPCOS within the time specified: 12 months. Handling Do not drop CeraDiodes and allow them to be chipped.
- Page 21 EPCOS CeraDiodes are not suitable for switching applications or voltage stabilization where static power dissipation is required. CeraDiodes are designed for ESD protection only. This listing does not claim to be complete, it merely reflects the experience of EPCOS AG. Please read Cautions and warnings and Page 21 of 22...
- Page 22 For these reasons, it is always ultimately incum- bent on the customer to check and decide whether an EPCOS product with the properties de- scribed in the product specification is suitable for use in a particular customer application.
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