SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination Applications Temperature measurement and compensation for mobile phone applications (e.g. battery pack, TCXO, LCD display) and data systems Features Standard EIA chip size 0805 SMD NTC with Ni - Barrier termination (Ag/Ni/Sn) The component is compliant with ROHS (DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment)
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SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination Resistance - Temperature Characteristic R/T-Curve 1011 / A01 R at 25°C 10000 [Ohm] B(25/100) 3730[K] ± 3 [%] Rn at 25°C 10000 [Ohm] ± 5 [%] ΔR/R25 ΔT R_Nom R_Min R_Max [Ω] [Ω]...
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SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination Resistance - Temperature Characteristic R/T-Curve 1011 / A01 R at 25°C 10000 [Ohm] B(25/100) 3730[K] ± 3 [%] Rn at 25°C 10000 [Ohm] ± 10 [%] ΔR/R25 ΔT R_Nom R_Min R_Max [Ω] [Ω]...
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SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination Reliability Tests of SMD NTC thermistors are made according to IEC 60068. The parts are mounted on standardized PCB in accordance with IEC 60539-1. ΔR Test Standard Test conditions Remarks (typical) IEC 60068-2-2 Storage at upper category...
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SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination - Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) : Preconditioning: Immersion into flux F-SW 32. Evaluation criteria: Leaching of side edges ≤ 1/3. Solder: Sn(60)Pb(40), Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9) Bath temperature (°C): 260 ±...
SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination 5. Storage conditions Solderability is guaranteed for 12 months from date of delivery for types with Ni-barrier termination, provided that the components are stored in the original packages. Storage temperature: -25 ... +45°C Relative humidity: <...
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SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination Taping and Packing Taping: Tape and reel packing comply with specifications of IEC 60286-3 Blister tape Section A-A D irection of unreeling Dimensions and tolerances: Definition Symbol Dimension (mm) Tol. (mm) Size 0805 Compartment width x Compartments length 1.6 x 2.4...
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SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination Reel Packing: Reel material: Blister Tape material: min. 10N Tape break force: 0.1 - 0.65N at a peel speed of 300 mm/min, angle between top cover Top cover tape peel force: tape and the direction of feed during peel off: 165 -180°.
Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc.) After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible. Solder thermistors after shipment from EPCOS within the time specified: SMD with nickel barrier termination: 12 months...
SMD NTC Thermistor B57620C5103*062 SMD NTC Thermistor with Ni-Barrier Termination Mounting When NTC thermistors are encapsulated with sealing material or over molded with plastic material, there must be no mechanical stress caused by thermal expansion during the production process (curing / over molding process) and during later operation.
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For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.
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