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XENSIV™ TLE4973 Current sensor 2GO kit
User Guide
XENSIV™ TLE4973 Current sensor 2GO kit
User Guide
About this document
Scope and purpose
Infineon's Current sensor 2Go kit is a low-cost solution which enables the user to quickly evaluate the TLE4973
current sensor.
The following key aspects are discussed in this document.
Sensor board description & schematic
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MCU board description & schematic
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Current sensor 2Go kit GUI description & installation procedure
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Current sensor 2Go kit use cases
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Reprogramming the EEPROM of TLE4973
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The programmer board is to be used by the customer solely for the purpose of evaluation and testing. It is not a
commercialized product and shall not be used for series production. The programmer board is thus not intended
to meet any industrial specifications and must be operated in the room temperature conditions.
Due to the purpose of the system, it is not subject to the same procedures regarding Returned Material Analysis
(RMA), Process Change Notification (PCN) and Product Withdraw (PWD) as regular products.
Intended audience
Current Sensor Module Developers
Inverter/Converter applications
Industrial Drive applications
User Guide
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
page 1 of 30
V 1.0
2024-05-29
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Table of Contents
Related Manuals for Infineon XENSIV TLE4973
Summary of Contents for Infineon XENSIV TLE4973
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Page 1: About This Document
User Guide About this document Scope and purpose Infineon’s Current sensor 2Go kit is a low-cost solution which enables the user to quickly evaluate the TLE4973 current sensor. The following key aspects are discussed in this document. Sensor board description & schematic −... -
Page 2: Table Of Contents
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Table of contents Table of contents About this document ........................1 Table of contents ..........................2 Disclaimer & Safety precautions ....................... 3 Introduction .......................... 4 Getting started ................................4 Kit Content ............................... 4 Use Cases .............................. -
Page 3: Disclaimer & Safety Precautions
As like regular products, Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Withdraw (PWD) is not applicable with this product. See Legal Disclaimer and Warnings for further restrictions on Infineon Technologies warranty and liability. -
Page 4: Introduction
Introduction Introduction The TLE4973 Current sensor 2Go kit is a budget-priced evaluation kit enabling the possibility to evaluate the Infineon TLE4973 current sensor. Getting started The following chapters describe the different parts of the TLE4973_MS2GO kit, hardware connection, software installation and clarifies how to use the graphical user interface (GUI) in order to perform the first evaluation of the sensor in a particular application. -
Page 5: Use Cases
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Introduction Use Cases The TLE4973_MS2GO kit can be used for different use cases as shown below. • TLE4973_MS2GO kit use case with MCU Board + connection to computer running Windows 7 or higher. •... -
Page 6: Hardware And Software Overview
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Introduction Hardware and Software Overview 1.4.1 Hardware Overview The TLE4973_MS2GO kit contains the following items: • In-plane edge interface connector. • MCU Board. • Sensor board. • USB Cable. • Disclaimer and Safety precautions document. Figure 2 depicts the assembled TLE4973_MS2GO kit with associated pin labels. -
Page 7: Software Overview
Infineon Development Center online platform, section tools, or from the Infineon Developer Center Launcher application. The user may filter the tool list by inserting the text “TLE4973” or “Current Sensor” and the following record shall appear: XENSIV™ Current Sensors MS2Go Evaluation App. -
Page 8: Installing The Software
.NET 4.8 online installer (needed only for older versions of Windows which do not have this already installed). Installation requires stable internet connection. Installation steps: • License agreement It is required that you agree with Infineon Terms and Conditions before continuing. Figure 5 Software Installation Step – License Agreement •... - Page 9 XENSIV™ TLE4973 Current sensor 2GO kit User Guide Introduction • After the binaries are copied to the installation folder, the user is prompted for installing JLink Segger Driver. If this is already installed on your PC the user can cancel this operation. Please note that by not having this driver installed, the USB connection between PC and the TLE4973_MS2GO kit MCU board will not function.
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Page 10: Uninstalling The Software
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Introduction • The user is notified upon completion of all installer processes and a shortcut is by default created on Desktop. The user may opt for running the installed XENSIV™ Current Sensors MS2Go Evaluation App. Figure 9 Software Installation Step –... -
Page 11: Tle4973_Ms2Go Kit Description
XENSIV™ TLE4973 Current sensor 2GO kit User Guide TLE4973_MS2GO kit Description TLE4973_MS2GO kit Description The TLE4973_MS2GO kit contains the following main components: • Sensor board • MCU Board • In-plane edge connector Sensor Board 2.1.1 Overview The current sensor is placed on a board with two M4 screw connectors for high current (≤20A) applications. The PCB is manufactured in 140 µm copper technology, and the sensor provides functional galvanic isolation. -
Page 12: Pcb Layout
XENSIV™ TLE4973 Current sensor 2GO kit User Guide TLE4973_MS2GO kit Description Figure 12 Sensor Board Schematic Design 2.1.3 PCB Layout The design described in sections 2.1.1 and 2.1.2 is physically implemented in PCB technology using a standard process with following characteristics: •... -
Page 13: Bill Of Materials
TLE4973_MS2GO kit Description 2.1.4 Bill of Materials Table 2 TLE4973_MS2GO kit Sensor Board bill of materials Designator Description Quantity Assembled on PCB Infineon Part JP1, JP2 PINHD_1X3_S2GO 2 NO 100pF 0603 10V 1 YES 1nF 0603 25V 1 YES 220nF 0603 25V... -
Page 14: Hardware Design
XENSIV™ TLE4973 Current sensor 2GO kit User Guide TLE4973_MS2GO kit Description 2.2.2 Hardware Design This section offers a detailed description on the latest hardware design version of the TLE4973_MS2GO MCU board, version V1.0. The hardware is composed of the following main blocks: •... - Page 15 XENSIV™ TLE4973 Current sensor 2GO kit User Guide TLE4973_MS2GO kit Description MCU Board Schematic – Sheet 1 Figure 15 User Guide 15 of 30 V 1.0 2024-05-29...
- Page 16 XENSIV™ TLE4973 Current sensor 2GO kit User Guide TLE4973_MS2GO kit Description MCU Board Schematic -Sheet 2 Figure 16 User Guide 16 of 30 V 1.0 2024-05-29...
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Page 17: Pcb Layout
XENSIV™ TLE4973 Current sensor 2GO kit User Guide TLE4973_MS2GO kit Description 2.2.3 PCB Layout The design described in sections 2.2.1 and 2.2.2 is physically implemented in PCB technology using a standard process with following characteristics: • PCB material: FR4. • Copper: 4 layers Top/Inner1/Inner2/Bottom, 35µm thickness each. -
Page 18: Bill Of Materials
Bill of Materials Table 3 TLE4973_MS2GO kit MCU Board bill of materials Designator Description Quantity Assembled on PCB Infineon Part C1, C2, C4, C101, C102, C103, C104, C105, C106, C201 100nF 0402 10V 10% 10 YES C107, C202 10µF 0603 10V 10%... -
Page 19: In-Plane Edge Connector
XENSIV™ TLE4973 Current sensor 2GO kit User Guide TLE4973_MS2GO kit Description In-Plane Edge Connector The in-plane edge connector is used to establish the connection between the MCU board and the sensor board. This is a 10 way open ended card edge connector with asymmetric keying which prevents mating in an incorrect orientation. -
Page 20: Current Sensor 2Go Evaluation Software
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Current Sensor 2GO Evaluation Software Current Sensor 2GO Evaluation Software Safety precautions Due to the design rules followed for high voltage application, the TLE4973_MS2GO kit can directly connect to the output of any inverter stage like a half-bridge of MOS-FETs. All isolation is done in the TISON-8-5 package and no further efforts are necessary. -
Page 21: Main Window And Graphical Elements
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Current Sensor 2GO Evaluation Software The XENSIV™ Current Sensors MS2Go Evaluation App is a graphical user interface compatible with multiple board types including TLE4971_MS2GO, TLI4971_MS2GO, TLI4971_S2GO and TLE4973_MS2GO evaluation kits. In the next window, please make sure you select the correct hardware for this use-case: TLE4973. - Page 22 XENSIV™ TLE4973 Current sensor 2GO kit User Guide Current Sensor 2GO Evaluation Software Data Logging and Readout Example - GUI Figure 22 Current and OCD values together with the sensor’s configured Output Mode and Measurement Range are displayed in the labels positioned on the top right corner of the view. The list view situated on the bottom part of the GUI is used for displaying real-time raw and processed values: •...
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Page 23: Adc Data Processing
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Current Sensor 2GO Evaluation Software The exported CSV file has the following structure: • Header section: in this section, the software will log generic data as sensor name, timestamp, number of logged points, acquisition frequency, user comment. •... -
Page 24: Eeprom Map And Configuration
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Current Sensor 2GO Evaluation Software 3.4.3 EEPROM Map and configuration This section gives an overview of the programmable content of the current sensor and its software implementation. The sensor's nonvolatile memory (EEPROM) is organized in 16 bits registers which can be addressed individually. The storage space is separated into two areas, user area with read/write access and the read only area [1]. - Page 25 XENSIV™ TLE4973 Current sensor 2GO kit User Guide Current Sensor 2GO Evaluation Software • Memory configuration import: The user has the option to import a .csv file with the same format as the memory and bring it in the Memory Map view with the option of altering and writing it. This function is useful for writing full configurations of the sensor.
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Page 26: Appendix I - Hardware Revision History
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Appendix I – Hardware Revision History Appendix I – Hardware Revision History The chapters 2.1 and 2.2 of this document describe the current state of the hardware: revision V1.0. This APENDIX will highlight the main hardware modifications implemented from revision 1.0 (first release) to the current revision. -
Page 27: Glossary
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Glossary Glossary Abbreviation Description MS2Go Magnetic Sensor to Go Printed Circuit Board Graphical User Interface EEPROM Electrically Erasable Programmable Read-Only Memory Over Current Detection Universal Serial Bus Device Under Test High Voltage Light Emitting Diode Micro-Controller Unit DCDI... -
Page 28: References
XENSIV™ TLE4973 Current sensor 2GO kit User Guide References References Infineon-TLE4973_magnetic_current_sensor-UserManual-vxx_xx-EN Infineon-TLE4973-RE35x5-S0010-DS-vxx_xx-EN; Infineon-TLE4973-RxxxT5-S0010-DS-vxx_xxEN; Infineon- TLE4973-xE35x5-S0001-DS-vxx_xx-EN; Infineon-TLE4973-xxxxT5-S0001-DS-vxx_xx-EN User Guide 28 of 30 V 1.0 2024-05-29... -
Page 29: Revision History
XENSIV™ TLE4973 Current sensor 2GO kit User Guide Revision history Revision history Document Date of release Description of changes version V 1.0 2024-05-29 Initial version User Guide 29 of 30 V 1.0 2024-05-29... - Page 30 Infineon Technologies hereby disclaims dangerous substances. For information on the types © 2024 Infineon Technologies AG. any and all warranties and liabilities of any kind in question please contact your nearest Infineon All Rights Reserved. (including without limitation warranties of non- Technologies office.
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