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BMP3xy – Digital Pressure Sensors
Handling, Soldering and Mounting Instruction
BMP3xy HSMI
Document revision
Document release date
Document number
Technical reference codes
Notes
1.5
April 2020
BST-BMP3xy-HS000-05
Valid for all BMP3xy
Data and descriptions in this document are subject to change without notice. Product
photos and pictures are for illustration purposes only and may differ from the real
product appearance.
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Table of Contents
Related Manuals for Bosch BMP3 Series
Summary of Contents for Bosch BMP3 Series
- Page 1 BMP3xy – Digital Pressure Sensors Handling, Soldering and Mounting Instruction BMP3xy HSMI Document revision Document release date April 2020 Document number BST-BMP3xy-HS000-05 Technical reference codes Valid for all BMP3xy Notes Data and descriptions in this document are subject to change without notice. Product photos and pictures are for illustration purposes only and may differ from the real product appearance.
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Page 2: Purpose Of This Document
It is also strongly recommended to study the BMP3xy data sheet prior to handling the BMP3xy sensor device. In case you have any questions, please do not hesitate to contact your nearest Bosch Sensortec representative for further advice. -
Page 3: Table Of Contents
Bosch Sensortec"| BMP3xy HSMI 3 | 20 Table of Contents 1 Package outline dimensions ............................4 2 Device Marking ................................4 3 Moisture sensitivity level (MSL) ........................... 4 3.1 MSL and device storage ............................4 3.2 Multiple reflow soldering cycles ..........................4 3.3 Classification reflow profile ............................ -
Page 4: Package Outline Dimensions
Bosch Sensortec"| BMP3xy HSMI 4 | 20 1 Package outline dimensions Please refer to the latest version of the corresponding product datasheet or preliminary datasheet. 2 Device Marking Please refer to the latest version of the corresponding product datasheet or preliminary datasheet. -
Page 5: Classification Reflow Profile
Bosch Sensortec"| BMP3xy HSMI 5 | 20 3.3 Classification reflow profile The following figure describes the recommended reflow soldering process. Vapor phase soldering has to be avoided. Modifications reserved | Data subject to change without notice Document number: BST-BMP3xy-HS000-05... -
Page 6: Environmental Safety
However, as secured by the extensive product qualification process of Bosch Sensortec, this has no impact to the usage or to the quality of the BMP3xy product. -
Page 7: Handling Of Reels
Bosch Sensortec"| BMP3xy HSMI 7 | 20 6 Handling of reels 6.1 Storage Once the reels are removed from the pizza box, they should always be stacked in vertical condition. 6.2 Introduction into production Reel trailers must not be removed. Removal of the trailer could cause deformation of the reel during de-reeling and... - Page 8 Bosch Sensortec"| BMP3xy HSMI 8 | 20 When reels are to be stored horizontally, then they must be ordered in a stack with max. 4 reels pro stack (see images below). Correct wrong wrong Modifications reserved | Data subject to change without notice...
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Page 9: Mounting Recommendations
7 Mounting recommendations MEMS sensors in general are high-precision measurement devices which consist of electronic as well as mechanical silicon structures. Bosch Sensortec MEMS sensor devices are designed for precision, efficiency and mechanical robustness. However, in order to achieve best possible results for your design, the following recommendations should be taken into consideration when mounting a pressure sensor on a printed-circuit board (PCB). - Page 10 The BMP3xy shall not be placed close to fast heating parts. In case of temperature changes > 3.0°C/sec during operation. It is recommended to follow Bosch Sensortec application note “Correction of errors induced by fast temperature changes”. Please contact your Bosch Sensortec representative for details ...
- Page 11 The scenarios described below – given as examples – may lead to a bending of the PCB, which as a consequence, might influence the performance of a sensor mounted on the PCB. Please note that this possible behavior is not limited to Bosch Sensortec devices, but may as well occur with 3 party MEMS devices in a similar manner.
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Page 12: Push-Button Contacts
Bosch Sensortec"| BMP3xy HSMI 12 | 20 Push-button contacts Keep a reasonable distance to push-button contacts, when placing the sensor device. Do not position the sensor directly beneath a push-button contact. Hot-spots on the PCB Keep a reasonable distance from any hot spots, when placing the sensor device. Hot spots can be for example other integrated circuits with high power consumption. -
Page 13: Pcb Anchor Points
Bosch Sensortec"| BMP3xy HSMI 13 | 20 PCB anchor points Please keep a reasonable distance from any anchor points, where the PCB is fixed at a base plate (e.g. like a shelf or similar), when placing the sensor device. Resin coatings Please avoid total and partial covering of the BMP3xy sensor with any protective material like for example epoxy resin. -
Page 14: Minimum Distance Between Sensor And Pcb
Bosch Sensortec"| BMP3xy HSMI 14 | 20 Minimum distance between sensor and PCB The distance between the sensor and the PCB after the soldering process must be at least 50µm. Underfill and cleaning materials Please avoid all kinds of foreign materials under the sensor, e.g. underfill and cleaning materials. -
Page 15: Redundant Pcb Anchor Points
Bosch Sensortec"| BMP3xy HSMI 15 | 20 Redundant PCB anchor points It is recommended to unscrew or remove any redundant PCB anchor points. In theory, an ideal flat plane is determined by 3 anchor points, exclusively. Any further anchor point will over-determine the ideal flat plane criteria. If these redundant anchor points are out of plane position (which means not 100% exact in plane position) the ideal flat criteria is infringed, resulting in mechanical stress. -
Page 16: Integration Into Water Resistant Devices
Bosch Sensortec"| BMP3xy HSMI 16 | 20 Integration into water resistant devices When operating the sensor inside a water resistant device (e.g. IPX5 or higher rated), special care must be taken, if a fast response to changes in ambient air pressure is needed. -
Page 17: Automatic Handling
Bosch Sensortec"| BMP3xy HSMI 17 | 20 7.2 Automatic handling When picking up the component from the Tape and Reel carrier, we recommend that you place the pick-up tool at a vertical-height distance from the sensor. When picking up the component from the Tape and Reel carrier, it is recommended that you place the pick-up tool at a vertical-height distance from the sensor. -
Page 18: Legal Disclaimer
Their sole purpose is internal client testing. The testing of an engineering sample may in no way replace the testing of a product series. Bosch Sensortec assumes no liability for the use of engineering samples. The Purchaser shall indemnify Bosch Sensortec from all claims arising from the use of engineering samples. -
Page 19: Document History And Modification
Bosch Sensortec"| BMP3xy HSMI 19 | 20 9 Document history and modification Rev. No Chapter Description of modification/changes Date Initial release May 2017 Changed validity from BMP380 to BMP3xy 14. Apr 2018 Added comments about using tape and applying all kind of 10. - Page 20 Bosch Sensortec"| BMP3xy HSMI 20 | 20 Bosch Sensortec GmbH Gerhard-Kindler-Straße 9 72770 Reutlingen / Germany contact@bosch-sensortec.com www.bosch-sensortec.com Modifications reserved Preliminary - specifications subject to change without notice Document number: BST-BMP3xy-HS000-05 Modifications reserved | Data subject to change without notice...
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