Samsung DVD-N2000 Service Manual
  1. Manuals
  2. Brands
  3. Samsung Manuals
  4. DVD Player
  5. DVD-N2000
  6. Service manual
Samsung DVD-N2000 Service Manual

Samsung DVD-N2000 Service Manual

Hide thumbs Also See for DVD-N2000:
Table of Contents

Advertisement

Quick Links

Download this manual
ELECTRONICS
© Samsung Electronics Co., Ltd. JUN. 2000
Printed in Korea
AH68-00532A
DVD PLAYER
DVD-N2000
SERVICE
DVD PLAYER
SKIP
HEAD
OPEN/CLOSE STOP
SCREEN FIT
OPEN/
CLOSE
Manual
CONTENTS

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the DVD-N2000 and is the answer not in the manual?

Questions and answers

Subscribe to Our Youtube Channel

Related Manuals for Samsung DVD-N2000

Summary of Contents for Samsung DVD-N2000

  • Page 1: Table Of Contents

    7. Exploded Views and Parts List 8. Electrical Parts List SKIP HEAD OPEN/CLOSE STOP SCREEN FIT OPEN/ 9. Block Diagrams CLOSE 10. PCB Diagrams 11. Wiring Diagram 12. Schematic Diagrams © Samsung Electronics Co., Ltd. JUN. 2000 Printed in Korea AH68-00532A...

  • Page 2: Precautions

    Melal Part cal return path to the chassis. Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the out- ohmmeter let and repeat the test. See Fig. 1-1. Fig. 1-2 Insulation Resistance Test Samsung Electronics...
  • Page 3 (5) antenna wiring. Always inspect in all areas tinuously and new instructions are issued whenev- for pinched, out-of-place, or frayed wiring, Do not er appropriate. change spacing between a component and the printed-circuit board. Check the AC power cord for damage. Samsung Electronics...

  • Page 4: Servicing Precautions

    Components i-enti- fied by shading, by( ) or by ( ) in the circuit dia- gram are important for safety or for the characteris- tics of the unit. Always replace them with the exact replacement components. Samsung Electronics...

  • Page 5: Esd Precautions

    (6) Do not remove a replacement ESD device from its protective package until immediately before your are ready to install it.(Most replacement ESD devices are packaged with leads electrically short- ed together by conductive foam, aluminum foil or comparable conductive materials). Samsung Electronics...

  • Page 6: Handling The Optical Pick-Up

    Be sure to put on a wrist strap grounded to the sheet. Be sure to lay a conductive sheet made of copper etc. Which is grounded to the table. Samsung Electronics...

  • Page 7: Pick-Up Disassembly And Reassembly

    SW3 on Deck PCB to “ON”. (See Fig 1-4) 4) Disassemble the Deck PCB. Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged. Flat-Cable To Main Front PCB (CN6) Fig. 1-4 Samsung Electronics...

  • Page 8: Reference Information

    "L":normal speed, "H":double speed DEM0 De-emphasis frequency select pin DZFR Rch zero input detect pin De-emphasis frequency select pin DZFL Lch zero input detect pin DEM1 Note : Allinput pins except internal pull-down pins should not be left floating. Samsung Electronics...
  • Page 9 Reference Information 2-1-2 DIC1 (KS1453 ; Data Processor) Samsung Electronics...
  • Page 10 Reference Information Samsung Electronics...
  • Page 11 2-1-3 DIC2 (M11B416256A ; CMOS 256K x 16 DRAM) CASL CONTROL DATA-IN BUFFER LOGIC CASH NO.2 CLOCK IO15 GENERATOR DATA-OUT BUFFER COLUMN COLUMN ADDRESS DECODER BUFFER REFRESH SENSE AMPLIFIERS CONTROLLER VO GATING 512x16 REFRESH COUNTER 512x512x16 ROW. MEMORY ADDRESS ARRAY BUFFERS(9) NO.1CLOCK GENERATOR Samsung Electronics...
  • Page 12 CASL Input Column Address Strobe/Lower Byte Control Input Write Enable Input Output Enable 2~5, 7~10, 31~34, 36~39 I/O0~I/O15 Input/Output Data Input/Output 1, 6, 20 Supply Power, 5V 21, 35, 40 Ground Ground 11, 12, 15, 30 No Connect Samsung Electronics...
  • Page 13 (TIMER 2) P30(RD) P31(WR) 8BIT PWM (T03)P73 P32(HWR) (TIMER 3) P33(WAIT) PORT 3 P34(BUSRQ) (INT4/T14)P80 P35(BUSAK) (INT5/T15)P81 16BIT TIMER P36(R/W) (T04)P82 (TIMER 4) P37(RAS) (T05)P83 16BIT TIMER (INT6/T16)P84 CS/WAIT P40(CS0/CAS0) (TIMER 5) (INT7/T17)P85 CONTROLLER P41(CS1/CAS1) (T06)P86 P42(CX2/CAS2) (3-BLOCK) (INTO)P87 Samsung Electronics...
  • Page 14 Reference Information Samsung Electronics...

  • Page 15: Pin Designations

    = Address Inputs PGM# (P#) CE# (E#) = Chip Enable Input DQ0—DQ7 = Data Input/Outputs OE# (G#) = Output Enable Input PGM# (P#) = Program Enable Input Supply Voltage = Program Voltage Input OE# (G#) = Ground CE# (E#) Samsung Electronics...
  • Page 16 A0-A19 Address Inputs Q0-Q7 Data Outputs Q8-Q14 Data Outputs Q15A—1 Data Output / Address Input Chip Enable Output Enable BYTEV Byte Mode / Program Supply M27C160 BYTEV PP Supply Voltage V SS V SS Q15A-1 Ground V CC Samsung Electronics...
  • Page 17 Timer 0 Port 8 Timer 1 Port 2 Port 3 Port 4 INT0-3 Noise Filter Port 5 PWM 1 Real Time Service XRAM Stack Pointer (128 bytes) VFD Controller PORT 0 Watch Dog Timer High Voltage Output 2-10 Samsung Electronics...
  • Page 18 Reference Information Samsung Electronics 2-11...
  • Page 19 FE_OFST(05 H ) DPDVCC DCD1 DFCT2 AVCC CDRSEL(00 H ) DFCT1 LDONB(00 H) ANALOG TESEL(00 H ) VREFA DFCTTH1 VC AMP ENVELOPE DEFECT DFCTTH2 ALPC FOFST FOFST DVCC 29 30 37 38 40 41 42 43 47 48 2-12 Samsung Electronics...
  • Page 20 DEFECT ing Level for Servo Defect output terminal for Servo DFCT1 DEFECT DSSP Defect output terminal for PLL DFCT2 DEFECT Power voltage input terminal for DPD TE DPDVCC Mirror output terminal MIRR MIRR DSSP BCA output terminal Samsung Electronics 2-13...
  • Page 21 Reference Information 2-1-9 SIC1 (KS1452 ; Servo Processor) DIRC SSTOP/PS0 SMON LOCK DFCT FOKB MIRR TZCA PHI1 XOUT TEST RSTB TILTO TILTI 2-14 Samsung Electronics...
  • Page 22 Reference Information Samsung Electronics 2-15...
  • Page 23 Output current control voltage Hall signal (H1+) Power save (Start/Stop switch) Hall signal (H1-) FG waveform Hall signal (H2+) Supply voltage (Signal) Hall signal (H2-) Supply voltage (Motor) Hall signal (H3+) Supply voltage (Motor) Hall signal (H3-) Output current detection 2-16 Samsung Electronics...
  • Page 24 Drive input 2.5V bias voltage DI2.1 VREF Drive input Drive input DI2.2 DI4.1 Drive output Drive input DO2.1 DI4.2 Drive output Drive output DO2.2 DO4.1 GND2 Ground 2 DO4.2 Drive output Op-amp output Ground 3 OPOUT GND3 Samsung Electronics 2-17...
  • Page 25 Communication Bus Video Time CCIR MPE1 MPE2 MPE3 MPE0 Base and Display Generator Main Bus Other Bus System Bus Interface Other Bus DMA MPEG Hardware Main Bus Arbitration, DMA, and Arbitration Assist and SDRAM Interface System Bus SDRAM 2-18 Samsung Electronics...
  • Page 26 SYSGPCS_B [1] CEANAB Coded Data SYSBR_B CASTROBE SYSBG_B CASDATA SYSBB_B CVERRFLG SYSCS_B CACLK SYSRW CAREQ SYSBCLK CVTOP SYS_RDY_B CP_CLK RESET CP_DOUT [2:1] PLL_CLKI Controllers Global CP_DIN [2:1] PLL_REF CP_ENA_B TEST GPIO [15:0] General I/O Test Mode TEST_CLK [4:0] Samsung Electronics 2-19...
  • Page 27 Reference Information 2-20 Samsung Electronics...
  • Page 28 A0 - A11 Address Inputs(4K Product) DQ12 DQ0 - 15 Data In/Out DQ11 DQ10 Ground Row Address Strobe UCAS Upper Column Address Strobe LCAS LCAS Lower Column Address Strobe UCAS Read/Write Input Data Output Enable A12(N.C)* Power(+3.3V) No Connection Samsung Electronics 2-21...
  • Page 29 Data Input Register LDQM Bank Select 2M x 16 2M x 16 Column Decoder Latency & Burst Length LCKE Programming Register LRAS LCBR LCAS LWCBR LDQM Timing Register L(U)DQM DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 LDQM N.C/RFU UDQM A10/AP 2-22 Samsung Electronics...
  • Page 30 Power and ground for the input buffers and the core logic. Isolated power supply and ground for the output buffers to provide improved noise Data output power/ground immunity. No connection N.C/RFU This pin is recommended to be left No Connection on the device. /reserved for future use Samsung Electronics 2-23...
  • Page 31 RCV1 Raster Contral 1 for video port. This pin receives/provides a VS/FS/FSEQ signal. Raster Contral 2 for video port. This pin provides an HS pulse of programmable length or receives I / O RCV2 an HS pulse. 2-24 Samsung Electronics...
  • Page 32 The 12C-bus receiver waits for the START condition. S C L 12C serial clock input S D A I / O 12C serial data input/output TTXRQ Teletext Request output, indicating when text bits are requested T T X Teletext bit stream input Samsung Electronics 2-25...
  • Page 33 4 ma output careq Supply Cmos Input 5 Volt Tolerant sData6 Cmos Input 5 Volt Tolerant dter 4 ma output casdata Supply Cmos Input 5 Volt Tolerant sel_cdi 4 ma output rrq0 srq0 Cmos Input 5 Volt Tolerant 2-26 Samsung Electronics...
  • Page 34 6 ma tristate IO buffer Cmos input sysDataIO7 6 ma tristate IO buffer Cmos input sysDataIO6 6 ma tristate IO buffer Cmos input sysDataIO5 6 ma tristate IO buffer Cmos input sysDataIO4 6 ma tristate IO buffer Cmos input sysDataIO3 Samsung Electronics 2-27...
  • Page 35 Reference Information MEMO 2-28 Samsung Electronics...

  • Page 36: Product Specification

    48KHz Sampling : 4Hz to 22 KHz * Frequency Response 96KHz Sampling : 4Hz to 44KHz * S/N Ratio 110dB * Dynamic Range 92dB * Total Harmonic Distortion 0.003% (In case of 1 KHz) * : Nominal specification Samsung Electronics...
  • Page 37 Product Specification MEMO Samsung Electronics...

  • Page 38: Disassembly And Reassembly

    Note : If Tray Œ doesn’t open, insert a Screw driver ¨ into the Emergency hole ˇ(as shown in detailed draw- ing) and then turn it in the direction of arrow “B”. Open Tray manually. Œ TRAY ´ DOOR-TRAY "A" ˇ EMERGENCY HOLE "B" ¨ SCREW DRIVER <Bottom View> Fig. 4-1 Door-Tray Removal Samsung Electronics...

  • Page 39: Top Cabinet Removal

    1) Remove 3 Screws Œ on the back Top Cabinet. 2) Remove 2 Screws ´, ˇ on the left and right side. 3) Lift up the Top Cabinet in direction of arrow. Œ 3 SCREWS ´ 1 SCREW ˇ 1 SCREW Fig. 4-2 Top Cabinet Removal Samsung Electronics...
  • Page 40 Œ 2 SCREWS ˆ BRACKET-PHONE Ø KEY POWER PCB ’ 4 SCREWS ˝ KEY PLAY PCB ˇ KNOB-VOLUME ´ ASS'Y FRONT CABINET ” KNOB-SUHTTLE ∏ KNOB -JOG Fig. 4-3 Ass’y Front Cabinet, Key Power PCB, Key Play PCB Removal Samsung Electronics...
  • Page 41 3) Remove 4 Screws ¨ and lift up the Main Front PCB ˆ, Main Back PCB Ø. Œ 4 SCREWS ˇ JACK PCB ¨ 4 SCREWS Ø MAIN FRONT PCB ˆ MAIN FRONT PCB ´ 2 SCREWS Fig. 4-4 Main Front/Back PCB, Jack PCB Removal Samsung Electronics...
  • Page 42 Disassembly/Reaasembly 4-1-5 Ass’y Deck Removal 1) Remove 4 Screws Œ from the Ass’y Deck and lift it up. Œ 4 SCREWS Fig. 4-5 Ass’y Deck Removal Samsung Electronics...

  • Page 43: Pcb Location

    Disassembly/Reaasembly 4-2 PCB Location JACK PCB KEY POWER PCB MAIN BACK PCB KEY PLAY PCB MAIN FRONT PCB Fig. 4-6 PCB Location Samsung Electronics...

  • Page 44: Connector Diagram

    MAIN BACK PCB MAIN FRONT PCB Ô DECK PCB MAIN FRONT PCB  MAIN FRONT PCB DECK PCB Ò CN102 KEY POWER PCB JACK PCB CN17 Ú CN17 JACK PCB KEY POWER PCB CN102 Fig. 4-7 Connector Diagram Samsung Electronics...
  • Page 45 3) Pull the Tray Ø to disassemble, while simultaneously pushing the Hook ∏, ” in direction of arrow “A”, “B”. Œ 2 SCREWS ´ COVER SHEET ˇ ASS'Y - DECK CLAMPER ∏ HOOK "C" "B" "D" ” HOOK Ø TRAY ˆ SCREW DRIVER "A" ¨ EMERGENCY HOLE <Bottom View> Fig. 4-8 Tray Removal Samsung Electronics...
  • Page 46 2) Disassemble the Ass’y-Deck Sub ¨ in direction of arrow “B”, while simultaneously pushing the Hook ˇ in direction of arrow “A”. ¨ ASS'Y - DECK SUB "B" "A" ˇ HOOK ´ ASS'Y - PCB DECK Œ 2 SCREWS Fig. 4-9 Ass’y-Deck Sub Removal Samsung Electronics...
  • Page 47 ALIGN TWO ARROWS ’ GEAR - CAM SUB Æ GEAR - SYNCRO Ú SHAFT - SYNCRO Æ GEAR - SYNCRO Ò LEVER - OPEN S/W  1 SCREW Ô ASS'Y - MOTOR LOAD Fig. 4-10 Chassis-Main Parts Removal 4-10 Samsung Electronics...

  • Page 48: Ass'y-Brkt Deck Removal

    Disassembly/Reaasembly 4-4-4 Ass’y-Brkt Deck Removal 1) Remove 4 Screws Œ. 2) Lift up the Ass’y-Brkt Deck ´. Œ 4 SCREWS ´ ASS'Y - BRKT DECK Fig. 4-11 Ass’y-Brkt Deck Removal Samsung Electronics 4-11...
  • Page 49  GEAR - FEED B Ô WASHER - PLAIN Ø ASS'Y - PICK UP Ú ASS'Y GEAR - FEED CU/CL ˇ SHAFT - P/U Ò WASHER - PLAIN ˆ RACK - SLIDE ¨ 2 SCREWS Fig. 4-12 Ass’y- Deck Parts Removal 4-12 Samsung Electronics...

  • Page 50: Circuit Descriptions

    Input : Common power to transformer (Vp). Fig. 5-2 The output Vs of transformer is determined by the ratio of 1st Np and 2nd Ns. Vs = (Ns/Np) x Vp Fig. 5-3 Vout Vout is output (DC) by diode and condensor. Fig. 5-4 Samsung Electronics...
  • Page 51 Fig. 5-6 ◆ Terms 1) 1st : Common power input to 1st winding. 2) 2nd : Circuit followings output winding of transformer. 3) F (Frequency) : Switching frequency (T : Switching cycle) 4) Duty : (Ton/T) x 100 Samsung Electronics...
  • Page 52 ´ Rectify to PD12 and smooth to PE6. ˇ Use the output of transformer as PIC1 Vcc : The loads are different before and after PIC1 driving. (Vcc of PIC1 decreases below OFF voltage, using only the resistance due to load increase after PIC1 driving.) Samsung Electronics...
  • Page 53 Reverse sequence of the above description --> Duty down --> Vout down --> Maintain 5.8V (i.e., the feedback to maintains 5.8V). Œ PR35, PR36 : Reduce 5.8V overshoot ´ PR37, PC44 : Prevent PIC3 oscillation(for phase correction) ˇ PC09 : Adjust feedback response rate Samsung Electronics...

  • Page 54: Internal Block Diagram

    Rectified Circuit Smoothing Circuit VoltageCircuit (x2) Motor 8V 1 Port Power TR Control Circuit Line Filter 8V Rectified 8V Rectified VoltageCircuit Voltage Smoothing Circuit Detection Circuit -8V Rectified -8V Rectified VoltageCircuit Smoothing Circuit Power IN (85~265V) Fig. 5-9 Samsung Electronics...
  • Page 55 RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWM signal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency. Samsung Electronics...
  • Page 56 Œ EQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal, output from KS1453, into DC via low-pass filter. ´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output from KS1453, into DVD via low-pass filter. Samsung Electronics...

  • Page 57: System Control

    Audio DAC Decoder DVD & CD (AK4324) (Ar ies1. 1) Processor AIC2,3,4 ASIC MMP-L3BZP (KS1453) NIC1 (KS999F) DIC1 SIC1 NIC7 Video Digital Encoder Servo (SAA7128) (KS1452) VIC50 64M X EDO DRAM 16M EPROM (K4E641612C) (27C160) NIC11 NIC2,3 Fig. 5-12 Samsung Electronics...
  • Page 58 5-4-2 Block Diagram DISC SLED M/T SPINDLE M/T HALL MIC1 TMP 93CS41F › HA1+ HA1– SIC8 HA2– NJM2903 RIC1 HA2+ KS1461 SLED+ SLED– SIC1 KS1452 & DRIC2 FOCUSING F– FAN8000D TRACKING T– SPINDLE DRIC1 KA3011D “ Fig. 5-13 Samsung Electronics...

  • Page 59: Operation

    Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speed from disc is faster than data output speed on screen). ´ For CD, VCD Receive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD. 5-10 Samsung Electronics...
  • Page 60 If the existing track count is within fine seek range, tracking begins using fine seek. 4) CLV SERVO(DISC MOTOR CONTROL SERVO) Input RF signal (from Pick-up) to SIC1 pin59. Detect SYNC signal from RF in SIC1, and output PWM signal to SIC1 pin 55 for constant linear velocity. Samsung Electronics 5-11...

  • Page 61: Dvd Data Processor

    VCLK NIC13 CRYSTAL (PLL1700) SDATA[7..0] CVDATA[7..0] NIC1 EFMI NIC16.17 PLCK CSTROBE X CVCLK ARIES1.1 PLCK BUFFER DACK X CVENAB DIC1 (MMP-L3BZP) DATREQ X CVREQ (KS1453) X CAREQ NIC7 DTER X CASDATA 8.11 (KS999) SDATA3.6 SEL-CDI Fig. 5-15 5-12 Samsung Electronics...
  • Page 62 Video signal converted into analog signal is outputted via amplifier of analog part. (Main Board) (Output Board) CVBS-1 Video NIC1 CVBS-2 data VIC52 A/V Decoder Amplifier XCMMP-L3BZP Control BA7660 VIC50 SAA7128 Video encoder VIC51 Amplifier BA7660 Fig. 5-16 Video Output Block Diagram Samsung Electronics 5-13...
  • Page 63 13). Pin9, Pin12 and Pin14 of VIC51 and VIC52 are feedback pin to SAG compensation(DC characteristic compen- sation of signal). Resistance(VR3-VR14) which is inserted to input terminal is bias resistance for input offset. The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm. 5-14 Samsung Electronics...
  • Page 64 D/A CONVERTER FRONT-R FILTER NIC1 XCMMP-L3BZP A/V Decoder DATA1 POST AIC3 SURROUND-L FILTER AK4324 POST D/A CONVERTER SURROUND-R FILTER DATA2 POST AIC4 CENTER FILTER AK4324 POST D/A CONVERTER SUB WOOFER FILTER Fig. 5-18 Audio Output Block Diagram Samsung Electronics 5-15...
  • Page 65 The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted in digital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTS amplifier built in the external digital input source with IEC-958/1937 transmission format. 5-16 Samsung Electronics...

  • Page 66: Troubleshooting

    Troubleshooting 6. Troubleshooting Samsung Electronics...
  • Page 67 Troubleshooting Samsung Electronics...
  • Page 68 Troubleshooting Samsung Electronics...
  • Page 69 Troubleshooting Samsung Electronics...
  • Page 70 Troubleshooting Samsung Electronics...
  • Page 71 Troubleshooting Samsung Electronics...
  • Page 72 Troubleshooting Samsung Electronics...
  • Page 73 Troubleshooting Samsung Electronics...
  • Page 74 Troubleshooting Samsung Electronics...
  • Page 75 Troubleshooting 6-10 Samsung Electronics...

  • Page 76: Exploded View And Parts List

    7-2 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Samsung Electronics...

  • Page 77: Cabinet Assembly

    Exploded Views and Parts List 7-1 Cabinet Assembly Samsung Electronics...
  • Page 78 Exploded Views and Parts List Loc. No Parts No. Description ; Specification Remark AH97-00337A ASSY FRONT CABINET;ASSY,DVD-N2000/XAA,- AH97-00338A ASSY-DOOR TRAY;ABS,DVD-N2000/XAA,- AH64-11306V KNOB-VOLUME;DVD-N2000/XAA,ABS 94HB,-,G42 AH64-00498A KNOB-JOG;-,ABS 94HB,-,BLK,-,DVD-N2000/X AH64-00499A KNOB-SHUTTLE;-,ABS 94HB,-,BLK,-,DVD-N200 AH61-00194A HOLDER-DECK A;-,ABS 94HB,-,BLK,-,DVD-909 AH64-80001E FOOT-FRONT;-,ABS94,HB,T2,SIL,H/STAMP,DVD AH61-00194B HOLDER-DECK B;-,ABS 94HB,-,BLK,-,DVD-909 AH61-00194C HOLDER-DECK C;-,ABS 94HB,-,BLK,-,DVD-909...

  • Page 79: Deck Assembly

    Exploded Views and Parts List 7-2 Deck Assembly S.N.A. S.N.A. S.N.A. S.N.A. : Service Not Available Samsung Electronics...
  • Page 80 RUBBER-INSULATOR;BUTYL RUBBER,-,DP-3 3809-001123 CABLE-FLAT;30V80C,90MM,40P,1.25MM,UL289 AH61-50323A SHAFT-SYNCRO;-,sus304,2.1,119,-,-,dvd-90 AH66-22005A GEAR-SYNCRO-A;KEPITAL F20-03,M0.8,Z9,-,P AH97-00179A ASSY-HOUSING MOTOR;DP-3,-,SOH-DP1 AH60-10151A SCREW-TAP TITE;DP,SPEC6.8 ,PH,+,CP,M2,L AC60-10051A SCREW-TAPPING;BH,-,-,M3,L8,FZY AH60-10143U SCREW-TAP TITE;-,SWRCH18A,-,PH,-,DP-3,+, AH60-10145A SCREW-TAP TITE;DP,PH,+,SPEC OD5.5 FP,TAP AH60-10147A SCREW-MACHINE;DP,CH,+,FP,M2,L4,ZPC,SWRCH AC60-10059A SCREW-TAPPING;BH,+,-,1.7,X5,ZPC2 AH60-00010A SCREW-MACHINE-MOTOR;-,+,SWCH18AK,M1.7,L2 AC60-10042A SCREW-TAPPING;PWH,+,-,M3,L8,- BG60-10020A SCREW-SP MOTOR;-,BHW TOOTH,-,-,M1.7,L3,- Samsung Electronics...
  • Page 81 Exploded Views and Parts List MEMO Samsung Electronics...

  • Page 82: Electrical Parts List

    R-CHIP;6.8Kohm,5%,1/16W,DA,TP,1608 MR58 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 DRR13 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 MR59 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 DRR3 2007-000034 R-CHIP;1OHM,5%,1/8W,DA,TP,3216 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 DRR4 2007-000034 R-CHIP;1OHM,5%,1/8W,DA,TP,3216 MR60 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 DRR7 2007-000616 R-CHIP;24Kohm,5%,1/16W,DA,TP,1608 MR61 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 DRR9 2007-000096 R-CHIP;30Kohm,5%,1/16W,DA,TP,1608 MR62 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, MR63 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 83 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, RR38 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RC48 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP, RR39 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608 RC48A 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP, 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, RR40 2007-000655 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608 RC50 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, RR41 2007-000708 R-CHIP;3.9Kohm,1%,1/16W,DA,TP,1608 RC51 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, RR42 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 RC52 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, RR43 2007-000090 R-CHIP;10Kohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 84 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 SR80 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 SC67 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, SR81 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, SR82 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, SR83 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT- SR85 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 0407-000114 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3,SOT- 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 2801-000261 CRYSTAL-UNIT;33.8688MHZ,50PPM,28-AAA,12P 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 Samsung Electronics...
  • Page 85 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- NC72 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 NPC1 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP, NC73 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 NPC2 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP, NC74 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 NPC3 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP, NC75 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 NPC4 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, NC76 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 NPE1 2402-000202 C-AL,SMD;100uF,20%,10V,WT,TP,6.6x6.6mm, NC77 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160 NPE2 2402-000202 C-AL,SMD;100uF,20%,10V,WT,TP,6.6x6.6mm, Samsung Electronics...
  • Page 86 2203-000595 C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012 NR81 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AC42 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP, NR82 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AC44 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V NR83 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AC45 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,- NR84 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AC46 2203-000595 C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012 NR85 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AC47 2203-000595 C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012 NR86 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AC48 2203-000192 C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,TP, Samsung Electronics...
  • Page 87 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AE39 2401-002068 C-AL;33uF,20%,16V,GP,TP,5x11,5 AR116 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 AR118 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012 AE40 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11,5 AR119 2007-000766 R-CHIP;330OHM,5%,1/10W,DA,TP,2012 2401-002144 C-AL;47uF,20%,16V,GP,TP,5x11,5 AR121 2007-001247 R-CHIP;91OHM,5%,1/10W,DA,TP,2012 AIC2 1002-001129 IC-D/A CONVERTER;AK4324VF,24BIT,VSOP,24P AR130 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM AIC3 1002-001129 IC-D/A CONVERTER;AK4324VF,24BIT,VSOP,24P AR131 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM Samsung Electronics...
  • Page 88 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M AR76 2007-001071 R-CHIP;6.8KOHM,5%,1/10W,DA,TP,2012 FR103 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M AR77 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR104 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M AR78 2001-000003 R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm FR105 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M AR79 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM FR106 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8X3.2M AR80 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR11 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM AR81 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM FR12 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM Samsung Electronics...
  • Page 89 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TP 2001-000734 R-CARBON;4.7KOHM,5%,1/8W,AA,TP,1.8X3.2M PD03 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TP PR31 2001-000515 R-CARBON;220OHM,5%,1/8W,AA,TP,1.8X3.2MM PD04 0402-001009 DIODE-RECTIFIER;1SR139,600V,1A,MSR,TP PR32 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM PD11 0402-000378 DIODE-RECTIFIER;EG01C,1000V,500mA,DO-41 PR33 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM PD12 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DO PR34 2001-000440 R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DO PR35 2001-000362 R-CARBON;150OHM,5%,1/8W,AA,TP,1.8X3.2MM PD31 0402-001013 DIODE-RECTIFIER;1SR153-400,400V,800mA,DO PR36 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8X3.2M Samsung Electronics...
  • Page 90 IC-CMOS LOGIC;74HC244,BUFFER/DRIVER,DIP, 2701-000160 INDUCTOR-AXIAL;22uH,5%,2.4x3.4mm 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V VR100 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V VR108 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3.2MM 2202-000173 C-CERAMIC,MLC-AXIAL;1nF,10%,50V,Y5P,TP,1 VR109 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MM 2202-000173 C-CERAMIC,MLC-AXIAL;1nF,10%,50V,Y5P,TP,1 VR110 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MM KCE8 2401-002007 C-AL;100uF,20%,16V,GP,TP,6.3x11,5 VR111 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MM KCE9 2401-002007 C-AL;100uF,20%,16V,GP,TP,6.3x11,5 VR112 2001-000666 R-CARBON;33OHM,5%,1/8W,AA,TP,1.8X3.2MM 0601-001447 LED;ROUND,RED,3.1mm,650nm Samsung Electronics...
  • Page 91 CONNECTOR-FPC/FC/PIC;40P,1.25mm,ANGLE,SN 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216 2203-000208 C-CERAMIC,CHIP;100nF,10%,50V,X7R,TP,3216 2203-000612 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,3216 0401-000101 DIODE-SWITCHING;1N4148,100V,200mA,DO-35, 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5 3301-000325 CORE-FERRITE BEAD;AB,3.2x2.5x1.3mm,-,- DLED 0601-001372 LED;ROUND,GRN,3.5MM,621NM 2007-000800 R-CHIP;360OHM,5%,1/8W,DA,TP,3216 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216 2007-000451 R-CHIP;180OHM,5%,1/8W,DA,TP,3216 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216 2007-000303 R-CHIP;10KOHM,5%,1/8W,DA,TP,3216 AH34-30001A SWITCH-PUSH;2EA,6.65X7.5,-,DC5V 3403-001001 SWITCH-PUSH;5V,5mA,-,OFF-ON 3408-000323 SWITCH-SLIDE;12Vdc,100mA,SPDT,OFF-ON,- 8-10 Samsung Electronics...
  • Page 92 DIC1 NIC7 (KS1453) (KS999F) DVD & CD Processor IF ASIC NIC1 (XCMMP-L3BZP) A/V Decoder SIC1 CVBS1 (KS1452) Digital Servo CVBS2 Yout VIC50 Cout (SAA7128) Video Encoder NIC11 NIC2, 3 (27C160) (K4E641612C) 16M EEPROM 64M x 2 EDO DRAM Samsung Electronics...

  • Page 93: Block Diagrams

    Block Diagrams MEMO Samsung Electronics...
  • Page 94 10-6 Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-5 Samsung Electronics 10-1...

  • Page 95: Pcb Diagrams

    PCB Diagrams 10-1 Main-Front COMPONENT SIDE SOLDER SIDE 10-2 Samsung Electronics...

  • Page 96: Main-Back

    PCB Diagrams 10-2 Main-Back COMPONENT SIDE SOLDER SIDE Samsung Electronics 10-3...

  • Page 97: Jack

    PCB Diagrams 10-3 Jack 10-4 Samsung Electronics...

  • Page 98: Key-Power

    PCB Diagrams 10-4 Key-Power 10-6 Deck 10-5 Key-Play Samsung Electronics 10-5...
  • Page 99 PCB Diagrams MEMO 10-6 Samsung Electronics...

  • Page 100: Wiring Diagram

    11. Wiring Diagram KEY PLAY PCB KEY POWER PCB Samsung Electronics 11-1...
  • Page 101 Wiring Diagram MEMO 11-2 Samsung Electronics...

  • Page 102: Schematic Diagrams

    12-17 Remote-Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-20 Samsung Electronics 12-1...
  • Page 103 Schematic Diagrams Block Identification of PCB Main-Front PCB (Component Side) Jack PCB (Conductor Side) Main-Back PCB (Component Side) Key Power PCB (Conductor Side) 12-2 Samsung Electronics...
  • Page 104 Schematic Diagrams 12-1 S.M.P.S. Samsung Electronics 12-3...

  • Page 105: Main-Power Supply

    Schematic Diagrams 12-2 Main-Power Supply 12-4 Samsung Electronics...

  • Page 106: Front-Micom/Vfd Display

    Schematic Diagrams 12-3 Front-Micom/VFD Display Samsung Electronics 12-5...

  • Page 107: Video

    Schematic Diagrams 12-4 Video 12-6 Samsung Electronics...

  • Page 108: Audio

    Schematic Diagrams 12-5 Audio Samsung Electronics 12-7...

  • Page 109: Component

    Schematic Diagrams 12-6 Component 12-8 Samsung Electronics...

  • Page 110: Main-Micom

    Schematic Diagrams 12-7 Main-Micom Samsung Electronics 12-9...

  • Page 111: R/F

    Schematic Diagrams 12-8 R/F 12-10 Samsung Electronics...

  • Page 112: Servo

    Schematic Diagrams 12-9 Servo Samsung Electronics 12-11...

  • Page 113: Dsp

    Schematic Diagrams 12-10 DSP 12-12 Samsung Electronics...

  • Page 114: I/F

    Schematic Diagrams 12-11 I/F Samsung Electronics 12-13...

  • Page 115: Mpeg Decoder

    Schematic Diagrams 12-12 MPEG Decoder 12-14 Samsung Electronics...
  • Page 116 (340) (341) (342) (343) (344) (345) (346) (347) (348) (349) (350) (351) (352) (353) (354) (355) (356) VDATA0 VDD3_06 VDATA5 VDATA6 FIELD SYS_D1 SYS_D4 SYS_D7 SYS_D11 SYS_D13 SYS_D14 SYS_D18 SYS_D22 SYS_D24 SYS_D26 SYS_D23 SYS_A1 VDD3-10 SYS_A7 SYS_A10 Samsung Electronics 12-15...

  • Page 117: Joy Stick

    Schematic Diagrams 12-13 Joy Stick 12-16 Samsung Electronics...

  • Page 118: Headphone

    Schematic Diagrams 12-14 Headphone Samsung Electronics 12-17...

  • Page 119: Key Play

    Schematic Diagrams 12-15 Key Play 12-18 Samsung Electronics...

  • Page 120: Deck

    Schematic Diagrams 12-16 Deck Samsung Electronics 12-19...

  • Page 121: Remote-Control

    Schematic Diagrams 12-17 Remote-Control 12-20 Samsung Electronics...

Table of Contents