SECTION 1 GENERAL This section is extracted from TABLE OF CONTENTS instruction manual. Specifications ................1 LOCATION AND FUNCTION OF CONTROLS 1. GENERAL Location and Function of Controls ........2 2. DISASSEMBLY 2-1. Cabinet (Lower) ............3 2-2. Front panel ..............3 2-3.
SECTION 2 DISASSEMBLY The equipment can be removed using the following procedure. 2-3. MAIN BOARD Cabinet (Lower) Panel, Front Main board 1 Screws (P 2.6x8) Note : Follow the disassembly procedure in the numerical order given. 2-1. CABINET (LOWER) 2 Main board 2 Screws (P 2.6x20) 1 Screws (P 2.6x20) 3 Cabinet (Lower)
SB-D30 SECTION 3 DIAGRAMS 3-1. PRINTED WIRING BOARDS Semiconductor Location Ref. No. Location (11) Note: • X : parts extracted from the component side. • b : Pattern from the side which enables seeing. – 5 – – 6 –...
SB-D30 3-2. SCHEMATIC DIAGRAM Note: Standard Value: • All capacitors are in µF unless otherwise noted. pF: µµF • Voltages are dc with respect to ground under no-signal TP10,11,12 TP13,14 50 WV or less are not indicated except for electrolytics conditions.
SECTION 4 SECTION 5 MAIN EXPLODED VIEW ELECTRICAL PARTS LIST NOTE : NOTE : • -XX, -X mean standardized parts, so they • The mechanical parts with no reference • Due to standardization, replacements in the • SEMICONDUCTORS may have some difference from the original number in the exploded views are not In each case, u : µ...
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