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Specifications
Specifications are subject to change without notice.
Table 5. Specifications
Specification
Bandwidth/Distance
Dimensions
Interfaces
Operating
Environment
Power
Protocols Supported
Regulatory
Compliance
Standards
Supported
Weight
Criteria
Up to 44.736 Mbps per DS3 port
ETHX-DS3-1-LT: Up to 44.736 Mbps
ETHX-DS3-2-LT: Up to 89.4 Mbps using loop bonded DS3 circuits
1.25" (3.2 cm) High x 8.5" (21.6 cm) Wide x 4.75" (12.1 cm) Deep
ETHX-DS3-1-LT: 2 BNC 75 ohm jacks (Tx and Rx)
ETHX-DS3-2-LT: 4 BNC 75 ohm jacks (2-Tx and 2-Rx)
4 10/100BaseT 8-position jacks
Temperature: 32 F to 122 F (0 C to 50 C)
Non-operating temperature: –40 F to 158 F (–40 C to 70 C)
Humidity: 5% to 95%, non-condensing
Altitude: –200 ft to 16,500 ft (–60 m to 5,000 m)
ETHX-DS3-1-LT: –48 VDC, 0.2 A, 11 W
ETHX-DS3-2-LT: –48 VDC, 0.3 A, 15 W
Transparent 802.1D Bridging
DS3 Line Code: C-bit parity (unchannelized DS3)
EMC: FCC Part 15; ICES-003; EN 300 386-2; CE Marking
Safety: UL1950, CSA C22.2 No. 950; EN60950; IEC950; CE
Marking
Telecom: FCC Part 68; Industry Canada CS-03
IEEE 802.3 Ethernet
IEEE 802.1p Priorities
IEEE 802.1Q VLAN
1.0 lbs (0.45 kg)
22
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