Handling Instructions; Pick And Place Equipment; Reflow Solder; Board Wash - TDK T5837 Manual

9. HANDLING INSTRUCTIONS

9.1. PICK AND PLACE EQUIPMENT

The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to
avoid damage to the MEMS microphone structure as follows:
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of
the package, the pickup tool can make contact with any part of the lid surface.
•
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the
microphone.
Do not pull air out of or blow air into the microphone port.
•
Do not use excessive force to place the microphone on the PCB.

9.2. REFLOW SOLDER

For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the
solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not
exceed the limit conditions specified in Figure 2 and Table 8.
T5837 devices have MSL (Moisture Sensitivity Level) rating 1, appropriate JEDEC J-STD-020 guidelines should be
followed to avoid damaging the part.

9.3. BOARD WASH

When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off
procedures or ultrasonic cleaning.
Document Number: DS-000447
Revision: 1.2
Page 20 of 25
T5837