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Bottom Port PDM Digital Output Multi-Mode Microphone
GENERAL DESCRIPTION
The T5919 is a multi-mode, low noise digital MEMS
microphone in a small package. The T5919 consists of a
MEMS microphone element and an impedance converter
amplifier followed by a fourth-order Σ-Δ modulator. The digital
interface allows the pulse density modulated (PDM) output of
two microphones to be time multiplexed on a single data line
using a single clock.
The T5919 has multiple modes of operation: High Quality,
Low-Power (AlwaysOn), and Sleep. The T5919 has high SNR in
all operational modes. It has 135 dB SPL AOP in High Quality
Mode and 120 dB SPL AOP in Low-Power mode.
The T5919 is available in a standard 3.5 × 2.65 × 0.98 mm
surface-mount package. It is reflow solder compatible with
no sensitivity degradation. The package integrates a Particle
Ingress Filter (PIF) for enhanced robustness to environmental
contaminants such as water and dust.
FUNCTIONAL BLOCK DIAGRAM
ICS-51360
T5919
ADC
POWER
MANAGEMENT
TDK, Inc. reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
CLK
PDM
MODULATOR
DATA
CHANNEL
SELECT
1745 Technology Drive, San Jose, CA 95110 U.S.A
APPLICATIONS
•
Smartphones
•
Microphone Arrays
•
Tablet Computers
•
Cameras
FEATURES
SPEC
HIGH QUALITY MODE
Sensitivity
SNR
Current
AOP
Clock
•
3.5 × 2.65 × 0.98 mm surface-mount package
•
Extended frequency response from 40 Hz to >20 kHz
•
Sleep Mode: 9 µA
•
Fourth-order Σ-Δ modulator
•
Digital pulse density modulation (PDM) output
•
Compatible with Sn/Pb and Pb-free solder processes
•
RoHS/WEEE compliant
•
Features PIF (Particle Ingress Filter) to enhance
product robustness to water & dust
ORDERING INFORMATION
PART
MMICT5919-00-012
TDK Corporation
+1(408) 988–7339
www.tdk.com
T5919
LOW-POWER MODE
−41 dB FS ±1 dB
64.5 dBA
590 µA
135 dB SPL
2.0 MHz to 3.3 MHz
400 kHz to 800 kHz
TEMP RANGE
−40°C to +85°C
Document Number: DS-000363
Revision: 1.0
Release Date: 3/9/2021
−26 dB FS ±1 dB
62 dBA
220 µA
120 dB SPL
PACKAGING
13" Tape and Reel
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Table of Contents
Related Manuals for TDK T5919
Summary of Contents for TDK T5919
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Page 1: General Description
3.5 × 2.65 × 0.98 mm surface-mount package • Extended frequency response from 40 Hz to >20 kHz The T5919 is available in a standard 3.5 × 2.65 × 0.98 mm • Sleep Mode: 9 µA surface-mount package. It is reflow solder compatible with •... -
Page 2: Table Of Contents
Table 8. Pin Function Descriptions ............................... 9 Typical Performance Characteristics ..............................10 Theory Of Operation ..................................... 12 PDM Data Format ..................................12 Table 9. T5919 Channel Setting ..............................12 PDM Microphone Sensitivity ..............................12 Applications Information ..................................14 Low-Power Mode..................................14 Dynamic Range Considerations .............................. - Page 3 T5919 Board Wash....................................19 Outline Dimensions ....................................20 Ordering Guide ..................................20 Revision History ..................................21 Compliance Declaration Disclaimer ..............................22 Page 3 of 22 Document Number: DS-000363 Revision: 1.0...
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Page 4: Specifications
T5919 SPECIFICATIONS TABLE 1. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – GENERAL = 25°C, VDD = 1.8 V, SCK = 2.4 MHz, C = 30 pF unless otherwise noted. Typical specifications are not guaranteed. LOAD PARAMETER CONDITIONS UNITS NOTES PERFORMANCE Directionality Omni Output Polarity Input acoustic pressure vs. - Page 5 T5919 TABLE 3. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – LOW-POWER MODE = 25°C, VDD = 1.8 V, SCK = 768 kHz, C = 30 pF unless otherwise noted. Typical specifications are not guaranteed. LOAD PARAMETER CONDITIONS UNITS NOTES Sensitivity 1 kHz, 94 dB SPL −27...
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Page 6: Timing Diagram
T5919 TABLE 5. PDM DIGITAL INPUT/OUTPUT = 25°C, VDD = 1.8 V, unless otherwise noted. PARAMETER CONDITIONS UNITS NOTES MODE SWITCHING Sleep Time Time from f falling <200 kHz Wake-Up Time High Quality mode, Sleep Mode to f >1.2 MHz, output within 0.5 dB of final sensitivity,... -
Page 7: Absolute Maximum Ratings
T5919 ABSOLUTE MAXIMUM RATINGS Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. -
Page 8: Soldering Profile
Time +25°C (t ) to Peak Temperature 5 min max 25°C *The reflow profile in Table 7 is recommended for board manufacturing with TDK MEMS microphones. All microphones are also compatible with the J-STD-020 profile Page 8 of 22 Document Number: DS-000363... -
Page 9: Pin Configurations And Function Descriptions
T5919 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS Figure 3. Pin Configuration (Top View, Terminal Side Down) TABLE 8. PIN FUNCTION DESCRIPTIONS NAME FUNCTION DATA Digital Output Signal (DATA1 or DATA2) Left Channel or Right Channel Select: DATA 1 (right): SELECT tied to GND SELECT DATA 2 (left): SELECT tied to VDD. -
Page 10: Typical Performance Characteristics
T5919 TYPICAL PERFORMANCE CHARACTERISTICS High Quality Mode 0.01 1000 10000 INPUT AMPLITUDE (dB SPL) FREQUENCY (Hz) Figure 5. THD + N High Quality Mode Figure 4. Typical Audio Frequency Response, High Quality Mode Low Power Mode High Quality Mode Low-Power Mode 0.01... - Page 11 T5919 High Quality Mode Low-Power Mode -100 -120 -140 1000 10000 FREQUENCY (Hz) Figure 8. Power Supply Rejection (PSR) vs. Frequency Page 11 of 22 Document Number: DS-000363 Revision: 1.0...
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Page 12: Theory Of Operation
PDM DATA FORMAT The output from the DATA pin of the T5919 is in pulse density modulated (PDM) format. This data is the 1-bit output of a fourth- order Σ-Δ modulator. The data is encoded so that the left channel is clocked on the falling edge of CLK, and the right channel is clocked on the rising edge of CLK. - Page 13 T5919 This definition of a 0 dB FS signal must be understood when measuring the sensitivity of the T5919. A 1 kHz sine wave at a 94 dB SPL acoustic input to the T5919 results in an output signal with a −26 dB FS level (low-power mode). The output digital word peaks at −26 dB below the digital full-scale level.
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Page 14: Applications Information
0 dB FS. To fully use the 106 dB dynamic range of the output data of the T5919 in a design, the digital signal processor (DSP) or codec circuit following it must be chosen carefully. The decimation filter that inputs the PDM signal from the T5919 must have a dynamic range sufficiently better than the dynamic range of the microphone so that the overall noise performance of the system is not degraded. - Page 15 The DATA signal does not need to be buffered in normal use when the T5919 microphone(s) is placed close to the codec on the PCB. If the DATA signal must be driven over a long cable (>15 cm) or other large capacitive load, a digital buffer may be required. Only use a signal buffer on the DATA line when one microphone is in use or after the point where two microphones are connected (see Figure 14).
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Page 16: Sleep Mode
T5919 outputs data within 0.5 dB of its settled sensitivity. START-UP TIME The start-up time of the T5919 is typically 7 ms, measured by the time from when power and clock are enabled until sensitivity of the output signal is within 0.5 dB of its settled sensitivity. -
Page 17: Supporting Documents
AN-100, MEMS Microphone Handling and Assembly Guide AN-1003, Recommendations for Mounting and Connecting the TDK, Bottom-Ported MEMS Microphones AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing TDK Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming Page 17 of 22 Document Number: DS-000363 Revision: 1.0... -
Page 18: Pcb Design And Land Pattern Layout
Avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 16. The response of the T5919 is not affected by the PCB hole size as long as the hole is not smaller than the sound port of the microphone (0.375 mm in diameter). -
Page 19: Handling Instructions
T5919 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. -
Page 20: Outline Dimensions
T5919 OUTLINE DIMENSIONS Figure 17. 5-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.5 mm × 2.65 mm × 0.98 mm Body Dimensions shown in millimeters Dimension tolerance is ±0.15 mm unless otherwise specified Figure 18. Package Marking Specification (Top View) -
Page 21: Revision History
T5919 REVISION HISTORY REVISION DATE REVISION DESCRIPTION 3/9/21 Initial version Page 21 of 22 Document Number: DS-000363 Revision: 1.0... -
Page 22: Compliance Declaration Disclaimer
This information furnished by TDK, Inc. (“TDK”) is believed to be accurate and reliable. However, no responsibility is assumed by TDK for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. TDK reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice.