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Bottom Port PDM Digital Output Multi-Mode Microphone
GENERAL DESCRIPTION
The T5837 is a multi-mode, low noise digital MEMS
microphone in a small package. The T5837 consists
of a MEMS microphone element and an impedance
converter amplifier followed by a Σ-Δ modulator. The
digital interface allows the pulse density modulated
(PDM) output of two microphones to be time
multiplexed on a single data line using a single clock.
The T5837 has multiple modes of operation: High
Quality, Low-Power (AlwaysOn), Ultrasonic and
Sleep modes. The T5837 has high SNR in all
operational modes. It has 133 dB SPL AOP in High
Quality Mode and 117 dB SPL AOP in Low-Power mode.
The T5837 is available in a standard 3.5 × 2.65 ×
0.98 mm surface-mount package. It is reflow solder
compatible.
FUNCTIONAL BLOCK DIAGRAM
TDK, Inc.
reserves the right to change
specifications and information herein without
notice unless the product is in mass production
and the datasheet has been designated by TDK in
writing as subject to a specified Product /
Process Change Notification Method regulation.
APPLICATIONS
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FEATURES
SPEC
Sensitivity
SNR
Current
AOP
Clock
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ORDERING INFORMATION
MMICT5837-00-012
EV_T5837-FX2
TDK Corporation
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.tdk.com
Smartphones
IP Cameras
Microphone Arrays
Home Security Glass Break Detect
Voice Activated Wearables
Voice Activated Home Automation
HIGH QUALITY
LOW-POWER
MODE
MODE
−37 dB FS ±1 dB
−21 dB FS ±1 dB
68 dBA
65.5 dBA
310 µA
120 µA
133 dB SPL
117 dB SPL
2.0 MHz to 3.7 MHz
400 kHz to 800 kHz
3.5 × 2.65 × 0.98 mm surface-mount package
Extended frequency response from 27 Hz to
>20 kHz
Sleep Mode: 9 µA SCK< 200 kHz, 0.8 µA SCK
= Off
Fifth order Σ-Δ modulator
Digital pulse density modulation (PDM)
output
Compatible with Sn/Pb and Pb-free solder
processes
RoHS/WEEE compliant
PART
TEMP RANGE
-40°C to +85°C
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Document Number: DS-000447
Revision: 1.2
Release Date: 9/19/2023
T5837
ULTRASONIC
MODE
−37 dB FS ±1 dB
68dBA
500 µA
133 dB SPL
4.2 MHz to 4.8 MHz
PACKAGING
13" Tape and Reel
Flex Evaluation Board
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Table of Contents
Related Manuals for TDK T5837
Summary of Contents for TDK T5837
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Page 1: General Description
120 µA 500 µA 133 dB SPL 117 dB SPL 133 dB SPL The T5837 is available in a standard 3.5 × 2.65 × Clock 2.0 MHz to 3.7 MHz 400 kHz to 800 kHz 4.2 MHz to 4.8 MHz 0.98 mm surface-mount package. -
Page 2: Table Of Contents
T5837 TABLE OF CONTENTS General Description ............................... 1 Applications ................................... 1 Features ..................................1 Functional Block Diagram .............................. 1 Ordering Information ..............................1 Table of Contents ................................2 1. Specifications ................................4 1.1. Acoustical/Electrical Characteristics – General ..................4 1.2. - Page 3 T5837 9. Handling Instructions ............................... 20 9.1. Pick And Place Equipment ........................20 9.2. Reflow Solder ............................20 9.3. Board Wash ............................20 10. Outline Dimensions ............................... 21 11. Reliability Specifications ............................22 12. Ordering Guide ..............................23 13. Revision History ..............................24 14.
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Page 4: Specifications
T5837 1. SPECIFICATIONS 1.1. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – GENERAL = 25°C, = 1.8 V, SCK = 2.4 MHz, C = 30 pF unless otherwise noted. Typical specifications are not LOAD guaranteed. PARAMETER CONDITIONS UNITS NOTES PERFORMANCE Directionality Omni Output Polarity Input acoustic pressure vs. output data... -
Page 5: Acoustical/Electrical Characteristics - Low-Power Mode
T5837 1.3. ACOUSTICAL/ELECTRICAL CHARACTERISTICS – LOW-POWER MODE = 25°C, = 1.8 V, SCK = 768 kHz, C = 30 pF unless otherwise noted. Typical specifications are not LOAD guaranteed. PARAMETER CONDITIONS UNITS NOTES Sensitivity 1 kHz, 94 dB SPL −22 −21... -
Page 6: Pdm Digital Input/Output
T5837 1.6. PDM DIGITAL INPUT/OUTPUT = 25°C, = 1.8 V, unless otherwise noted. Typical specifications are not guaranteed. PARAMETER CONDITIONS UNITS NOTES MODE SWITCHING Sleep Time Time from f falling <200 kHz High Quality mode, Sleep Mode to f >1.2 MHz, output Wake-Up Time within 0.5 dB of final sensitivity, power on... -
Page 7: Absolute Maximum Ratings
T5837 2. ABSOLUTE MAXIMUM RATINGS Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. -
Page 8: Soldering Profile
5 min max 25°C *The reflow profile in Table 8 is recommended for board manufacturing with TDK MEMS microphones. All microphones are also compatible with the J-STD-020 profile Note: After 3 reflows, microphone sensitivity may deviate by up to 2 dB. -
Page 9: Pin Configurations And Function Descriptions
T5837 3. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS Figure 3. Pin Configuration (Top View, Terminal Side Down) 3.1. PIN FUNCTION DESCRIPTIONS NAME FUNCTION DATA Digital Output Signal (DATA1 or DATA2) Left Channel or Right Channel Select: DATA 1 (right): SELECT tied to GND... -
Page 10: Typical Performance Characteristics
T5837 4. TYPICAL PERFORMANCE CHARACTERISTICS High Quality Mode 0.01 95 100 105 110 115 120 125 130 135 1000 10000 INPUT AMPLITUDE (dB SPL) FREQUENCY (Hz) Figure 5. THD + N High Quality Mode Figure 4. Typical Audio Frequency Response, High Quality Mode... -
Page 11: Theory Of Operation
5.1. PDM DATA FORMAT The output from the DATA pin of the T5837 is in pulse density modulated (PDM) format. This data is the 1-bit output of a Σ-Δ modulator. The data is encoded so that the left channel is clocked on the falling edge of CLK, and the right channel is clocked on the rising edge of CLK. -
Page 12: Channel Setting
This definition of a 0 dB FS signal must be understood when measuring the sensitivity of the T5837. A 1 kHz sine wave at a 94 dB SPL acoustic input to the T5837 results in an output signal with a −21 dB FS level (low-power mode). - Page 13 T5837 –0.2 –0.4 –0.6 –0.8 –1.0 TIME (ms) Figure 13. 1 kHz, 0 dB FS Sine Wave There is not a commonly accepted unit of measurement to express the instantaneous level, as opposed to the RMS level of the signal, of a digital signal output from the microphone. Some measurement systems express the instantaneous level of an individual sample in units of D, where 1.0 D is digital full scale.
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Page 14: Applications Information
0 dB FS. To fully use the 107 dB dynamic range of the output data of the T5837 in a design, the digital signal processor (DSP) or codec circuit following it must be chosen carefully. The decimation filter that inputs the PDM signal from the T5837 must have a dynamic range sufficiently better than the dynamic range of the microphone so that the overall noise performance of the system is not degraded. - Page 15 T5837 Figure 15. Stereo PDM Microphone Connection to Codec Decouple the VDD pin of the T5837 to GND with a 0.1 µF capacitor. Place this capacitor as close to VDD as the printed circuit board (PCB) layout allows. Do not use a pull-up or pull-down resistor on the PDM data signal line because it can pull the signal to an incorrect state during the period that the signal line is tristated.
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Page 16: Entering And Exiting Sleep Mode
Figure 16. Buffered Connections Between Stereo T5837s and a Codec When long wires are used to connect the codec to the T5837, a source termination resistor can be used on the clock output of the codec instead of a buffer to minimize signal overshoot or ringing. Match the value of this resistor to the characteristic impedance of the CLK trace on the PCB. -
Page 17: Supporting Documents
AN-100, MEMS Microphone Handling and Assembly Guide AN-1003, Recommendations for Mounting and Connecting the TDK, Bottom-Ported MEMS Microphones AN-1112, Microphone Specifications Explained AN-1124, Recommendations for Sealing TDK Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140, Microphone Array Beamforming Page 17 of 25 Document Number: DS-000447 Revision: 1.2... -
Page 18: Pcb Design And Land Pattern Layout
Figure 18. The response of the T5837 is not affected by the PCB hole size as long as the hole is not smaller than the sound port of the microphone (0.375 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended. Take care to align the hole in the microphone package with the hole in the PCB. -
Page 19: Pcb Material And Thickness
8.1. PCB MATERIAL AND THICKNESS The performance of the T5837 is not affected by PCB thickness. The T5837 can be mounted on either a rigid or flexible PCB. A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. -
Page 20: Handling Instructions
MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 2 and Table 8. T5837 devices have MSL (Moisture Sensitivity Level) rating 1, appropriate JEDEC J-STD-020 guidelines should be followed to avoid damaging the part. -
Page 21: Outline Dimensions
T5837 10. OUTLINE DIMENSIONS Figure 19. 5-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV] 3.5 mm × 2.65 mm × 0.98 mm Body Dimensions shown in millimeters Dimension tolerance is ±0.15 mm unless otherwise specified Figure 20. Package Marking Specification (Top View) -
Page 22: Reliability Specifications
T5837 11. RELIABILITY SPECIFICATIONS Test Standard Conditions Early Life Failure Rate (ELFR) JEDEC JESD22-A108 ≥ 125°C, V max, 48 hrs. Temperature Humidity Bias (THB) JEDEC JESD22-A101 Biased, 85°C, 85% RH, 1000 hrs. Preceded with JESD22-A113 MSL 1 Preconditioning High Temperature Operating Life JEDEC JESD22-A108 ≥... -
Page 23: Ordering Guide
T5837 12. ORDERING GUIDE PART TEMP RANGE PACKAGE QUANTITY PACKAGING MMICT5837-00-012 -40°C to +85°C 5-Terminal LGA_CAV 10,000 13” Tape and Reel EV_T5837-FX2 Flex Evaluation Board Page 23 of 25 Document Number: DS-000447 Revision: 1.2... -
Page 24: Revision History
T5837 13. REVISION HISTORY REVISION DATE REVISION DESCRIPTION 5/11/2022 Initial production version 7/25/2022 Fixed typos on Table 3 and Table 8. Formatting changes, Corrected typos in figure numbers, 9/19/2023 added reliability specifications table. Page 24 of 25 Document Number: DS-000447... -
Page 25: Compliance Declaration Disclaimer
TDK. This information furnished by TDK, Inc. (“TDK”) is believed to be accurate and reliable. However, no responsibility is assumed by TDK for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice.
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