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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
8
1
SCALE 1:1
−X−
A
8
B
1
−Y−
G
−Z−
H
D
0.25 (0.010)
SOLDERING FOOTPRINT*
7.0
0.275
0.6
0.024
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
CASE 751−07
5
S
0.25 (0.010)
Y
M
M
4
C
N
SEATING
PLANE
0.10 (0.004)
Z
Y
S
X
S
M
1.52
0.060
4.0
0.155
1.270
0.050
mm
SCALE 6:1
inches
STYLES ON PAGE 2
98ASB42564B
SOIC−8 NB
SOIC−8 NB
ISSUE AK
K
_
X 45
M
J
MARKING DIAGRAM*
8
8
XXXXX
XXXXX
ALYWX
ALYWX
G
1
1
IC
IC
(Pb−Free)
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, "G" or microdot "G", may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped "CONTROLLED COPY" in red.
DATE 16 FEB 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
A
4.80
5.00
0.189
B
3.80
4.00
0.150
C
1.35
1.75
0.053
D
0.33
0.51
0.013
G
1.27 BSC
0.050 BSC
0.10
0.25
0.004
H
J
0.19
0.25
0.007
K
0.40
1.27
0.016
_
_
_
M
0
8
0
N
0.25
0.50
0.010
S
5.80
6.20
0.228
GENERIC
8
8
XXXXXX
XXXXXX
AYWW
AYWW
1
1
Discrete
Discrete
(Pb−Free)
XXXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
PAGE 1 OF 2
www.onsemi.com
MAX
0.197
0.157
0.069
0.020
0.010
0.010
0.050
_
8
0.020
0.244
G
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